| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/12/2002 | US20020125040 Multi-layer circuit assembly and process for preparing the same |
| 09/12/2002 | US20020125030 High-Q micromechanical device and method of tuning same |
| 09/12/2002 | US20020124997 Cooling system for a power electronics module to drive at least on electrical unit in a motor vehicle |
| 09/12/2002 | US20020124955 Attachment of a heat spreader for fabricating a cavity down plastic chip carrier |
| 09/12/2002 | US20020124585 Multi-load refrigeration system with multiple parallel evaporators |
| 09/12/2002 | US20020124398 Multi-layer circuit assembly and process for preparing the same |
| 09/12/2002 | US20020124392 Method for making an article having an embedded electronic device |
| 09/12/2002 | DE10206608A1 Temperature monitoring apparatus for microprocessors, has regulator circuit to adjust speed of fan based on sensed temperature and speed monitoring device to alert user when fan speed exceeds specified range |
| 09/12/2002 | DE10162037A1 Retainer of active or passive electric components on flexible, insulating, miniaturized support foil |
| 09/12/2002 | DE10152095A1 Blank-Chip-Träger und Verfahren zum Herstellen einer Halbleitervorrichtung unter Verwendung des Blank-Chip-Trägers Blank chip carrier and method for producing a semiconductor device using the chip carrier blank |
| 09/12/2002 | DE10117754C1 Process for applying and/or inserting plastic compositions into cavities of chip cards involves passing a plastic composition conveyed from a storage vessel through a testing device to judge irregularities and removing defective components |
| 09/12/2002 | DE10110369A1 Cooling arrangement for roof-mounted, vehicle occupant sensor system employs Peltier-effect element in close thermal contact with CCD camera system |
| 09/12/2002 | DE10109542A1 Leiterplattenanordnung Printed circuit board assembly |
| 09/12/2002 | DE10109327A1 Halbleiterchip und Herstellungsverfahren für ein Gehäuse Semiconductor chip and the manufacturing method of a housing |
| 09/12/2002 | DE10109220A1 Integrierte Schaltung mit einer Stützkapazität Integrated circuit comprising a backup capacitance |
| 09/12/2002 | DE10108915A1 Elektromigrations-Teststruktur zur Erfassung einer Zuverlässigkeit von Verdrahtungen Electromigration test structure for detecting a reliability of wirings |
| 09/12/2002 | DE10108081A1 Anordnung eines Halbleiterchips auf einem Substrat Arrangement of a semiconductor chip on a substrate |
| 09/12/2002 | DE10108077A1 Integrated circuit chip has contact pad arranged outside and inside inner region to allow flip-chip or wire bonding assembly |
| 09/12/2002 | DE10107399A1 Device used as a semiconductor chip comprises an electronic component, a mechanically and electrically connected wiring plate, and a flexible layer around the peripheral edges of the rear side of the electronic component |
| 09/12/2002 | DE10106346A1 Arrangement used in electronic devices comprises an electronic component, a semiconductor chip, and a wiring plate on which the electronic component lies in the assembled state |
| 09/12/2002 | DE10103956C1 Semiconductor wafer has active chip surface enclosed by removable saw frame provided with active protection |
| 09/12/2002 | CA2408046A1 Heatsink and heatsink device using the heatsink |
| 09/12/2002 | CA2401739A1 Fluxing underfill compositions |
| 09/11/2002 | EP1239716A2 Apparatus for cooling an electronic component and electronic device comprising the apparatus |
| 09/11/2002 | EP1239666A2 Imaging system |
| 09/11/2002 | EP1239517A2 Lead frame and method for fabricating resin-encapsulated semiconductor device using the same |
| 09/11/2002 | EP1239516A1 Temperature monitoring device for apparatus cooling microprocessors |
| 09/11/2002 | EP1239515A1 Substrate for electronic power circuit and electronic power module utilizing such a substrate |
| 09/11/2002 | EP1239514A2 Low fabrication cost, fine pitch and high reliability solder bump |
| 09/11/2002 | EP1239359A1 The heat-radiator of a portable computer's cpu |
| 09/11/2002 | EP1238574A2 Integrated convection and conduction heat sink for multiple mounting positions |
| 09/11/2002 | EP1238431A1 Method and device for interconnecting electronic components in three dimensions |
| 09/11/2002 | EP1238430A2 Dual-die integrated circuit package |
| 09/11/2002 | EP1238429A1 Power transistor module, power amplifier and method in the fabrication thereof |
| 09/11/2002 | EP1238427A2 Integrated circuit package formed at a wafer level |
| 09/11/2002 | EP1238426A2 Encasing arrangement for a semiconductor component |
| 09/11/2002 | EP1238425A1 Heat conductive sheet and method of producing the sheet |
| 09/11/2002 | EP1238423A2 Methods for separating microcircuit dies from wafers |
| 09/11/2002 | EP1238419A1 Plasma processing of tungsten using a gas mixture comprising a fluorinated gas and oxygen |
| 09/11/2002 | EP1238400A2 Semiconductor inductor and methods for making the same |
| 09/11/2002 | EP1008180B1 Gallium arsenide monolithic microwave integrated circuits employing thermally bumped devices |
| 09/11/2002 | EP0811247B1 Semiconductor processing method of forming an electrically conductive contact plug |
