| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/19/2002 | US20020131238 Heat sink |
| 09/19/2002 | US20020131237 Electronic module including a cooling substrate and related methods |
| 09/19/2002 | US20020131236 CPU heat sink |
| 09/19/2002 | US20020131010 Liquid crystal display device and defect repairing method for the same |
| 09/19/2002 | US20020131003 Active matrix type liquid crystal display device and method of manufacturing the same |
| 09/19/2002 | US20020130739 Embedded waveguide and embedded electromagnetic shielding |
| 09/19/2002 | US20020130722 Crosstalk suppression in differential ac coupled multichannel ic amplifiers |
| 09/19/2002 | US20020130721 Electronic circuit unit suitable for reduction in size and weight |
| 09/19/2002 | US20020130714 Semiconductor integrated circuit device having an optimal circuit layout to ensure stabilization of internal source voltages without lowering circuit functions and/or operating performance |
| 09/19/2002 | US20020130687 Antifuse reroute of dies |
| 09/19/2002 | US20020130614 Display device |
| 09/19/2002 | US20020130425 Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device |
| 09/19/2002 | US20020130424 Semiconductor integrated circuit |
| 09/19/2002 | US20020130423 Semiconductor device and manufacturing method thereof |
| 09/19/2002 | US20020130422 Semiconductor/printed circuit board assembly, and computer system |
| 09/19/2002 | US20020130421 Semiconductor device |
| 09/19/2002 | US20020130420 Semiconductor devices having gradual slope contacts |
| 09/19/2002 | US20020130416 Integrated circuits with multiple low dielectric-constant inter-metal dielectrics |
| 09/19/2002 | US20020130415 Semiconductor device and manufacturing method thereof |
| 09/19/2002 | US20020130414 Semiconductor device and method of manufacturing the same |
| 09/19/2002 | US20020130413 Ball grid array chip packages having improved testing and stacking characteristics |
| 09/19/2002 | US20020130412 Semiconductor device and method of manufacture thereof |
| 09/19/2002 | US20020130411 Bga substrate via structure |
| 09/19/2002 | US20020130410 Interconnect structure for surface mounted devices |
| 09/19/2002 | US20020130409 Semiconductor device and drive circuit using the semiconductor devices |
| 09/19/2002 | US20020130408 Method for making electronic devices including silicon and LTCC and devices produced thereby |
| 09/19/2002 | US20020130407 Diamondoid-containing materials in microelectronics |
| 09/19/2002 | US20020130406 Components and methods with nested leads |
| 09/19/2002 | US20020130405 Electronic device |
| 09/19/2002 | US20020130404 Semiconductor module in which plural semiconductor chips are enclosed in one package |
| 09/19/2002 | US20020130402 Electronic device and method of manufacture the same |
| 09/19/2002 | US20020130400 Semiconductor package with lead frame |
| 09/19/2002 | US20020130399 Method for manufacturing a dual chip package |
| 09/19/2002 | US20020130398 Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same |
| 09/19/2002 | US20020130397 Direct attachment semiconductor chip to organic substrate |
| 09/19/2002 | US20020130396 Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials |
| 09/19/2002 | US20020130394 Semiconductor device and manufacturing method thereof |
| 09/19/2002 | US20020130391 Method for manufacturing a package structure of integrated circuits |
| 09/19/2002 | US20020130383 Semiconductor device having wiring patterns with insulating layer |
| 09/19/2002 | US20020130375 Damascene structure and method of making |
| 09/19/2002 | US20020130367 Semiconductor device incorporating elements formed of refractory metal-silicon-nitrogen and method for fabrication |
| 09/19/2002 | US20020130366 ESD protection circuit for a semiconductor integrated circuit |
| 09/19/2002 | US20020130365 Novel UMOS-like gate-controlled thyristor structure for ESD protection |
| 09/19/2002 | US20020130364 Low leakage input protection device and scheme for electrostatic discharge |
| 09/19/2002 | US20020130355 Semiconductor device and method of manufacturing the same |
| 09/19/2002 | US20020130347 Formation of a frontside contact on silicon-on-insulator substrate |
| 09/19/2002 | US20020130320 Method for evaluating an integrated electronic device |
| 09/19/2002 | US20020130311 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices |
| 09/19/2002 | US20020130276 Gas cooled electrostatic pin chuck for vacuum applications |
| 09/19/2002 | US20020130248 Circuit arrangement and method of protecting at least a chip arrangement from manipulation and/or abuse |
| 09/19/2002 | US20020130161 Method of attaching a body made of metal matrix composite (MMC) material or copper to a ceramic member |
| 09/19/2002 | US20020130114 Laser wire bonding for wire embedded dielectrics to integrated circuits |
| 09/19/2002 | US20020130046 Positioning substrate in an electroplating bath; forming doped copper layer on substrate; wherein the doped copper layer comprises an amount of non-metal that is controlled for increasing electromigration resistance in doped copper layer |
