| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/26/2002 | US20020137260 Depositing colloidal suspension, drying and infiltrating with a liquid phase matrix material, such as a spin-on polymer, followed by curing, to provide an etch resistant dielectric |
| 09/26/2002 | US20020137259 Method for forming semiconductor device |
| 09/26/2002 | US20020137258 Die stacking scheme |
| 09/26/2002 | US20020137257 Substrate of semiconductor package |
| 09/26/2002 | US20020137256 Method and structure for an organic package with improved BGA life |
| 09/26/2002 | US20020137254 Semiconductor device and method for fabricating the same |
| 09/26/2002 | US20020137253 Method of reducing shear stresses on IC chips and structure formed thereby |
| 09/26/2002 | US20020137252 Folded interposer |
| 09/26/2002 | US20020136872 Lead frame laminate and method for manufacturing semiconductor parts |
| 09/26/2002 | US20020136507 Laser welding components to an optical micro-bench |
| 09/26/2002 | US20020136250 Diode laser component |
| 09/26/2002 | US20020135984 Clean release, phase change thermal interface |
| 09/26/2002 | US20020135981 Method and apparatus for cooling electronic components |
| 09/26/2002 | US20020135980 High heat flux electronic cooling apparatus, devices and systems incorporating same |
| 09/26/2002 | US20020135961 Efficient cooler |
| 09/26/2002 | US20020135670 Laser marking techniques |
| 09/26/2002 | US20020135459 Method for the manufacture of printed circuit boards with plated resistors |
| 09/26/2002 | US20020135236 Non-optical signal isolator |
| 09/26/2002 | US20020135080 Semiconductor device and method for fabricating same |
| 09/26/2002 | US20020135079 Chip-scale package |
| 09/26/2002 | US20020135078 Chip module with bond-wire connections with small loop height |
| 09/26/2002 | US20020135077 Semiconductor copper bond pad surface protection |
| 09/26/2002 | US20020135076 Heat sink with collapse structure and semiconductor package with heat sink |
| 09/26/2002 | US20020135074 Method of manufacturing a semiconductor device |
| 09/26/2002 | US20020135072 Semiconductor memory device for reducing parasitic bit line capacitance and method of fabricating the same |
| 09/26/2002 | US20020135071 Integrated circuit device contact plugs having a liner layer that exerts compressive stress thereon and methods of manufacturing same |
| 09/26/2002 | US20020135070 Integrated circuits having plugs in conductive layers therein and related methods |
| 09/26/2002 | US20020135069 Electroplating methods for fabricating microelectronic interconnects |
| 09/26/2002 | US20020135066 Stackable ball grid array package |
| 09/26/2002 | US20020135065 Thermally and electrically enhanced ball grid array packaging |
| 09/26/2002 | US20020135063 Apparatus to reduce thermal fatigue stress on flip chip solder connections |
| 09/26/2002 | US20020135062 Process of manufacturing a composite structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material |
| 09/26/2002 | US20020135061 Composite material, and manufacturing method and uses of same |
| 09/26/2002 | US20020135058 Component built-in module and method of manufacturing the same |
| 09/26/2002 | US20020135056 Semiconductor device and method of manufacturing the same |
| 09/26/2002 | US20020135055 Semiconductor device having a fuse connected to a pad and fabrication method thereof |
| 09/26/2002 | US20020135053 Integrated circuit package with a capacitor |
| 09/26/2002 | US20020135052 Stress-relieving heatsink structure and method of attachment to an electronic package |
| 09/26/2002 | US20020135051 Semiconductor device and lead frame therefor |
| 09/26/2002 | US20020135050 Semiconductor device |
| 09/26/2002 | US20020135049 Electronic package with surface-mountable device built therein |
| 09/26/2002 | US20020135043 Tri-layer dielectric fuse cap for laser deletion |
| 09/26/2002 | US20020135042 Reduced RC delay between adjacent substrate wiring lines |
| 09/26/2002 | US20020135041 Semiconductor integrated circuit and semiconductor device |
| 09/26/2002 | US20020135040 Integrated circuit structure having low dielectric constant material and having silicon oxynitride caps over closely spaced apart metal lines |
| 09/26/2002 | US20020135032 Semiconductor device for esd protection |
| 09/26/2002 | US20020135026 Semiconductor device, memory system and electronic apparatus |
| 09/26/2002 | US20020135003 Semiconductor device, memory system and electronic apparatus |
| 09/26/2002 | US20020134993 Bond wire tuning of RF power transistors and amplifiers |
| 09/26/2002 | US20020134686 Method for the formation of copper wiring films |
| 09/26/2002 | US20020134582 Integrated circuit package and method |
| 09/26/2002 | US20020134581 Hybrid capacitor, circuit, and system |
