Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2002
10/08/2002US6462428 Semiconductor device and method for manufacturing the same
10/08/2002US6462426 Barrier pad for wafer level chip scale packages
10/08/2002US6462425 Semiconductor device and manufacturing method thereof
10/08/2002US6462424 Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
10/08/2002US6462423 Flip-chip with matched lines and ground plane
10/08/2002US6462422 Intercrossedly-stacked dual-chip semiconductor package
10/08/2002US6462420 Semiconductor chip and semiconductor device having a chip-on-chip structure
10/08/2002US6462419 Semiconductor device and method for manufacturing the same
10/08/2002US6462418 Semiconductor device having improved heat radiation
10/08/2002US6462417 Coherent alloy diffusion barrier for integrated circuit interconnects
10/08/2002US6462416 Gradated barrier layer in integrated circuit interconnects
10/08/2002US6462415 Semiconductor device as an object of thickness reduction
10/08/2002US6462414 Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball pad
10/08/2002US6462413 LDMOS transistor heatsink package assembly and manufacturing method
10/08/2002US6462412 Foldable, flexible laminate type semiconductor apparatus with reinforcing and heat-radiating plates
10/08/2002US6462410 Integrated circuit component temperature gradient reducer
10/08/2002US6462407 Electronic device having a multiplicity of contact bumps
10/08/2002US6462406 Resin-sealed semiconductor device and a configuration thereof which make it possible to decrease the size, thickness, weight and cost of the device.
10/08/2002US6462405 Semiconductor package
10/08/2002US6462404 Multilevel leadframe for a packaged integrated circuit
10/08/2002US6462401 Semiconductor wafer having a bank on a scribe line
10/08/2002US6462400 Chip outline band (COB) structure for integrated circuits
10/08/2002US6462399 Multi-chip module employing a carrier substrate with micromachined alignment structures and method of forming
10/08/2002US6462398 Semiconductor device and semiconductor assembly apparatus for semiconductor device
10/08/2002US6462395 Semiconductor device and method of producing the same
10/08/2002US6462394 Device configured to avoid threshold voltage shift in a dielectric film
10/08/2002US6462392 Micromechanical cap structure and the respective manufacturing method
10/08/2002US6462384 Semiconductor device for ESD protection
10/08/2002US6462381 Silicon-on-insulator (SOI) electrostatic discharge (ESD) protection device with backside contact opening
10/08/2002US6462318 Protective element
10/08/2002US6462284 Semiconductor device and method of manufacture thereof
10/08/2002US6462283 Semiconductor package with central circuit pattern
10/08/2002US6462282 Circuit board for mounting bare chip
10/08/2002US6462274 Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages
10/08/2002US6462271 Capping structure for electronics package undergoing compressive socket actuation
10/08/2002US6462163 A low-molecular-weight polyester formed from a single species of linear aliphatic diol and a single species of dicarboxylic acid with a single species of diisocyanate; impervious to oxygen and moisture; food and drug packaging
10/08/2002US6462108 High Tg potting compound
10/08/2002US6462107 Photoimageable compositions and films for printed wiring board manufacture
10/08/2002US6461970 Method of reducing defects in anti-reflective coatings and semiconductor structures fabricated thereby
10/08/2002US6461967 Material removal method for forming a structure
10/08/2002US6461960 Method of manufacturing a semiconductor device
10/08/2002US6461957 Method of manufacturing semiconductor device
10/08/2002US6461954 High speed heating in hydrogen environment
10/08/2002US6461950 Semiconductor processing methods, semiconductor circuitry, and gate stacks
10/08/2002US6461941 Method of forming capacitor on cell region including forming dummy pattern around alignment key
10/08/2002US6461914 Process for making a MIM capacitor
10/08/2002US6461912 Method of fabricating semiconductor storage device having a capacitor
10/08/2002US6461911 Semiconductor memory device and fabricating method thereof
10/08/2002US6461896 Process for mounting electronic device and semiconductor device
10/08/2002US6461895 Process for making active interposer for high performance packaging applications
10/08/2002US6461893 Method for manufacturing an electronic device
10/08/2002US6461891 Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
10/08/2002US6461889 Method of fabricating semiconductor device with diamond substrate
10/08/2002US6461797 Method and apparatus for selectively programming a semiconductor device
10/08/2002US6461745 Copper foil overcoated with nickel, cobalt and molybdenum alloy; tape automatic bonding