| 09/19/2002 | US20020129970 Portable electronic medium and manufacturing method thereof |
| 09/19/2002 | US20020129957 Low profile non-electrically-conductive component cover for encasing circuit board components to prevent direct contact of a conformal EMI shield |
| 09/19/2002 | US20020129951 Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
| 09/19/2002 | US20020129879 Device produced by a process of controlling grain growth in metal films |
| 09/19/2002 | DE10210903A1 Halbleiterpackungsbauelement geringer Dicke, Verfahren zu seiner Herstellung und zugehörige Elektronikkomponente Semiconductor package device of small thickness, process for its preparation and its associated electronics component |
| 09/19/2002 | DE10210662A1 Power semiconducting component has length of gate electrode layer on first isolation film and total isolation film thickness directly beneath gate electrode tip that exceed/equal lower limits |
| 09/19/2002 | DE10134983A1 Arrangement for cooling integrated semiconducting components has cooling body extending from components on top of module board over end of board to components on bottom of board |
| 09/19/2002 | DE10116062A1 Electronic component removal from lead frame cuts down in sectors to removal depth by pulsed solid-state laser beam passed repeatedly along parting line |
| 09/19/2002 | DE10110203A1 Elektronisches Bauteil mit gestapelten Halbleiterchips An electronic part having stacked semiconductor chips |
| 09/19/2002 | DE10110005A1 Electronic component used as semiconductor comprises semiconductor chip having active front side with bond pads and covered with elastic layer provided with contacts electrically conductively connected to bond pads |
| 09/19/2002 | DE10109877A1 Leiterbahnanordnung und Verfahren zur Herstellung einer Leiterbahnanordnung Interconnect arrangement and method for fabricating a wiring arrangement |
| 09/19/2002 | DE10109818A1 Semiconductor device has semiconductor body and associated carrier provided with flip-chip connections and furhter connections for dissipation of waste heat |
| 09/19/2002 | DE10109778A1 Hohlraumstruktur und Verfahren zum Herstellen einer Hohlraumstruktur Cavity structure and method of making a hollow structure |
| 09/19/2002 | CA2451882A1 Nanofabrication |
| 09/18/2002 | EP1241706A2 A gas cooled electrostatic pin chuck for vacuum applications |
| 09/18/2002 | EP1241481A2 Contact structure for interconnections, interposer, semiconductor assembly and method |
| 09/18/2002 | EP1240971A2 Laser welding components to a micro-optical bench |
| 09/18/2002 | EP1240810A1 A module including one or more chips |
| 09/18/2002 | EP1240669A1 Electrostatic discharge protection network having distributed components connected with inductors |
| 09/18/2002 | EP1240668A1 Method and apparatus for encoding information in an ic package |
| 09/18/2002 | EP1240667A2 Integrated circuit package |
| 09/18/2002 | EP1240251A1 Encapsulant compositions with thermal shock resistance |
| 09/18/2002 | EP0862791B1 Method of manufacturing and transferring metallic droplets |
| 09/18/2002 | EP0789934B1 Ballast monitoring for radio frequency power transistors |
| 09/18/2002 | EP0729669B1 Dual-sided push-pull amplifier |
| 09/18/2002 | CN2512115Y Radiator |
| 09/18/2002 | CN2512114Y Duplicated piled reversing welding-ball matrix package body |
| 09/18/2002 | CN1370322A Inductor element |
| 09/18/2002 | CN1370305A Electronic device comprising chip fixed on support and method for making same |
| 09/18/2002 | CN1369914A Packed integrated circuit |
| 09/18/2002 | CN1369913A Ball arra ypackage for redcing electric stray signals |
| 09/18/2002 | CN1369912A Semiconductor integrated circuit and its preparing method |
| 09/18/2002 | CN1369911A Wire frame, semiconductor device using such frame and its mfg. method |
| 09/18/2002 | CN1369910A Layout strcture for multi-layer metallic power/ground bus |
| 09/18/2002 | CN1369909A Radiating structure of LED |
| 09/18/2002 | CN1369854A Semiconductor device and its mfg. method and electronic camera installation |
| 09/18/2002 | CN1091301C 半导体器件 Semiconductor devices |
| 09/18/2002 | CN1091300C Lead-on-chip semiconductor device package and its mfg. method |
| 09/18/2002 | CN1091299C Semiconductor device contg. semiconductor element in package |
| 09/17/2002 | USRE37840 Method of preparing a printed circuit board |
| 09/17/2002 | US6452804 Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate |
| 09/17/2002 | US6452803 Heat sink assembly |
| 09/17/2002 | US6452802 Symmetrical package for semiconductor die |
| 09/17/2002 | US6452801 Heat sink clip with slidable locking bars |
| 09/17/2002 | US6452800 Heat sink assembly for dissipating heat of an electronic package mounted on an electrical socket |
| 09/17/2002 | US6452799 Integrated circuit cooling system |
| 09/17/2002 | US6452798 Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods |