Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2013
12/18/2013CN103450632A Epoxy resin composition for electronic packaging and preparation method thereof
12/18/2013CN103448308A Biodegradable flexible conductive base plate and preparation method thereof
12/18/2013CN102786908B Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
12/18/2013CN102466773B Radio frequency noise de-embedding method
12/18/2013CN102456666B Digital coordinate axis and reliability test method of gate oxide film
12/18/2013CN102412229B Metal plug structure in semiconductor device
12/18/2013CN102403366B Integrated circuit device and method of forming same
12/18/2013CN102388453B Robust ESD protection circuit, method and design structure for tolerant and failsafe designs
12/18/2013CN102282669B Method and apparatus for reducing semiconductor package tensile stress
12/18/2013CN102277123B Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
12/18/2013CN102272922B Semiconductor die package with clip interconnection
12/18/2013CN102224567B Integrated capacitor with grid plates
12/18/2013CN102217060B Flexible and stackable semiconductor die packages, systems using same, and methods of making same
12/18/2013CN102201414B Semiconductor memory device and manufacturing same
12/18/2013CN102158275B Photoreceiving device
12/18/2013CN102150294B Contacting device with conductor
12/18/2013CN102130129B Layout structure of static random access memory (SRAM) and manufacturing method thereof
12/18/2013CN102130102B Electronic device and method of producing same
12/18/2013CN102034740B Semiconductor device and method for fabricating same
12/18/2013CN101876410B Modularized LED street lamp
12/17/2013US8612159 Analyte monitoring device and methods of use
12/17/2013US8611125 Multi-chip packages providing reduced signal skew and related methods of operation
12/17/2013US8611087 Cooling system for information device
12/17/2013US8610294 Laser processing method and semiconductor device obtained by using the processing method
12/17/2013US8610293 Resin composition for encapsulating optical semiconductor element and optical semiconductor device
12/17/2013US8610292 Resin sealing method of semiconductor device
12/17/2013US8610291 Copper alloy bonding wire for semiconductor device
12/17/2013US8610289 Semiconductor component and method for producing a metal-semiconductor contact
12/17/2013US8610288 Semiconductor device with stacked semiconductor chips
12/17/2013US8610287 Wiring substrate and method of manufacturing the same
12/17/2013US8610286 Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in Fo-WLCSP
12/17/2013US8610285 3D IC packaging structures and methods with a metal pillar
12/17/2013US8610284 Semiconductor device and electronic device
12/17/2013US8610283 Semiconductor device having a copper plug
12/17/2013US8610282 Semiconductor device and method of manufacturing the same
12/17/2013US8610281 Double-sided semiconductor structure using through-silicon vias
12/17/2013US8610279 Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
12/17/2013US8610278 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures
12/17/2013US8610277 Bridge type pad structure of a semiconductor device
12/17/2013US8610276 Metal cap for back end of line (BEOL) interconnects, design structure and method of manufacture
12/17/2013US8610275 Semiconductor contact structure including a spacer formed within a via and method of manufacturing the same
12/17/2013US8610274 Die structure, die arrangement and method of processing a die
12/17/2013US8610271 Chip package and manufacturing method thereof
12/17/2013US8610270 Semiconductor device and semiconductor assembly with lead-free solder
12/17/2013US8610269 Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device
12/17/2013US8610268 Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element
12/17/2013US8610267 Reducing delamination between an underfill and a buffer layer in a bond structure
12/17/2013US8610266 Semiconductor device for radio frequency applications and method for making the same
12/17/2013US8610265 Compliant core peripheral lead semiconductor test socket
12/17/2013US8610264 Compliant interconnects in wafers
12/17/2013US8610262 Ball grid array package with improved thermal characteristics
12/17/2013US8610261 Power semiconductor device
