Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2002
10/10/2002US20020145204 Semiconductor device
10/10/2002US20020145203 Method and structure for economical high density chip carrier
10/10/2002US20020145202 Semiconductor device fabricated on multiple substrates and method for fabricating the same
10/10/2002US20020145201 Method and apparatus for making air gap insulation for semiconductor devices
10/10/2002US20020145200 Spin-on cap layer, and semiconductor device containing same
10/10/2002US20020145199 Semiconductor device and method for fabricating the same
10/10/2002US20020145198 Semiconductor device and its manufacturing method
10/10/2002US20020145197 Wiring substrate
10/10/2002US20020145196 Cross guard-ring structure to protect the chip crack in low dielectric constant and copper process
10/10/2002US20020145195 Composite material, and manufacturing method and uses of same
10/10/2002US20020145194 Diamond heat spreading and cooling technique for integrated circuits
10/10/2002US20020145193 Method to reduce number of wire-bond loop heights versus the total quanity of power signal rings
10/10/2002US20020145192 Heat-resisting high-power diode
10/10/2002US20020145191 Semiconductor element, connection structure thereof, semiconductor device using a plurality of such elements and processes for making the same
10/10/2002US20020145190 Arrangement and method of arrangement of stacked dice in an integrated electronic device
10/10/2002US20020145189 Press-fit diode for universal mounting
10/10/2002US20020145188 Flat semiconductor device and power converter employing the same
10/10/2002US20020145186 Method of forming HSQFN type package
10/10/2002US20020145185 Critically aligned optical MEMS dies for large packaged substrate arrays and method of manufacture
10/10/2002US20020145182 Microelectronic packages having an array of resilient leads and methods therefor
10/10/2002US20020145181 Method for integrated circuit packaging
10/10/2002US20020145180 Semiconductor apparatus with decoupling capacitor
10/10/2002US20020145178 Matrix form semiconductor package substrate having an electrode of serpentine shape and method for forming
10/10/2002US20020145177 Semiconductor device
10/10/2002US20020145176 Semiconductor device
10/10/2002US20020145175 Inductance element and semiconductor device
10/10/2002US20020145172 High withstand voltage semiconductor device
10/10/2002US20020145165 Semiconductor device having electrostatic discharge protector and fabricating method thereof
10/10/2002US20020145164 Device and method of low voltage SCR protection for high voltage failsafe ESD applications
10/10/2002US20020145163 Electrostatic discharge protection apparatus
10/10/2002US20020145156 Semiconductor device and method for manufacturing the same
10/10/2002US20020145140 Substrate device manufacturing method and substrate device, electrooptical device manufacturing method and electrooptical device and electronic unit
10/10/2002US20020145138 Semiconductor integrated circuit device
10/10/2002US20020144909 Palladium plating solution
10/10/2002US20020144897 Surface mount type condenser
10/10/2002US20020144840 Leadframe package with dummy chip
10/10/2002US20020144809 Laminated heat transfer device and method of producing thereof
10/10/2002US20020144804 Thermal transfer device and working fluid therefor including a kinetic ice inhibitor
10/10/2002US20020144802 Evaporative cooling device and method
10/10/2002US20020144775 Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier
10/10/2002US20020144720 Method and apparatus for selective removal of material from wafer alignment marks
10/10/2002US20020144710 Method for cleaning semiconductor wafer after chemical mechanical polishing on copper wiring
10/10/2002US20020144396 Method of making an integrated circuit package
10/10/2002DE10154771A1 Silicon composition low dielectric film, semiconductor device and method for producing low dielectric films
10/10/2002DE10117172A1 Detection of optically transparent substrate wafer involves providing surface of transparent wafer with coating of opaque material such as metal or silicon monitoring light flow to sensor
10/10/2002DE10115613A1 Integrated circuit, especially memory component, has at least two test circuits that can be connected to connector field via selection switch
10/10/2002DE10114825C1 Determining operating temperature in semiconducting component involves interpolating between calibration values obtained with multivibrator depending on current measurement value
10/10/2002DE10114231A1 Supporting element production used for integrating into integrated circuit component comprises providing photoresist coating on support foil facing away from copper layer
