Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2002
10/17/2002US20020149079 Semiconductor device and process for its manufacture to increase threshold voltage stability
10/17/2002US20020149077 Semiconductor chip with internal ESD matching
10/17/2002US20020149075 Solid-state image pickup apparatus and fabricating method thereof
10/17/2002US20020149063 N-channel metal oxide semiconductor (NMOS) driver circuit and method of making same
10/17/2002US20020149045 Semiconductor device and method of fabricating the same
10/17/2002US20020149034 Semiconductor chip and multi-chip module
10/17/2002US20020149027 Semiconductor device and its manufacture, and semiconductor device packaging structure
10/17/2002US20020149012 Semiconductor device
10/17/2002US20020148998 Potassium hypochlorite, hydrofluoric acid and deionized water
10/17/2002US20020148979 Methods and compositions for ionizing radiation shielding
10/17/2002US20020148946 Stacked structure of an image sensor and method for manufacturing the same
10/17/2002US20020148897 Descriptor for identifying a defective die site and methods of formation
10/17/2002US20020148640 Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured
10/17/2002US20020148639 Multi-layer substrates and fabrication processes
10/17/2002US20020148637 High performance dense wire for printed circuit board
10/17/2002US20020148635 Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
10/17/2002US20020148630 Plastic integrated circuit package and method and leadframe for making the package
10/17/2002US20020148603 Heat-dissipating device for electronic components
10/17/2002US20020148596 Cooling device for an electronic component and cooling system with such cooling devices
10/17/2002US20020148595 Heatsink, method of manufacturing the same and cooling apparatus using the same
10/17/2002US20020148112 Encapsulation method for ball grid array semiconductor package
10/17/2002DE10216080A1 Semiconducting component for integrated CMOS circuit has first and second metal conductors connecting low impedance region to supply and earth connection surfaces
10/17/2002DE10213556A1 Semiconductor device includes gap formed between wirings on substrate and filled with gas
10/17/2002DE10212917A1 Semiconductor integrated circuit layout method involves outputting wiring connecting terminal of circuit blocks as wiring pattern for mask manufacture, when antenna ratio is smaller than reference value
10/17/2002DE10205408A1 Semiconductor module comprises a housing closed on one side by a metallic heat conducting base which is connected to a metallic coated, electrically insulating heat conducting ceramic layer via a solder layer
10/17/2002DE10204438A1 Halbleitervorrichtung Semiconductor device
10/17/2002DE10156769A1 Leistungshalbleitereinrichtung Power semiconductor device
10/17/2002DE10134979A1 Integrated semiconductor chip having an active front side with semiconductor structures and contact connections and a passive/active rear side with/without semiconductor structures
10/17/2002DE10134943A1 Electronic power component comprises a semiconductor chip having contact surfaces of source contacts on its active surface and a gate contact
10/17/2002DE10134099A1 Production of an integrated semiconductor circuit comprises forming conducting pathways on an electrically insulating layer arranged on a semiconductor substrate, and successively forming a first and a second covering layer
10/17/2002DE10119782C1 Security data read-out protection method for IC with initiation of protection function by detecting current through conductive surfaces of IC upon application of given voltage
10/17/2002DE10118630A1 Production of an optoelectronic semiconductor component comprises preparing sintered glass blanks, applying an adhesive to the surfaces of the blank to be connected, fixing both blanks in a tool, and forming a mechanical composite
10/17/2002DE10118231A1 Optoelectronic component arrangement comprises an optoelectronic component arranged on a support element, a closed dam on the support element and surrounding the optoelectronic component, and a casting composition arranged inside a dam
10/17/2002DE10117775A1 Power semiconductor module used in power electronics comprises a semiconductor chip arranged on a flat electrode connected to a base plate (11) via an insulating intermediate layer having air holes
10/17/2002DE10116069A1 Elektronisches Bauteil mit einem Halbleiterchip und Verfahren zu seiner Herstellung Electronic component having a semiconductor chip and method for its preparation
10/17/2002DE10114767A1 Verfahren zur Realisierung von Verdrahtungsoptionen bei einem integrierten Schaltkreis und integrierter Schaltkreis A process for the realization of wiring options in an integrated circuit and integrated circuit
10/17/2002CA2443691A1 Thermoelectric device for dna genomic and proteonic chips and thermo-optical switching circuits
10/16/2002EP1250033A2 Printed circuit board and electronic component
10/16/2002EP1249874A2 Light emitting device
10/16/2002EP1249870A2 Semiconductor device