12/17/2013US8610260 Stub minimization for assemblies without wirebonds to package substrate
12/17/2013US8610259 Multi-function and shielded 3D interconnects
12/17/2013US8610258 Integrated circuit package with multiple dies and sampled control signals
12/17/2013US8610257 Semiconductor device and method for producing such a device
12/17/2013US8610256 Device for detecting an attack against an integrated circuit
12/17/2013US8610254 Apparatus for integrated circuit packaging
12/17/2013US8610253 Lead frame, semiconductor device, and method of manufacturing semiconductor device
12/17/2013US8610252 Scribe line structure for wafer dicing
12/17/2013US8610245 Anti-fuse element without defective opens
12/17/2013US8610244 Layered structure with fuse
12/17/2013US8610243 Metal e-fuse with intermetallic compound programming mechanism and methods of making same
12/17/2013US8610237 Semiconductor apparatus
12/17/2013US8610224 MEMS element and electrical device using the same
12/17/2013US8610217 Self-protected electrostatic discharge field effect transistor (SPESDFET), an integrated circuit incorporating the SPESDFET as an input/output (I/O) pad driver and associated methods of forming the SPESDFET and the integrated circuit
12/17/2013US8610216 Structure for protecting an integrated circuit against electrostatic discharges
12/17/2013US8610214 ESD protection device having a geometric salicide pattern
12/17/2013US8610178 Semiconductor device having a fuse element
12/17/2013US8610006 Lid for micro-electro-mechanical device and method for fabricating the same
12/17/2013US8609527 Method of manufacturing semiconductor device
12/17/2013US8609525 Integrated circuit packaging system with interconnects and method of manufacture thereof
12/17/2013US8609508 Method of fabricating an integrated circuit having a strain inducing hollow trench isolation region
12/17/2013US8609506 On-chip heat spreader
12/17/2013US8609472 Process for fabricating electronic components using liquid injection molding
12/17/2013US8609442 Vapor deposition method, vapor deposition device and organic EL display device
12/17/2013US8609441 Substrate comprising a mark
12/17/2013US8607447 Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas
12/16/2013DE202012008739U1 Kühlkreislauf mit ausreichend knapp bemessenem Wärmetauscher Cooling circuit with sufficiently tightly dimensioned heat exchanger
12/15/2013CA2818040A1 Integrated circuit package and method of making same
12/13/2013DE202012008740U1 Thermosiphon mit zwei parallel geschalteten Kondensatoren Thermosyphon with two capacitors connected in parallel
12/12/2013WO2013184931A1 Kinetic heat sink having controllable thermal gap
12/12/2013WO2013184921A2 Reduced stress tsv and interposer structures
12/12/2013WO2013184880A1 Use of conformal coating elastic cushion to reduce through silicon vias (tsv) stress in 3-dimensional integration
12/12/2013WO2013184797A1 Ferroelectric devices, interconnects, and methods of manufacture thereof
12/12/2013WO2013184785A1 Pore sealing pastes for porous materials
12/12/2013WO2013184576A1 Bio-implantable hermetic integrated circuit device
12/12/2013WO2013184324A1 Fixture for shaping a laminate substrate
12/12/2013WO2013184152A1 Submount for electronic, optoelectronic, optical, or photonic components
12/12/2013WO2013184145A1 Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer
12/12/2013WO2013184025A1 Evaporating-condensing cooling system of current-conducting elements (versions)
12/12/2013WO2013183671A1 Method for manufacturing semiconductor device
12/12/2013WO2013183512A1 Curable epoxy resin composition
12/12/2013WO2013183315A1 Seal ring and process for producing seal ring
12/12/2013WO2013182980A1 Chip scale light emitting device with metal pillars in a molding compound formed at wafer level
12/12/2013WO2013181781A1 An apparatus comprising conductive portions and a method of making the apparatus
12/12/2013WO2013140226A3 System and method for controlling internal temperature of electronic components
12/12/2013US20130332092 Calibration Kits for RF Passive Devices
12/12/2013US20130330897 Semiconductor memory device including multi-layer gate structure
12/12/2013US20130330882 Integrated Circuit Packages, Methods of Forming Integrated Circuit Packages, And Methods of Assembling Integrated Circuit Packages
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