Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2002
10/03/2002US20020142576 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
10/03/2002US20020142574 Solder ball allocation on a chip and method of the same
10/03/2002US20020142561 Method for improving a stepper signal in a planarized surface over alignment topography
10/03/2002US20020142555 Method for fabricating a semiconductor device
10/03/2002US20020142550 Semiconductor device and method of manufacturing the same
10/03/2002US20020142533 Low-dielectric-constant interlayer insulating film composed of borazine-silicon-based polymer and semiconductor device
10/03/2002US20020142521 Electric or electronic component and method of manufacturing such a component
10/03/2002US20020142520 Method of making semiconductor device
10/03/2002US20020142514 Microelectronic assembly with die support and method
10/03/2002US20020142513 Ball grid array interposer, packages and methods
10/03/2002US20020142512 Planar spiral inductor structure with patterned microelectronic structure integral thereto
10/03/2002US20020142510 Solid image pickup apparatus and production method thereof
10/03/2002US20020142508 Metal film protection of the surface of a structure formed on a semiconductor substrate during etching of the substrate by a KOH etchant
10/03/2002US20020142494 Method and system for fabricating contacts on semiconductor components
10/03/2002US20020142187 Composite multilayer ceramic electronic parts and method of manufacturing the same
10/03/2002US20020142177 Mixture of polymer and spherical filler
10/03/2002US20020142167 Chip on films; flexible printed circuit
10/03/2002US20020142165 Graphite-based heat sink
10/03/2002US20020142153 Resin sealing method for semiconductors and release film used therefor
10/03/2002US20020141706 Optical connector, optical element holding structure, and structure of a mount section of an optical connector
10/03/2002US20020141473 Controlling laser polarization
10/03/2002US20020141257 Layout method for semiconductor integrated circuit
10/03/2002US20020141220 Bi-level digit line architecture for high density DRAMS
10/03/2002US20020141171 Alternate bump metallurgy bars for power and ground routing
10/03/2002US20020141168 High-frequency circuit board and semiconductor device using the high-frequency circuit board
10/03/2002US20020141161 Power source unit for driving magnetron and heatsink to be mounted on printed circuit board thereof
10/03/2002US20020141160 Adjusting fillet geometry to couple a heat spreader to a chip carrier
10/03/2002US20020141157 Heat sink mounting method and apparatus
10/03/2002US20020141155 Thermal management components
10/03/2002US20020141143 Electric power distributor for use in motor vehicle
10/03/2002US20020141142 Electronic packages
10/03/2002US20020140949 Method of inspecting semiconductor integrated circuit which can quickly measure a cubic body
10/03/2002US20020140869 System and method for providing a low power receiver design
10/03/2002US20020140532 Wiring board and wiring board module using the same
10/03/2002US20020140443 Method and apparatus for inspecting conductive pattern
10/03/2002US20020140437 Structure and method for electrical method of determining film conformality
10/03/2002US20020140389 Method and apparatus for controlling cooling fan
10/03/2002US20020140135 Multilayered ceramic substrate production method
10/03/2002US20020140115 Semiconductor device
10/03/2002US20020140114 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, semiconductor wafer and method for manufacturing semiconductor device by using sealing apparatus
10/03/2002US20020140113 Encapsulated semiconductor die package, and method for making same
10/03/2002US20020140112 Insulated bond wire assembly process technology for integrated circuits
10/03/2002US20020140111 Method and apparatus for implementing selected functionality on an integrated circuit device
10/03/2002US20020140110 Semiconductor chip mounting substrate and semiconductor device using the same
10/03/2002US20020140108 Molded body for pbga and chip-scale packages
10/03/2002US20020140107 Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
10/03/2002US20020140106 Twisted wordline strapping arrangement
10/03/2002US20020140104 Method of making a semiconductor device having a dual damascene interconnect spaced from a support structure
10/03/2002US20020140103 Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer
10/03/2002US20020140102 Multi-layered barrier metal thin films for Cu interconnect by ALCVD
10/03/2002US20020140100 Semiconductor device and method for fabricating the same
10/03/2002US20020140099 Semiconductor device and method for manufacturing the same
10/03/2002US20020140097 Semiconductor device
10/03/2002US20020140096 Method and structure for ex-situ polymer stud grid array contact formation
10/03/2002US20020140095 Semiconductor package and method of manufacturing the same
10/03/2002US20020140094 Fluxless flip chip interconnection
10/03/2002US20020140093 Conductor bodies attached adhesive sheet, process for producing semiconductor device and semiconductor device
10/03/2002US20020140092 Lead frame, and semiconductor integrated circuit using the same, and optical module and method producing for the same
10/03/2002US20020140091 Dual die memory
10/03/2002US20020140090 High frequency semiconductor device housing package
10/03/2002US20020140089 High frequency semiconductor device
10/03/2002US20020140088 Semiconductor integrated circuit having three-dimensional interconnection lines
10/03/2002US20020140087 High frequency semiconductor device
10/03/2002US20020140086 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
10/03/2002US20020140085 Semiconductor package including passive elements and method of manufacture
10/03/2002US20020140084 Semiconductor device
10/03/2002US20020140083 Semiconductor device haivng resin-sealed area on circuit board thereof
10/03/2002US20020140082 Chain extension for thermal materials
10/03/2002US20020140081 Highly integrated multi-layer circuit module having ceramic substrates with embedded passive devices
10/03/2002US20020140078 Power semiconductor device
10/03/2002US20020140077 Multichip semiconductor package
10/03/2002US20020140076 Multi-layer wiring circuit board and method for producing the same
10/03/2002US20020140075 Power transistor package with integrated flange for surface mount heat removal
10/03/2002US20020140072 IC chip package
10/03/2002US20020140071 Multiple ground signal path LDMOS power package
10/03/2002US20020140070 Packaging system for die-up connection of a die-down oriented integrated circuit
10/03/2002US20020140069 Structure and manufactruing method of chip scale package
10/03/2002US20020140068 Leadframe-based semiconductor package for multi-media card
10/03/2002US20020140067 Semiconductor package and manufacturing method thereof
10/03/2002US20020140065 Semiconductor package and method for manufactruing the same
10/03/2002US20020140064 Semiconductor chip package and lead frame structure thereof
10/03/2002US20020140063 Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
10/03/2002US20020140062 Semiconductor package
10/03/2002US20020140061 Lead frame for semiconductor package
10/03/2002US20020140059 Semiconductor device
10/03/2002US20020140058 IC chip
10/03/2002US20020140057 High frequency semiconductor device
10/03/2002US20020140052 High frequency semiconductor device
10/03/2002US20020140050 Semiconductor device having an inductor with low loss
10/03/2002US20020140048 Semiconductor integrated circuit device, and method of manufacturing the same
10/03/2002US20020140007 Semiconductor device and method for fabricating the same
10/03/2002US20020140006 High frequency semiconductor device
10/03/2002US20020140003 Solid-state imaging device
10/03/2002US20020140002 Semiconductor integrated circuit configured to supply sufficient internal current
10/03/2002US20020139993 High frequency semiconductor device
10/03/2002US20020139975 Electrical passivation of silicon-containing surfaces using organic layers
10/03/2002US20020139969 High frequency semiconductor device
10/03/2002US20020139578 Hyperbga buildup laminate
10/03/2002US20020139577 In-street integrated circuit wafer via
10/03/2002US20020139576 Conductive contamination reliability solution for assembling substrates
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