H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2002
10/01/2002	US6459154 Bonding pad structure of a semiconductor device and method of fabricating the same
10/01/2002	US6459153 Compositions for improving interconnect metallization performance in integrated circuits
10/01/2002	US6459152 Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface
10/01/2002	US6459151 Structure and process of via chain for misalignment test
10/01/2002	US6459150 Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer
10/01/2002	US6459149 Electronic component, communication device, and manufacturing method for electronic component
10/01/2002	US6459148 QFN semiconductor package
10/01/2002	US6459147 Attaching semiconductor dies to substrates with conductive straps
10/01/2002	US6459145 Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor
10/01/2002	US6459144 Flip chip semiconductor package
10/01/2002	US6459143 Method of packaging fuses
10/01/2002	US6459136 Single metal programmability in a customizable integrated circuit device
10/01/2002	US6459135 Monolithic integrated circuit incorporating an inductive component and process for fabricating such an integrated circuit
10/01/2002	US6459125 SOI based transistor inside an insulation layer with conductive bump on the insulation layer
10/01/2002	US6459105 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions
10/01/2002	US6459095 Chemically synthesized and assembled electronics devices
10/01/2002	US6459039 Method and apparatus to manufacture an electronic package with direct wiring pattern
10/01/2002	US6458734 Dielectric ceramic composition
10/01/2002	US6458719 Low dielectric constant film composed of boron, nitrogen, and hydrogen having thermal resistance, process for forming the film, use of the film between semiconductor device layers, and the device formed from the film
10/01/2002	US6458718 Providing a substrate; providing a chemical precursor of the formula (f3c)4-m-nmxmrn, wherein m is silicon or germenium, x is halogen, r is hydrogen or d, activating the precursor to deposit a fluorine containing material onto the substrate
10/01/2002	US6458710 Process for forming uniform multiple contact holes
10/01/2002	US6458709 Method for fabricating a repair fuse box for a semiconductor device
10/01/2002	US6458700 Integrated circuitry fabrication method of making a conductive electrical connection
10/01/2002	US6458697 Semiconductor device and manufacturing method therefor
10/01/2002	US6458693 Method of manufacturing a semiconductor device
10/01/2002	US6458690 Method for manufacturing a multilayer interconnection structure
10/01/2002	US6458687 Method for forming conductive structures
10/01/2002	US6458686 Inverse integrated circuit fabrication process
10/01/2002	US6458684 Single step process for blanket-selective CVD aluminum deposition
10/01/2002	US6458682 Method of manufacturing a bump electrode semiconductor device using photosensitive resin
10/01/2002	US6458681 Method for providing void free layer for semiconductor assemblies
10/01/2002	US6458676 Method of varying the resistance along a conductive layer
10/01/2002	US6458673 Transparent and conductive zinc oxide film with low growth temperature
10/01/2002	US6458670 Area of multilayer wiring substrate can be reduced, and cracks caused by residual stress produced by a firing step can be prevented
10/01/2002	US6458669 Method of manufacturing an integrated circuit
10/01/2002	US6458651 Method of forming a capacitor and an electrical connection thereto
10/01/2002	US6458632 UMOS-like gate-controlled thyristor structure for ESD protection
10/01/2002	US6458631 Method for fabricating an integrated circuit, in particular an antifuse
10/01/2002	US6458630 Antifuse for use with low k dielectric foam insulators
10/01/2002	US6458629 High-frequency module, method of manufacturing thereof and method of molding resin
10/01/2002	US6458627 Semiconductor chip package and method of fabricating same
10/01/2002	US6458626 Fabricating method for semiconductor package
10/01/2002	US6458625 Multi chip semiconductor package and method of construction
10/01/2002	US6458623 Conductive adhesive interconnection with insulating polymer carrier
10/01/2002	US6458622 Stress compensation composition and semiconductor component formed using the stress compensation composition
10/01/2002	US6458617 Multi-chip semiconductor package structure
10/01/2002	US6458609 Semiconductor device and method for manufacturing thereof
10/01/2002	US6458606 Etch bias distribution across semiconductor wafer
10/01/2002	US6458472 Fluxing underfill compositions
