Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2002
10/03/2002US20020139572 Semiconductor devices and methods for manufacturing the same
10/03/2002US20020139571 Semiconductor device and process for fabricating the same
10/03/2002US20020139570 Compliant multi-layered circuit board for pbga applications
10/03/2002US20020139567 Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same
10/03/2002US20020139556 Method and apparatus for providing hermetic electrical feedthrough
10/03/2002US20020139518 Fan holder
10/03/2002US20020139515 Heat sink with textured regions
10/03/2002US20020139123 Efficiency thermoelectrics utilizing thermal isolation
10/02/2002EP1246376A1 Laser diode matching circuit and method of impedance matching therefor
10/02/2002EP1246326A1 Electronic packages
10/02/2002EP1246325A2 Laser working dielectric substrate and method for working same and semiconductor package and method for manufacturing same
10/02/2002EP1246266A2 Light emission apparatus and method of fabricating the same
10/02/2002EP1246243A2 Semiconductor package and manufacturing method thereof
10/02/2002EP1246242A1 Short-circuit resistant IGBT module
10/02/2002EP1246241A2 Semiconductor package
10/02/2002EP1246240A2 Method and apparatus for forming improved metal interconnects
10/02/2002EP1246239A1 Method of forming dual damascene structure
10/02/2002EP1246236A1 Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
10/02/2002EP1246235A1 Method for encapsulating a chip having a sensitive surface
10/02/2002EP1246230A2 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, semiconductor wafer and method for manufacturing semiconductor device by use of sealing apparatus
10/02/2002EP1245628A1 Composition for preparing substances having nano-pores
10/02/2002EP1245455A2 Electric power distributor for use in motor vehicle
10/02/2002EP1245138A1 Method, facility and device for producing an electrical connecting element, electrical connecting element and semi-finished product
10/02/2002EP1245048A1 Apparatus for current ballasting esd sensitive devices
10/02/2002EP1245047A2 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size
10/02/2002EP1245046A1 Interconnection device and method
10/02/2002EP1245045A1 A semiconductor device having a reduced signal processing time and a method of fabricating the same
10/02/2002EP1244821A1 Articles coated with aluminum nitride by chemical vapor deposition
10/02/2002EP1244724A1 Polyarylene compositions with enhanced modulus profiles
10/02/2002EP1244534A1 Energy-efficient, laser-based method and system for processing target material
10/02/2002EP1116180B1 Method for contacting a circuit chip
10/02/2002EP1099197B1 Device for supplying output data in reaction to input data, method for checking authenticity and method for encrypted data transmission
10/02/2002EP1047744B1 Curable epoxy-based compositions
10/02/2002EP1018291B1 Flexible circuits and carriers and process for manufacture
10/02/2002EP0962123A4 Heat sink mounting assembly for surface mount electronic device packages
10/02/2002EP0912997B1 Rf power package with a dual ground
10/02/2002DE10212629A1 Verfahren zum Herstellen eines Mehrlagen-Keramiksubstrats A method for manufacturing a ceramic multi-layer substrate
10/02/2002DE10211926A1 Heat dissipation structure for integrated circuit in electronic appliance, has space between integrated circuit and circuit board which is filled with solder through holes in circuit board
10/02/2002DE10205122A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
10/02/2002DE10164666A1 Semiconductor device for electrostatic discharge protection comprises transistors having multi-fingered structure, multilayer interconnections separated from one another, pad conductive layer, and contact plugs
10/02/2002DE10140726A1 Electronic component used as a semiconductor wafer comprises a semiconductor chip having contact surfaces of an integrated circuit on its active surface, and a bimetallic strip arranged on the contact surfaces
10/02/2002DE10136152A1 Semiconductor component with numerous discrete raised points on component main side
10/02/2002DE10134100A1 Production of integrated semiconductor circuit comprises forming first electrically insulating layer on semiconductor substrate, applying and structuring mask layer, etching trenches in insulating layer, and further processing
10/02/2002DE10113943A1 Diodenlaserbauelement Diode laser component
10/02/2002DE10113769A1 Semiconductor chip used in control modules or storage modules comprises an elastic film laminated on a main side
10/02/2002DE10113192A1 Semiconductor component for containing semiconductor microchips has a carrier, a microchip made of a semiconductor material to fit on the carrier and a barrier.
