H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2002
10/22/2002	US6467676 A hydroxyl-containing fluxing precursor compound is added to the encapsulant composition to react with the anhydride curing agent to produce an active fluxing agent under typical reflow conditions.
10/22/2002	US6467674 Method of manufacturing semiconductor device having sealing film on its surface
10/22/2002	US6467666 Method of producing a semiconductor device
10/22/2002	US6467295 Refrigerated cooling apparatus for semiconductor device
10/22/2002	CA2233385C Electronic-circuit assembly and manufacturing method thereof
10/17/2002	WO2002082577A1 Microwave circuit
10/17/2002	WO2002082549A1 Semiconductor integrated circuit device and its manufacturing method
10/17/2002	WO2002082543A1 Semiconductor device
10/17/2002	WO2002082540A1 Semiconductor device, method of manufacture thereof, and semiconductor substrate
10/17/2002	WO2002082539A2 A radio frequency (rf) device and its method of manufacture
10/17/2002	WO2002082538A1 Integrated inductance
10/17/2002	WO2002082537A1 High frequency integrated circuit (hfic) microsystems assembly and method for fabricating the same
10/17/2002	WO2002082536A2 Laminated heat transfer device and method of producing thereof
10/17/2002	WO2002082535A1 Isolated thermal interface
10/17/2002	WO2002082531A2 Structure and method for determining edges of regions in a semiconductor wafer
10/17/2002	WO2002082527A1 Method of forming electrical connections
10/17/2002	WO2002082525A1 Semiconductor device and production method therefor
10/17/2002	WO2002082515A1 Semiconductor structure and device including a carbon film
10/17/2002	WO2002082473A2 Thick film paste systems for circuits on diamonds substrates
10/17/2002	WO2002082389A2 Extraction of a private datum to authenticate an integrated circuit
10/17/2002	WO2002082364A1 Semiconductor device and its manufacturing method
10/17/2002	WO2002081996A2 Orientation-independent thermosyphon heat spreader
10/17/2002	WO2002081981A2 Thermoelectric device for dna genomic and proteonic chips and thermo-optical seitching circuits
10/17/2002	WO2002081592A1 Extrudable bridged grease-like heat radiating material, container sealingly filled with the material, method of manufacturing the container, and method of radiating heat by the use thereof
10/17/2002	WO2002081565A1 Polymer resin for ion beam or ion injection treatment to give surface conductiveness
10/17/2002	WO2002081190A1 Graphite article having predetermined anisotropic characteristics and process therefor
10/17/2002	WO2002081187A2 Anisotropic thermal solution
10/17/2002	WO2002067315A8 Processes of forming thermal transfer materials, and thermal transfer materials
10/17/2002	WO2002065548A3 Integrated circuit arrangement consisting of a flat substrate
10/17/2002	WO2002057333A3 Epoxy resin composition for semiconductor encapsulation
10/17/2002	WO2002023628A3 Semiconductor component and method of manufacturing
10/17/2002	US20020151228 Self-coplanarity bumping shape for flip chip
10/17/2002	US20020151204 Contact for PGA and PGA socket
10/17/2002	US20020151195 Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrate
10/17/2002	US20020151194 Microelectronic spring with additional protruding member
10/17/2002	US20020151190 Semiconductor device having a multilayer interconnection structure
10/17/2002	US20020151189 Chip scale package with flip chip interconnect
10/17/2002	US20020151174 Wiring line assembly and method for manufacturing the same, and thin film transistor array substrate having the wiring line assembly and method for manufacturing the same
10/17/2002	US20020151171 Semiconductor device and manufacturing method therefor, circuit substrate, and electronic apparatus
10/17/2002	US20020151169 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them
10/17/2002	US20020151166 Integrated circuits having reduced step height by using dummy conductive lines
10/17/2002	US20020151161 Method for forming conductive film pattern, and electro-optical device and electronic apparatus
10/17/2002	US20020151150 Capacitor and method for forming same
10/17/2002	US20020151137 Method for semiconductor device planarization
10/17/2002	US20020151131 Method of forming minute pattern and method of manufacturing semiconductor device
10/17/2002	US20020151113 Apparatus and method for suppressing false resonances in fiber optic modulators
10/17/2002	US20020151112 Semiconductor substrate and land grid array semiconductor package using same and fabrication methods thereof