10/01/2002	US6458411 Method of making a mechanically compliant bump
10/01/2002	US6458255 Ultra-low resistivity tantalum films and methods for their deposition
10/01/2002	US6458251 Pressure modulation method to obtain improved step coverage of seed layer
10/01/2002	US6457986 Cam retaining means for ZIF electrical connector
10/01/2002	US6457654 Micromachined synthetic jet actuators and applications thereof
10/01/2002	US6457633 Method of forming a BGA-type semiconductor device having reliable electrical connection for solder balls
10/01/2002	US6457632 Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy
10/01/2002	US6457515 Two-layered micro channel heat sink, devices and systems incorporating same
10/01/2002	US6457514 Liquid cooled dissipator for electronic components equipped with selectively arranged dissipation fins
10/01/2002	US6457321 Spray cooling system
10/01/2002	US6457234 Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond
10/01/2002	US6457233 Solder bonding method, and process of making electronic device
10/01/2002	US6457228 Method for sealing liquid coolant into module
10/01/2002	CA2265916C Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and ic card
09/2002
09/30/2002	CA2379921A1 Twisted wordline strapping arrangement
09/30/2002	CA2342496A1 Twisted wordline straps
09/26/2002	WO2002076166A1 Heat sink
09/26/2002	WO2002076165A1 Electronic module including a cooling substrate and related methods
09/26/2002	WO2002076164A2 Electronic module with fluid dissociation electrodes and methods
09/26/2002	WO2002076161A1 Method of manufacturing electronic part and electronic part obtained by the method
09/26/2002	WO2002075926A2 Antifuse reroute of dies
09/26/2002	WO2002075892A1 Electrostatic discharge protection structures having high holding current for latch-up immunity
09/26/2002	WO2002075810A2 Integrated circuit comprising electric connecting elements
09/26/2002	WO2002075809A1 Mask sheet for assembling semiconductor device and method for assembling semiconductor device
09/26/2002	WO2002075797A2 Method of forming copper interconnects
09/26/2002	WO2002075786A2 Bond wire tuning of rf power transistors and amplifiers
09/26/2002	WO2002075755A1 Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work
09/26/2002	WO2002075647A1 Portable electronic device
09/26/2002	WO2002075262A1 Infrared detection element and method for fabricating the same and equipment for measuring temperature
09/26/2002	WO2002049109B1 Stacked die package
09/26/2002	WO2002001637A3 Layout and process for a device with segmented ball limited metallurgy for the inputs and outputs
09/26/2002	WO2001039252A9 Active package for integrated circuit
09/26/2002	US20020137867 Obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group- having (meth)acrylate; bonds or adheres well to metal conductor layers
09/26/2002	US20020137404 I-channel surface-mount connector
09/26/2002	US20020137366 Universal low profile connector for grid arrays with organic contact retainer
09/26/2002	US20020137359 Ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device containing the same
09/26/2002	US20020137355 Process for forming uniform multiple contact holes
09/26/2002	US20020137349 Monolithic low dielectric constant platform for passive components and method
09/26/2002	US20020137332 Microelectronic interconnect material with adhesion promotion layer and fabrication method
09/26/2002	US20020137330 Ultra large scale integration, ULSI; Having a layer of chromium oxide (CrO)
09/26/2002	US20020137328 Semiconductor device and manufacturing method thereof
09/26/2002	US20020137327 Semiconductor device and manufacturing method thereof.
09/26/2002	US20020137326 Method for manufacturing a low-profile semiconductor device
09/26/2002	US20020137323 Metal ion diffusion barrier layers
09/26/2002	US20020137322 Reduced mask count process for manufacture of mosgated device
09/26/2002	US20020137320 Process for producing semiconductor integrated circuit device
09/26/2002	US20020137309 Release sheet and a protective film forming layer of a thermosetting or energy ray-curable component and binder component formed on a detachable surface of the release sheet
09/26/2002	US20020137277 Semiconductor device having a reduced-capacitance conductive layer and fabrication method for the same
09/26/2002	US20020137263 Dispensing process for fabrication of microelectronic packages
09/26/2002	US20020137262 Semiconductor device
09/26/2002	US20020137261 Semiconductor device

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