10/08/2002US6461690 Laser marking techniques
10/08/2002US6461225 Local area alloying for preventing dishing of copper during chemical-mechanical polishing (CMP)
10/08/2002US6461136 Apparatus for filling high aspect ratio via holes in electronic substrates
10/08/2002US6460753 Bi-material assembly adhesively bonded at the ends and fabrication method
10/08/2002US6460609 Heat sink for facilitating air flow
10/08/2002US6460608 Heat sink and information processor using heat sink
10/08/2002US6460598 Heat exchanger cast in metal matrix composite and method of making the same
10/08/2002US6460245 Method of fabricating semiconductor chip assemblies
10/03/2002WO2002078417A1 Heat sink and method for manufacturing the same
10/03/2002WO2002078093A1 Reduced mask count process for manufacture of mosgated device
10/03/2002WO2002078088A1 Method for assembling components of different thicknesses
10/03/2002WO2002078087A2 Semiconductor chip having multiple conductive layers in an opening, and method for fabricating same
10/03/2002WO2002078086A2 Power transistor package with integrated flange for surface mount heat removal
10/03/2002WO2002078085A1 Package for electronic part and method of manufacturing the package
10/03/2002WO2002078083A2 In-street integrated circuit wafer via
10/03/2002WO2002078082A2 Electronic structure
10/03/2002WO2002078080A1 Chip module with bond-wire connections with small loop height
10/03/2002WO2002078079A1 Package of semiconductor device and its manufacturing method
10/03/2002WO2002078078A2 Dispensing process for fabrication of microelectronic packages
10/03/2002WO2002078077A1 Method for encapsulating a chip having a sensitive surface
10/03/2002WO2002078076A2 Method for realizing wiring options in an integrated circuit and a corresponding integrated circuit
10/03/2002WO2002078054A2 Integrated circuit package with a capacitor
10/03/2002WO2002078029A1 Support for an electrical circuit in particular an electrical breaker
10/03/2002WO2002077304A1 Heat dissipation member for electronic apparatus and method for producing the same
10/03/2002WO2002077303A1 Method for manufacturing radiating member for electronic equipment
10/03/2002WO2002057361A3 Curing agent for epoxy resins and epoxy resin composition
10/03/2002WO2002052644A9 Thermally enhanced microcircuit package and method of forming same
10/03/2002WO2002051224A3 Multilayered hybrid electronic module
10/03/2002WO2002035607A3 Semiconductor assembly and method for producing semiconductor assemblies of this type
10/03/2002WO2001019889A9 Highly stable packaging substrates and brominated indane derivatives
10/03/2002WO2000047024A3 Multi-layer circuit board assembly for the packaging of semiconductor devices
10/03/2002US20020143092 For use in microprocessor architecture
10/03/2002US20020143091 Used to coat electronic or electrical devices such as semiconductors, diodes, and integrated circuits; free of halogen, phosphorus, and antimony
10/03/2002US20020142999 Topical ophthalmic, otic or nasal drug for therapy of bacterial infections
10/03/2002US20020142628 Shunt power connection for an integrated circuit package
10/03/2002US20020142623 Method of forming insulating film and method of manufacturing semiconductor device
10/03/2002US20020142617 Method for evaluating a wafer cleaning operation
10/03/2002US20020142614 Heat treatment redistributes Cu particles segregated in the Al-Cu alloy layer during the O2-plasma pretreatment, preventing occurrence of a short-circuit failure.
10/03/2002US20020142604 Method for forming aluminum bumps by sputtering and chemical mechanical polishing
10/03/2002US20020142592 Selectively depositing a first metallic passivation layer on the top copper surfaces to prevent Cu oxidation and/or Cu out-diffusion; depositing a final passivation layer; exposing the passivated Cu; selective immersion deposition of Au.
10/03/2002US20020142589 Method of obtaining low temperature alpha-ta thin films using wafer bias
10/03/2002US20020142586 Method of forming dual damascene structure
10/03/2002US20020142585 Reacting a mixture comprising an oxidizable siloxane and an oxidizable compound with a tertiarybutyl, tertiarybutoxy, furfuryl, furfuryloxy, or neopentyl group that decomposes to gases that leave voids when the material is annealed
10/03/2002US20020142583 Forming a conductive barrier layer of a metal nitride while continuously reducing the supply of nitrogen source gas; and electroplating a metal layer directly on a top surface of the barrier layer.
10/03/2002US20020142581 Assembly including semiconductor chip, conductive pad, conductive trace, connection joint, and insulative adhesive; conductive trace includes routing line and pillar; connection joint contacts and electrically connects routing line and pad
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