| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 12/19/2013 | DE102012105110A1 Montageträger und Verfahren zur Montage eines Montageträgers auf einem Anschlussträger Mounting bracket and method for mounting a mounting bracket on a connection carrier |
| 12/19/2013 | DE102010014940B4 Leistungshalbleitermodul mit Anschlusselementen Power semiconductor module with connecting elements |
| 12/19/2013 | DE102009057145B4 Druckkontaktiertes Leistungshalbleitermodul mit teilweise bandartigen Lastanschlusselementen Pressure-contacted power semiconductor module with partial band-like load connection elements |
| 12/19/2013 | DE102008046864B4 Halbleiterstruktur mit Kondensator und Herstellungsverfahren dafür Semiconductor structure with capacitor and manufacturing method therefor |
| 12/18/2013 | EP2675256A1 Power converter |
| 12/18/2013 | EP2674975A1 Interface for communication between voltage domains |
| 12/18/2013 | EP2674974A1 Semiconductor structure with improved noise isolation between a seal ring and active circuits |
| 12/18/2013 | EP2674973A1 Power semiconductor module |
| 12/18/2013 | EP2674972A1 Cooling device and power conversion device |
| 12/18/2013 | EP2674971A1 Method for manufacturing heat dissipating plate for semiconductor module, said heat dissipating plate, and semiconductor module using said heat dissipating plate |
| 12/18/2013 | EP2674970A2 Integrated circuit build-up package and method of manufacturing the same with adhesive die mounting to a dielectric layer |
| 12/18/2013 | EP2673803A2 Power semiconductor module |
| 12/18/2013 | EP2673802A1 Encapsulated component |
| 12/18/2013 | EP2673801A1 Contact system comprising a connecting means and method |
| 12/18/2013 | EP2673586A1 Heat-absorbing device with phase-change material |
| 12/18/2013 | EP2673403A1 Insulated metal substrate |
| 12/18/2013 | EP2545503B1 Electronic device having a chip and method for manufacturing by coils |
| 12/18/2013 | EP2042260B1 Method and paste for contacting metal surfaces |
| 12/18/2013 | EP1721497B1 Improved flip chip mmic on board performance using periodic electromagnetic bandgap structures |
| 12/18/2013 | EP1465246B1 Method for producing electrical through hole interconnects |
| 12/18/2013 | EP1402572B1 Method for producing miniature amplifier and signal processing unit |
| 12/18/2013 | EP0888642B1 Semiconductor device |
| 12/18/2013 | CN203353032U Electronic assembly |
| 12/18/2013 | CN203353020U Heat radiation structure for inverter power supply circuit module |
| 12/18/2013 | CN203351598U Embedded gate grounded NMOS triggered silicon controlled rectifier transient voltage inhibitor |
| 12/18/2013 | CN203351591U Flexible substrate packaging structure |
| 12/18/2013 | CN203351590U Trimming structure for reducing fuse spines |
| 12/18/2013 | CN203351589U Metal-oxide-metal capacitor |
| 12/18/2013 | CN203351588U High power consumption type chip packaging structure |
| 12/18/2013 | CN203351587U Semiconductor device |
| 12/18/2013 | CN203351586U Packaging structure |
| 12/18/2013 | CN203351585U Intelligent power module |
| 12/18/2013 | CN203351584U Camera module group packaging structure |
| 12/18/2013 | CN203351583U Micro-channel radiator |
| 12/18/2013 | CN203351582U Novel thyristor valve radiator |
| 12/18/2013 | CN203351581U Heat dissipation device |
| 12/18/2013 | CN203351580U Semiconductor radiator |
| 12/18/2013 | CN203351579U Heavy current field effect transistor |
| 12/18/2013 | CN203351578U Field-effect tube integrated with thermistor |
| 12/18/2013 | CN203351577U Integrated circuit package structure, LED drive circuit package structure and power source conversion integrated circuit package structure |
| 12/18/2013 | CN203351576U Full compression joint type insulated gate bipolar transistor device |
| 12/18/2013 | CN203351575U Laminated body, laminated board, multilayer laminated board and printed wiring board |
| 12/18/2013 | CN103460817A Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate |
| 12/18/2013 | CN103460816A Electronic assembly |
| 12/18/2013 | CN103460382A Induced thermal gradients |
| 12/18/2013 | CN103460381A Improvements in or relating to thyristor clamped assemblies |
| 12/18/2013 | CN103460380A Stacked via structure for metal fuse applications |
| 12/18/2013 | CN103460379A Semiconductor chip with supportive terminal pad |
| 12/18/2013 | CN103460378A Cooling device for an electronic module of a household appliance, and assembly and domestic appliance comprising a cooling device |
| 12/18/2013 | CN103460377A High-frequency package |
| 12/18/2013 | CN103460376A Electronic component and manufacturing method for the electronic component |
| 12/18/2013 | CN103460362A Electronic module and method for the production thereof |
