| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/24/2002 | US6455938 Integrated circuit interconnect shunt layer |
| 09/24/2002 | US6455937 Arrangement and method for improved downward scaling of higher conductivity metal-based interconnects |
| 09/24/2002 | US6455936 Integrated circuit assembly having interposer with a compliant layer |
| 09/24/2002 | US6455935 Asymmetric, double-sided self-aligned silicide |
| 09/24/2002 | US6455932 Ceramic package for semiconductor device |
| 09/24/2002 | US6455931 Monolithic microelectronic array structure having substrate islands and its fabrication |
| 09/24/2002 | US6455929 Embedded type package of power semiconductor device |
| 09/24/2002 | US6455928 Stackable ball grid array package |
| 09/24/2002 | US6455926 High density cavity-up wire bond BGA |
| 09/24/2002 | US6455925 Power transistor package with integrated flange for surface mount heat removal |
| 09/24/2002 | US6455924 Stress-relieving heatsink structure and method of attachment to an electronic package |
| 09/24/2002 | US6455923 Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices |
| 09/24/2002 | US6455922 Deformation-absorbing leadframe for semiconductor devices |
| 09/24/2002 | US6455921 Fabricating plug and near-zero overlap interconnect line |
| 09/24/2002 | US6455920 Semiconductor device having a ball grid array and a fabrication process thereof |
| 09/24/2002 | US6455915 Integrated inductive circuits |
| 09/24/2002 | US6455914 Pedestal fuse |
| 09/24/2002 | US6455913 Copper fuse for integrated circuit |
| 09/24/2002 | US6455910 Cross guard-ring structure to protect the chip crack in low dielectric constant and copper process |
| 09/24/2002 | US6455900 Semiconductor device |
| 09/24/2002 | US6455898 Electrostatic discharge input protection for reducing input resistance |
| 09/24/2002 | US6455891 Semiconductor device and method for manufacturing the same |
| 09/24/2002 | US6455885 Inductor structure for high performance system-on-chip using post passivation process |
| 09/24/2002 | US6455880 Microwave semiconductor device having coplanar waveguide and micro-strip line |
| 09/24/2002 | US6455864 Methods and compositions for ionizing radiation shielding |
| 09/24/2002 | US6455786 Wiring board and manufacturing method thereof and semiconductor device |
| 09/24/2002 | US6455783 Multilayer printed wiring board and method for manufacturing the same |
| 09/24/2002 | US6455778 Micro-flex technology in semiconductor packages |
| 09/24/2002 | US6455774 Molded image sensor package |
| 09/24/2002 | US6455770 Electromagnetic radiation shield for attenuating electromagnetic radiation from an active electronic device |
| 09/24/2002 | US6455453 Mgo and an mgal2o4 crystal phase; glass composed of silicon oxide, boron oxide, alkaline earth oxide; high strength; metals such as silver or copper |
| 09/24/2002 | US6455446 High-temperature high-pressure processing method for semiconductor wafers, and an anti-oxidizing body used for the method |
| 09/24/2002 | US6455445 Silicone polymer insulation film on semiconductor substrate and method for forming the film |
| 09/24/2002 | US6455444 Semiconductor device having a multilayer interconnection structure |
| 09/24/2002 | US6455436 Method of fabricating semiconductor device |
| 09/24/2002 | US6455435 Method for fabricating a wiring plane on a semiconductor chip with an antifuse |
| 09/24/2002 | US6455434 Prevention of slurry build-up within wafer topography during polishing |
| 09/24/2002 | US6455425 Selective deposition process for passivating top interface of damascene-type Cu interconnect lines |
| 09/24/2002 | US6455421 Plasma treatment of tantalum nitride compound films formed by chemical vapor deposition |
| 09/24/2002 | US6455419 System and method of forming a tungsten plug |
| 09/24/2002 | US6455418 Barrier for copper metallization |
| 09/24/2002 | US6455415 Using low dielectric material results in semiconductor structure that is free of silicon nitride or oxide in copper interconnect region and which comprises copper interconnect structure that overcomes undesirable copper diffusion |
| 09/24/2002 | US6455412 Semiconductor contact via structure and method |
| 09/24/2002 | US6455410 Semiconductor device and method of manufacturing the same |
| 09/24/2002 | US6455408 Method for manufacturing semiconductor devices having redistribution patterns with a concave pattern in a bump pad area |
| 09/24/2002 | US6455356 Methods for moding a leadframe in plastic integrated circuit devices |
| 09/24/2002 | US6455354 Method of fabricating tape attachment chip-on-board assemblies |