| 09/11/2002 | EP0793859B1 Plastic housing designed to accommodate electronic and/or micromechanical components and into which conductor tracks pass |
| 09/11/2002 | CN2511099Y Power device holddown |
| 09/11/2002 | CN2511097Y 电子器件散热器 Electronics radiator |
| 09/11/2002 | CN2510996Y High-speed heat-conducting device with liquid-gas change-over |
| 09/11/2002 | CN2510995Y 散热器结构 Radiator structure |
| 09/11/2002 | CN2510994Y Fastening piece for radiator |
| 09/11/2002 | CN2510993Y Grating array package and packaging method |
| 09/11/2002 | CN2510992Y Slotted seat structure for grid-array packaged element |
| 09/11/2002 | CN2510912Y Fixing piece of radiating fin |
| 09/11/2002 | CN2510911Y CPU radiator fixing device |
| 09/11/2002 | CN1369112A Fabrication method for sell aligned Cu diffusion barrier in integrated circuit |
| 09/11/2002 | CN1369111A Process for using siloxane dielectric films in integration of organic dielectric films in electronic devices |
| 09/11/2002 | CN1369078A Device and method for making devices comprising at least a chip fixed on support |
| 09/11/2002 | CN1368840A Electronic with built-in heating unit electronic device and its cooling device |
| 09/11/2002 | CN1368761A Semiconductor device |
| 09/11/2002 | CN1368760A 半导体设备 Semiconductor Equipment |
| 09/11/2002 | CN1368757A Semiconductor device and method for manufacture semiconductor equipment |
| 09/11/2002 | CN1090651C Polymer composition for making single or multilayer circuit patterns |
| 09/11/2002 | CN1090646C 半导体器件 Semiconductor devices |
| 09/11/2002 | CN1090549C Pb-in-sn tall C-4 for fatigue enhancement solder structure for electronic component subassembly and its application method |
| 09/11/2002 | CN1090442C Noiseproof electronic elements and devices |
| 09/10/2002 | US6449749 System and method for product yield prediction |
| 09/10/2002 | US6449170 Integrated circuit package incorporating camouflaged programmable elements |
| 09/10/2002 | US6449169 Ball grid array package with interdigitated power ring and ground ring |
| 09/10/2002 | US6449168 Circuit board and a method for manufacturing the same |
| 09/10/2002 | US6449166 High capacity memory module with higher density and improved manufacturability |
| 09/10/2002 | US6449165 Electrical interconnecting device for a semiconductor assembly |
| 09/10/2002 | US6449162 Removable land grid array cooling solution |
| 09/10/2002 | US6449161 Heat sink for chip stacking applications |
| 09/10/2002 | US6449160 Radiation fin assembly for heat sink or the like |
| 09/10/2002 | US6449159 Semiconductor module with imbedded heat spreader |
| 09/10/2002 | US6449158 Method and apparatus for securing an electronic power device to a heat spreader |
| 09/10/2002 | US6449157 IC package assembly with retention mechanism |
| 09/10/2002 | US6449156 Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof |
| 09/10/2002 | US6449155 Land grid array subassembly for multichip modules |
| 09/10/2002 | US6449154 Heat sink assembly retainer device |
| 09/10/2002 | US6449152 Device for pressing a heat sink tightly against a CPU and positioning a fan over the heat sink |
| 09/10/2002 | US6449151 Heat sink assembly having fastening means for attaching fan to heat sink |
| 09/10/2002 | US6449026 Fringe field switching liquid crystal display and method for manufacturing the same |
| 09/10/2002 | US6448865 Integrated circuit interconnect system |
| 09/10/2002 | US6448849 Semiconductor devices including a switch mounted thereon and a module loaded with the same |
| 09/10/2002 | US6448783 Method of inspecting semiconductor chip with projecting electrodes for defects |
| 09/10/2002 | US6448665 Semiconductor package and manufacturing method thereof |
| 09/10/2002 | US6448664 Ball grid array chip packages having improved testing and stacking characteristics |
| 09/10/2002 | US6448663 Semiconductor device, semiconductor device mounting structure, liquid crystal device, and electronic apparatus |
| 09/10/2002 | US6448662 Arrangement for accessing region of a flip chip die |
| 09/10/2002 | US6448661 Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof |
| 09/10/2002 | US6448660 Semiconductor device and production process thereof |
| 09/10/2002 | US6448659 Stacked die design with supporting O-ring |
| 09/10/2002 | US6448658 Semiconductor device having improved interconnection-wiring structures |
| 09/10/2002 | US6448657 Structure for reducing junction spiking through a wall surface of an overetched contact via |
| 09/10/2002 | US6448656 System including a memory device having a semiconductor connection with a top surface having an enlarged recess |
| 09/10/2002 | US6448655 Fluroinated diamond-like carbon; exposure to ultraviolet radiation |
| 09/10/2002 | US6448654 Ultra thin etch stop layer for damascene process |
| 09/10/2002 | US6448653 Method for using low dielectric constant material in integrated circuit fabrication |
| 09/10/2002 | US6448652 Interconnect structure with a dielectric layer conforming to the perimeter of a wiring layer |
| 09/10/2002 | US6448651 Semiconductor device having a multi-level metallization and its fabricating method |
| 09/10/2002 | US6448650 Fine pitch system and method for reinforcing bond pads in semiconductor devices |