10/10/2002CA2442985A1 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
10/09/2002EP1248324A2 Terminal for electrical connector and terminal blank with a carrier
10/09/2002EP1248298A1 Stitch and select implementation in twin monos array
10/09/2002EP1248297A2 Inductance element and semiconductor device
10/09/2002EP1248295A2 Semiconductor element, connection structure thereof, semiconductor device using a plurality of such elements and processes for making the same
10/09/2002EP1248291A2 Adhesive sheet with conductor bodies for flip-chip mounting
10/09/2002EP1248128A2 Optical connector, optical element holding structure, and structure of a mount section of an optical connector
10/09/2002EP1247338A2 Component with drain for pyroelectrical voltages and a method for production thereof
10/09/2002EP1247298A2 Electronic device and method using crystalline, conductive regions and amorphous, insulating regions of a layer
10/09/2002EP1247297A2 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths
10/09/2002EP1247294A1 Packaging of integrated circuits and vertical integration
10/09/2002EP1247293A1 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
10/09/2002EP1247292A1 Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst
10/09/2002EP1055285B1 Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves
10/09/2002EP0852810B1 Semiconductor component with insulating housing
10/09/2002EP0721661B1 Method of manufacturing a semiconductor device for surface mounting, and semiconductor device for surface mounting
10/09/2002CN2515804Y Enclosed structure with low change-over noise
10/09/2002CN2515803Y Flip projecting block mat allocation
10/09/2002CN2515802Y Electric power electronic power device gate electrode device body
10/09/2002CN2515801Y Dry passive environmental protection heat-conducitng pipe radiator
10/09/2002CN2515800Y Cooling radiating assembly of central processor for notebook computer
10/09/2002CN2515799Y 散热器 Heat sink
10/09/2002CN2515798Y Vane device for radiating fan
10/09/2002CN2515797Y Cooling device for heating circuit
10/09/2002CN1373938A Energy conditioning circuit assembly
10/09/2002CN1373922A Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
10/09/2002CN1373903A Method of constructing electronic assembly having indium thermal couple and electronic assembly having indium thermal couple
10/09/2002CN1373902A Protective layer for semiconductor device
10/09/2002CN1373901A Fabrication process for dishing-free c damascene structures
10/09/2002CN1373534A Socket for spheric grid array package
10/09/2002CN1373519A Semiconductor device and mfg. method thereof
10/09/2002CN1373513A Voltage control element for preventing electrostatic discharge and its protecting circuit
10/09/2002CN1373512A Interlink structure with accurate conductor
10/09/2002CN1373511A External power supply ring with multiple slender tapes for decreasing voltage drop of integrated circuit
10/09/2002CN1373510A Cooling device for cooling heat-generating element and electronic apparatus comprising same
10/09/2002CN1373509A Semiconductor with metallic base
10/09/2002CN1373508A Structure of hung electronic device
10/09/2002CN1373480A Conductive and resistance material with electrical stability for electronic apparatus
10/09/2002CN1092400C Method for making semiconductor devices having electroplated leads
10/09/2002CN1092399C Method for mfg. semiconductor device
10/09/2002CN1092398C Crack-resistant semiconductor package and fabrication method thereof and fabrication apparatus thereof
10/09/2002CN1092397C High-performance low-cost multi-chip module package
10/08/2002US6463570 Apparatus and method for verifying process integrity
10/08/2002US6463267 High frequency power amplifying apparatus having amplifying stages with gain control signals of lower amplitudes applied to earlier preceding stages
10/08/2002US6462976 Conversion of electrical energy from one form to another, and its management through multichip module structures
10/08/2002US6462960 Complex adhesive sheet is provided at the joint between a metal stem and a metal cap.
10/08/2002US6462952 Structure and method for constructing circuit module suitable for hand-held electronic equipment
10/08/2002US6462951 Securing heat sinks to electronic components
10/08/2002US6462950 Stacked power amplifier module
10/08/2002US6462945 Apparatus and method for cooling a heat generating component
10/08/2002US6462528 Method and apparatus for probing a conductor of an array of closely-spaced conductors
10/08/2002US6462522 Transistor pattern for voltage regulator
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