| 09/24/2002 | US6455353 Method of making semiconductor packages at wafer level |
| 09/24/2002 | US6455349 Method and apparatus for filling a gap between spaced layers of a semiconductor |
| 09/24/2002 | US6455348 Lead frame, resin-molded semiconductor device, and method for manufacturing the same |
| 09/24/2002 | US6455332 Methodology to mitigate electron beam induced charge dissipation on polysilicon fine patterning |
| 09/24/2002 | US6455130 Nanoporous dielectric films with graded density and process for making such films |
| 09/24/2002 | US6454919 Physical vapor deposition apparatus with deposition and DC target power control |
| 09/24/2002 | US6454866 Wafer support system |
| 09/24/2002 | US6454171 Electronic card encapsulating at least one IC chip and the method for producing the same |
| 09/24/2002 | US6454160 Method for hermetically encapsulating microsystems in situ |
| 09/24/2002 | US6454158 Wire bonding apparatus and wire bonding method of semiconductor device |
| 09/24/2002 | US6454153 Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies |
| 09/24/2002 | US6453987 Unitary heat-dissipating fin strip unit with straight strip portions and U-shaped strip portions |
| 09/24/2002 | US6453553 Method for making an anisotropic conductive coating with conductive inserts |
| 09/24/2002 | US6453547 Coupling spaced bond pads to a contact |
| 09/24/2002 | US6453537 Cooling method for electronic components |
| 09/24/2002 | US6453530 Tool for mounting a clip to a socket |
| 09/19/2002 | WO2002074029A1 Multilayer printed wiring board |
| 09/19/2002 | WO2002073701A1 An rf power ldmos transistor |
| 09/19/2002 | WO2002073699A2 Nanofabrication |
| 09/19/2002 | WO2002073693A1 Semiconductor device |
| 09/19/2002 | WO2002073691A1 In-situ cap and method of fabricating same for an integrated circuit device |
| 09/19/2002 | WO2002073690A2 A method of packaging a device with a lead frame |
| 09/19/2002 | WO2002073687A2 Method of removing oxide from copper bond pads |
| 09/19/2002 | WO2002073685A2 Multi-layer circuit assembly and process for preparing the same |
| 09/19/2002 | WO2002073684A1 Method for structuring a flat substrate consisting of a glass-type material |
| 09/19/2002 | WO2002073683A1 Components with nested leads |
| 09/19/2002 | WO2002073667A2 Formation of a frontside contact on silicon-on-insulator substrate |
| 09/19/2002 | WO2002073661A2 Extraction method of defect density and size distributions |
| 09/19/2002 | WO2002043152A3 Poly fuse rom |
| 09/19/2002 | WO2002011201A3 Method and device for producing connection substrates for electronic components |
| 09/19/2002 | US20020132896 Crosslinking |
| 09/19/2002 | US20020132471 High modulus film structure for enhanced electromigration resistance |
| 09/19/2002 | US20020132469 Method for forming metal wiring layer |
| 09/19/2002 | US20020132466 Semiconductor device having reduced interconnect-line parasitic capacitance |
| 09/19/2002 | US20020132463 Semiconductor device and manufacturing method of the same |
| 09/19/2002 | US20020132462 Spherical semiconductor device and method for fabricating the same |
| 09/19/2002 | US20020132461 Semiconductor device having bump electrodes with a stress dissipating structure and method of manufacturing the same |
| 09/19/2002 | US20020132450 Semiconductor device and method for producing the same, and anisotropic conductive circuit board |
| 09/19/2002 | US20020132397 Use of atomic oxygen process for improved barrier layer |
| 09/19/2002 | US20020132395 Body contact in SOI devices by electrically weakening the oxide under the body |
| 09/19/2002 | US20020132392 Semiconductor device and method for manufacturing the same |
| 09/19/2002 | US20020132390 Radiused leadframe |
| 09/19/2002 | US20020132096 Wiring board |
| 09/19/2002 | US20020132095 Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board |
| 09/19/2002 | US20020132060 Laser marking techniques |
| 09/19/2002 | US20020132053 Highly stable packaging substrates |
| 09/19/2002 | US20020131289 Metal during pattern for memory devices |
| 09/19/2002 | US20020131281 On-chip power supply with optimized electromagnetic compatibility |
| 09/19/2002 | US20020131255 I-channel surface-mount connector |
| 09/19/2002 | US20020131247 Dielectric resin composition and multilayer circuit board comprising dielectric layers formed therefrom |
| 09/19/2002 | US20020131246 Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens |
| 09/19/2002 | US20020131245 Modular PC Card which receives add-in PC Card modules |
| 09/19/2002 | US20020131240 Heat dissipation structure of integrated circuit (IC) |