| 12/18/2013 | CN103460351A Cu alloy film, and display device and electronic device each equipped with same |
| 12/18/2013 | CN103460339A Bonding-surface fabrication method, bonded substrate, substrate bonding method, bonding-surface fabrication device, and substrate assembly |
| 12/18/2013 | CN103459654A Copper-titanium alloy sputtering target, semiconductor wiring line formed by the sputtering target, and semiconductor element and device each equipped with semiconductor wiring line |
| 12/18/2013 | CN103459454A Resin composition, cured substance therefrom, and photosemiconductor device using same |
| 12/18/2013 | CN103456774A Semiconductor device having non-orthogonal element |
| 12/18/2013 | CN103456746A Array substrate, manufacturing method thereof and display device |
| 12/18/2013 | CN103456736A Semiconductor device and method of forming the same |
| 12/18/2013 | CN103456729A LED display screen |
| 12/18/2013 | CN103456723A Ferroelectric crystal film, electronic component, manufacturing method of ferroelectric crystal film, and manufacturing apparatus therefor |
| 12/18/2013 | CN103456722A Latch-up robust scr-based devices |
| 12/18/2013 | CN103456721A Esd-robust i/o driver circuit |
| 12/18/2013 | CN103456720A Esd protection device for circuits with multiple power domains |
| 12/18/2013 | CN103456719A Electronic device radiation-resistant reinforcing packaging structure |
| 12/18/2013 | CN103456718A Metal interconnecting wire electromigration test structure |
| 12/18/2013 | CN103456717A Measurement structure and method for resistance of active region and polysilicon bevels on semiconductor device |
| 12/18/2013 | CN103456716A Three-dimensional multi-chip stacking module and manufacturing method thereof |
| 12/18/2013 | CN103456715A Intermediary base material and manufacturing method thereof |
| 12/18/2013 | CN103456714A Semiconductor device and method of manufacturing thereof |
| 12/18/2013 | CN103456713A Switching circuit |
| 12/18/2013 | CN103456712A Novel bead for 2.5d/3d chip packaging application |
| 12/18/2013 | CN103456711A Fin-type anti-fuse structure and manufacturing method thereof |
| 12/18/2013 | CN103456710A Mos device and manufacturing method thereof |
| 12/18/2013 | CN103456709A Integrated circuit based transformer |
| 12/18/2013 | CN103456708A Devices and methods for improved reflective electron beam lithography |
| 12/18/2013 | CN103456707A Semiconductor packaging structure and manufacturing method |
| 12/18/2013 | CN103456706A Discrete semiconductor device package and manufacturing method |
| 12/18/2013 | CN103456705A Structure and method for packaging stackable integrated chips |
| 12/18/2013 | CN103456704A Design scheme for connector site spacing and resulting structures |
| 12/18/2013 | CN103456703A Semiconductor package and fabrication method thereof |
| 12/18/2013 | CN103456702A Corrosion preventing method with water and electricity separated and liquid cooling radiator |
| 12/18/2013 | CN103456701A Integrated circuit die assembly with heat spreader |
| 12/18/2013 | CN103456700A Quick-change cooling and fixing device for thyristors |
| 12/18/2013 | CN103456699A Integrated circuit packaging structure and packaging method thereof |
| 12/18/2013 | CN103456698A Chip package structure and chip packaging method |
| 12/18/2013 | CN103456697A Isolation rings for packages and the method of forming the same |
| 12/18/2013 | CN103456696A Package substrate and method of manufacturing the same |
| 12/18/2013 | CN103456695A Board separation apparatus and operating method thereof |
| 12/18/2013 | CN103456682A Semiconductor processing method and semiconductor structure |
| 12/18/2013 | CN103456681A Method and apparatus for back end of line semiconductor device processing |
| 12/18/2013 | CN103456679A Interconnection structure and manufacturing method thereof |
| 12/18/2013 | CN103456678A Barrier stack structure and method for forming same |
| 12/18/2013 | CN103456677A Semiconductor device and manufacturing method thereof |
| 12/18/2013 | CN103456650A Eyepoint training method for wire bond and related semiconductor processing operation |
| 12/18/2013 | CN103456647A Integrated circuit packaging system with substrate and method of manufacture thereof |
| 12/18/2013 | CN103456645A Packaging-after etching three-dimensional system-on-chip upright stacking packaging structure and technology method |
| 12/18/2013 | CN103456644A Sleadframe for integrated circuit die packaging in a molded package and a method for preparing such a leadframe |
| 12/18/2013 | CN103456643A Ic carrier plate and manufacturing method thereof |
| 12/18/2013 | CN103456601A Capacitor for interposers and methods of manufacture thereof |