| 09/26/2002 | US20020134580 Configuration having an electronic device electrically connected to a printed circuit board |
| 09/26/2002 | US20020134579 Method and device for avoiding electrostatic discharge of an electronic device by using electroconductive sheet |
| 09/26/2002 | US20020134578 Packaging structure of a driving circuit for a liquid crystal display device and packaging method of a driving circuit for a liquid crystal display device |
| 09/26/2002 | US20020134575 Insulating nut holder for electrical component package |
| 09/26/2002 | US20020134543 Connecting device with local heating element and method for using same |
| 09/26/2002 | US20020134534 Press formed two-phase cooling module and method for making same |
| 09/26/2002 | US20020134532 Cooling system for multichip module |
| 09/26/2002 | US20020134488 Method for producing multilayer ceramic substrate |
| 09/26/2002 | US20020134419 Heat sink/spreader structures which utilize thermoelectric effects to dissipate thermal energy from electronics (integrated circuits) |
| 09/26/2002 | US20020133943 Method for manufacturing circuit device |
| 09/26/2002 | DE10206661A1 Electronic component used in semiconductors comprises a semiconductor chip surrounded by a sawn edge having profile-sawn contours of semiconductor material and surrounded by a plastic composition forming a plastic edge |
| 09/26/2002 | DE10114639A1 Cooling device for electronic components in PCs has circuit board for fitting onto cooling ribs, temperature-controled resistance on board controled by temperature sensor near cooling ribs |
| 09/25/2002 | EP1244210A2 Electronic circuit unit |
| 09/25/2002 | EP1244172A2 Wiring board and wiring board module using the same |
| 09/25/2002 | EP1244145A2 Press formed two-phase cooling module and method for making same |
| 09/25/2002 | EP1244143A2 Sheet to form a protective film for chips and process for producing semiconductor chips |
| 09/25/2002 | EP1244055A2 Portable electronic medium and manufacturing method thereof |
| 09/25/2002 | EP1243672A1 Plating device and plating method |
| 09/25/2002 | EP1243569A2 Electrical circuit having a metal-bonded-ceramic material or MBC component as an insulating substrate |
| 09/25/2002 | EP1243027A1 Anti tamper encapsulation for an integrated circuit |
| 09/25/2002 | EP1243026A1 Organic packages with solders for reliable flip chip connections |
| 09/25/2002 | EP1243025A2 Semiconductor packaging |
| 09/25/2002 | EP1242223A1 Microreaction systems and molding methods |
| 09/25/2002 | EP0805785B1 Low dielectric loss glasses |
| 09/25/2002 | EP0654169B1 Cubic metal oxide thin film epitaxially grown on silicon |
| 09/25/2002 | CN2513228Y Integrated circuit device with low random noise high frequency signal |
| 09/25/2002 | CN2513227Y Improved structure of overlapping tin ball for ball gate array IC socket |
| 09/25/2002 | CN2513155Y Computer microprocessor radiator |
| 09/25/2002 | CN1371590A Multilayer substrate module and portable wireless terminal |
| 09/25/2002 | CN1371505A Chip card module and chip card encompassing said module as well as method for producing the chip card module |
| 09/25/2002 | CN1371128A Semiconductor device and its manufacture |
| 09/25/2002 | CN1371127A Wire frame and the manufacture of resin sealed semiconductor unit with the wire frame |
| 09/25/2002 | CN1371125A Heat radiator with magnetized heat-conducting liquid |
| 09/25/2002 | CN1371019A Flexible plate, electro-optical unit and electronic equipment |
| 09/25/2002 | CN1370810A Adhesive composition and adhesive sheet for semiconductor device |
| 09/24/2002 | US6457158 Method and device for placing electrode for signal observation |
| 09/24/2002 | US6457157 I/O device layout during integrated circuit design |
| 09/24/2002 | US6456518 Bi-level digit line architecture for high density drams |
| 09/24/2002 | US6456493 Heat sink clip |
| 09/24/2002 | US6456490 Engagement securing device for a heat sink |
| 09/24/2002 | US6456183 Inductor for integrated circuit |
| 09/24/2002 | US6456117 Shield circuit and integrated circuit in which the shield circuit is used |
| 09/24/2002 | US6456099 Special contact points for accessing internal circuitry of an integrated circuit |
| 09/24/2002 | US6455945 Semiconductor device having a fragment of a connection part provided on at least one lateral edge for mechanically connecting to adjacent semiconductor chips |
| 09/24/2002 | US6455943 Bonding pad structure of semiconductor device having improved bondability |
| 09/24/2002 | US6455942 Method and apparatus for strapping a plurality of polysilicon lines in a semiconductor integrated circuit device |
| 09/24/2002 | US6455941 Chip scale package |
| 09/24/2002 | US6455940 Semiconductor device including lead wiring protected by dual barrier films |