10/17/2002	US20020151111 P-connection components with frangible leads and bus
10/17/2002	US20020151110 Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
10/17/2002	US20020151109 Coils integrated in IC-package
10/17/2002	US20020151106 Thermosetting resin composition and semiconductor device using the same
10/17/2002	US20020151104 Semiconductor device and method for producing the same
10/17/2002	US20020151103 Semiconductor device and method of manufacturing the same
10/17/2002	US20020151102 Stacked semiconductor package structure having films and method for manufacturing the films
10/17/2002	US20020151093 Barrier layer integrity test
10/17/2002	US20020151090 Integrated inductive circuits
10/17/2002	US20020150743 Method for manufacturing ceramic substrate and non-fired ceramic substrate
10/17/2002	US20020150740 Cover with gapped adhesive preform
10/17/2002	US20020150682 High pressure plasma vapor deposition
10/17/2002	US20020150069 Mobile station supervision of the forward dedicated control channel when in the discontinuous transmission mode
10/17/2002	US20020149920 Semiconductor device incorporating module structure
10/17/2002	US20020149919 Multi-chip module and fabricating method thereof
10/17/2002	US20020149917 Electronic component with a semiconductor chip, and method of producing the electronic component
10/17/2002	US20020149913 Cooling unit for cooling heat generating component and electronic apparatus containing cooling unit
10/17/2002	US20020149896 Thermoelectric module and method of producing the same
10/17/2002	US20020149391 Antifuse reroute of dies
10/17/2002	US20020149312 High power radiation emitter device and heat dissipating package for electronic components
10/17/2002	US20020149298 Electronic component and method of production thereof
10/17/2002	US20020149122 Alignment mark and aligning method using the same
10/17/2002	US20020149121 Base interconnection substrate, manufacturing method thereof, semiconductor device and manfacturing method thereof
10/17/2002	US20020149120 Semiconductor device having TEG elements
10/17/2002	US20020149119 Semiconductor device
10/17/2002	US20020149118 Semiconductor device and bump formation method
10/17/2002	US20020149117 Semiconductor device and its manufacturing method
10/17/2002	US20020149116 Integrated circuit device and method for forming the same
10/17/2002	US20020149115 Bonding pad and method for manufacturing it
10/17/2002	US20020149113 Lead-free solder structure and method for high fatigue life
10/17/2002	US20020149112 Selectively increased interlevel capacitance
10/17/2002	US20020149111 Interconnect exhibiting reduced parasitic capacitance variation
10/17/2002	US20020149109 A semiconductor device including damascene wiring and a manufacturing method thereof
10/17/2002	US20020149108 Low-loss coplanar waveguides and method of fabrication
10/17/2002	US20020149106 Method of eliminating uncontrolled voids in sheet adhesive layer
10/17/2002	US20020149105 Flip chip type semiconductor device and method of fabricating the same
10/17/2002	US20020149104 Integrated circuit package configuration having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body
10/17/2002	US20020149103 Multi-chip semiconductor package
10/17/2002	US20020149102 Structure and method for fabrication of a leadless multi-die carrier
10/17/2002	US20020149100 Vertically mountable interposer, assembly and method
10/17/2002	US20020149099 Semiconductor device and package, and method of manufacture therefor
10/17/2002	US20020149098 Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate
10/17/2002	US20020149096 Electronic device sealed under vacuum containing a getter and method of operation
10/17/2002	US20020149094 Semiconductor device
10/17/2002	US20020149093 Method for manufacturing a semiconductor device
10/17/2002	US20020149092 Carrier frame and semiconductor package including carrier frame
10/17/2002	US20020149091 Leadframe-based chip scale package
10/17/2002	US20020149090 Lead frame and semiconductor package
10/17/2002	US20020149088 Inductance device formed on semiconductor substrate
10/17/2002	US20020149086 Semiconductor device
10/17/2002	US20020149085 Method of manufacturing air gap in multilevel interconnection
10/17/2002	US20020149083 Semiconductor device having capacitor which assures sufficient capacity without requiring large space and method of producing the same
10/17/2002	US20020149082 Semiconductor device and method for fabricating the same

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