10/02/2002DE10112543A1 Integrierte Schaltung mit elektrischen Verbindungselementen Integrated circuit having electrical connecting elements
10/02/2002DE10112414A1 Semiconductor circuit structure, has electronic component integrated in semiconductor body, casing with connection leg and semiconductor body inside and inductive/capacitive component
10/02/2002DE10112264A1 Electric unit for measuring temperature in a heat sink screwed onto a power semiconductor has an electric component linked to the heat sink and a temperature sensor.
10/02/2002DE10111989A1 Process for reducing a plasma-induced charge in a semiconductor circuit used in the manufacture of, e.g. transistors, includes removing the insulating layer using a plasma-promoted dry chemical method
10/02/2002DE10111759A1 Casing structure for use with semiconductor microchips has a floating semiconductor microchip cased by an injection-molded plastic sealing or covering compound.
10/02/2002DE10110999A1 Structure for accommodating electronic component and printed circuit board, links electronic component with external contacts to printed circuit board with contact connection surfaces in a strip conductor structure.
10/02/2002CN2514494Y Rotary colling device for central microprocessor
10/02/2002CN2514493Y Radiating fan with self-radiating action
10/02/2002CN2514492Y Combined radiating fin
10/02/2002CN2514491Y Improved fastener for radiator
10/02/2002CN2514490Y Camera sensor chip encapsulating structure
10/02/2002CN2514405Y Fixing assembly of fixing base for radiating fin of microprocessor
10/02/2002CN2514399Y Temp differential radiator
10/02/2002CN2514398Y Radiator structure
10/02/2002CN2514396Y Low noise host machine of computers
10/02/2002CN1372784A Electronic device with heat generating parts and heat absorbing parts
10/02/2002CN1372676A Secure microcontroller against attacks based on current consumption values
10/02/2002CN1372382A Switch circuit
10/02/2002CN1372381A Switch circuit
10/02/2002CN1372323A Semiconductor memory device and making method thereof
10/02/2002CN1372321A Anti-electrostatic optical cover
10/02/2002CN1372320A Surface installation type chip semiconductor device and making method thereof
10/02/2002CN1372319A Semiconductor component package module unit and programming method thereof
10/02/2002CN1372318A Wire stick tape assembling for semiconductor component and method thereof
10/02/2002CN1372317A Chip heat sink package structure and making method thereof
10/02/2002CN1372316A Cast mould inlaid radiator, semiconductor device using same and making method thereof
10/02/2002CN1372315A Semiconductor device formed by mounting chip on support substraet and support substrate thereof
10/02/2002CN1372314A Wafer package assembling with film substrate
10/02/2002CN1372313A Method for making semiconductor device
10/02/2002CN1372311A Semiconductor chip and package method thereof
10/02/2002CN1372310A Stacket semiconductor with film and film making method thereof
10/02/2002CN1372303A Aggregate dielectric layer for reducing intride consumption
10/02/2002CN1371780A Laser welding device and miniature optical platform
10/02/2002CN1371763A Piezoelectric element and package thereof
10/02/2002CN1091950C Semiconductor device and assembling method thereof
10/02/2002CN1091949C Integrated electro-optic package
10/02/2002CN1091946C Method for forming interlayer insulating film of semiconductor device
10/01/2002US6459945 System and method for facilitating determining suitable material layer thickness in a semiconductor device fabrication process
10/01/2002US6459935 Integrated filter feed-thru
10/01/2002US6459928 Apparatus and method for collecting data useful for determining the parameters of an alert window for timing delivery or ETC signals to a heart under varying cardiac conditions
10/01/2002US6459592 Circuit assembly including VLSI package
10/01/2002US6459584 Fixing frame for positioning heat dispensing device of computers
10/01/2002US6459583 Ready-to-mount heat dissipating assembly
10/01/2002US6459582 Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
10/01/2002US6459581 Electronic device using evaporative micro-cooling and associated methods
10/01/2002US6459563 Method and apparatus for polygonal heat slug
10/01/2002US6459561 Low inductance grid array capacitor
10/01/2002US6459343 Integrated circuit interconnect system forming a multi-pole filter
10/01/2002US6459163 Semiconductor device and method for fabricating the same
10/01/2002US6459162 Encapsulated semiconductor die package
10/01/2002US6459161 Semiconductor device with connection terminals in the form of a grid array
10/01/2002US6459160 Package with low stress hermetic seal
10/01/2002US6459157 Semiconductor device and double-sided multi-chip package
10/01/2002US6459156 Semiconductor device, a process for a semiconductor device, and a process for making a masking database
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