10/16/2002EP1249869A2 Arrangement for cooling a power semiconductor device
10/16/2002EP1249868A1 Cooling device for an electronic component as well as cooling system using those cooling devices
10/16/2002EP1249867A2 A metal barrier for copper interconnects that incorporates silicon in the metal barrier or at the copper/metal barrier interface
10/16/2002EP1249865A2 Multi-layered barrier metal thin films for Cu interconnect by ALCVD
10/16/2002EP1249863A1 Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it
10/16/2002EP1249787A1 An IC module for a portable electronic device
10/16/2002EP1249057A2 Flexible compliant interconnect assembly
10/16/2002EP1249042A1 Personalized hardware
10/16/2002EP1249041A1 Organic flip chip packages with an array of through hole pins
10/16/2002EP1249025A1 Coil and coil system to be integrated in a microelectronic circuit, and a microelectronic circuit
10/16/2002EP1249004A1 Method to manufacture a smart label inlet web and a smart label inlet web
10/16/2002EP1114834B1 Epoxy resin composition and process for producing silane-modified epoxy resin
10/16/2002EP0729652B1 Method for fabricating a contact structure for interconnections, interposer, semiconductor assembly
10/16/2002EP0719451B1 Filling holes and the like in substrates
10/16/2002CN2517018Y Improved structure of cooling fin
10/16/2002CN2517017Y Combined heat sink fins
10/16/2002CN2517016Y Fastening structure of cover-type heat sink
10/16/2002CN2517015Y Cooling module device
10/16/2002CN1374993A Electronic tag assembly and method therefor
10/16/2002CN1374705A Thin film transistor substrate and its producing method
10/16/2002CN1374699A Semi-conductor device and its producing method
10/16/2002CN1374698A Semi-conductor apparatus and its pattern wiring method
10/16/2002CN1374697A Resin sealing semi-conductor device and its producing method
10/16/2002CN1374696A Lead wire holder
10/16/2002CN1374695A Semiconductor package with built-in heat dissipating block
10/16/2002CN1374694A Insulation substrate for semi-conductor and power modular
10/16/2002CN1374693A Semiconductor package with heat dissipating structure
10/16/2002CN1374574A Hot-fin heater exchanger
10/16/2002CN1092843C 半导体器件封装 The semiconductor device package
10/16/2002CN1092841C Chip-type semiconductor package and fabrication method thereof
10/15/2002USRE37882 Semiconductor device manufacturing method
10/15/2002US6466446 Integrated circuit package with diamond heat sink
10/15/2002US6466445 Clip for heat sink
10/15/2002US6466444 Heat sink
10/15/2002US6466443 Heat sink fastener with pivotable securing means
10/15/2002US6466441 Cooling device of electronic part having high and low heat generating elements
10/15/2002US6466124 Thin film resistor and method for forming the same
10/15/2002US6466112 Coaxial type signal line and manufacturing method thereof
10/15/2002US6466101 Microstrip line-waveguide converter structure, integrated circuit package for high frequency signals provided with this converter structure, and manufacturing method therefor
10/15/2002US6466053 Antifuse reroute of dies
10/15/2002US6465898 Bonding alignment mark for bonds over active circuits
10/15/2002US6465897 Method for photo alignment after CMP planarization
10/15/2002US6465896 Coils integrated in IC-package
10/15/2002US6465895 Bonding pad structures for semiconductor devices and fabrication methods thereof
10/15/2002US6465894 Semiconductor device having bed structure underlying electrode pad
10/15/2002US6465893 Stacked chip assembly
10/15/2002US6465892 Interconnect structure for stacked semiconductor device
10/15/2002US6465891 Integrated-circuit package with a quick-to-count finger layout design on substrate
10/15/2002US6465890 Integrated circuit package having offset segmentation of package power and/or ground planes and methods for reducing delamination in integrated circuit packages
10/15/2002US6465889 Improving the dimensional accuracy of trenches and, hence, the width of metal lines, in damascene interconnection structures
10/15/2002US6465887 Single crystal transition metal on a barrier film comprising a first layer of elemental metal atoms and a second layer of a metal halide, especially of barium, strontium or cesium
10/15/2002US6465886 Semiconductor device having circuit pattern and lands thereon
10/15/2002US6465885 Positioning of soldering pads in semiconductor diode package
10/15/2002US6465883 Capsule for at least one high power transistor chip for high frequencies
10/15/2002US6465882 Integrated circuit package having partially exposed conductive layer
10/15/2002US6465881 Compression bonded type semiconductor device
10/15/2002US6465879 Respective bumps are brought in direct contact with respective circuit electrodes, and diffusion bonding is caused to occur by applying ultrasonic vibration and a load from the side of the semiconductor
10/15/2002US6465878 Compliant microelectronic assemblies
10/15/2002US6465877 Semiconductor package including flex circuit, interconnects and dense array external contacts
10/15/2002US6465876 Semiconductor device and lead frame therefor
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