Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2002
10/23/2002CN2518223Y Wafer packing body structure
10/23/2002CN2518222Y Fixed structure of retaining bracket of CPU radiator
10/23/2002CN2518221Y Semiconductor structured base plate
10/23/2002CN2518220Y Argon arc welding free pressure connecting silicon component
10/23/2002CN2518219Y Combined holddown of rectifier cell
10/23/2002CN2518146Y Radiator able to increase radiation efficiency
10/23/2002CN2518145Y Improved structure of CPU radiator support
10/23/2002CN1376007A Electronic circuit unit
10/23/2002CN1375929A Small electronic element
10/23/2002CN1375875A Semiconductor device and its mfg. method
10/23/2002CN1375872A Memory module with laminated chips and its making process
10/23/2002CN1375871A Semiconductor device and mfg. method for same
10/23/2002CN1375870A Semiconductor device and its making method
10/23/2002CN1375869A Semiconductor device and its making method
10/23/2002CN1375868A Moulded two-phase cooling assembly and its mfg. method
10/23/2002CN1375867A Radiating structure of integrated circuit (IC)
10/23/2002CN1375866A Sheet material for forming chip protection film and method for making semiconductor chip
10/23/2002CN1375521A Thermal-setting resin composition and semiconcutor apparatus using same
10/23/2002CN1093319C Semiconductor device, ferroelectric capacitor, and process for forming the same
10/22/2002US6470133 Integrated circuit electronic equipment and method of assembly which uses said integrated circuit
10/22/2002US6470103 Semiconductor parts and semiconductor mounting apparatus
10/22/2002US6469903 Flexible printed circuit and semiconductor device
10/22/2002US6469898 Heat dissipating device
10/22/2002US6469897 Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same
10/22/2002US6469895 Integrated circuit mounting structure including a switching power supply
10/22/2002US6469894 Apparatus for cooling an electronic component and electronic device comprising the apparatus
10/22/2002US6469893 Direct heatpipe attachment to die using center point loading
10/22/2002US6469886 Monolithic integrated capacitor
10/22/2002US6469775 Photolithographic device is registered to the wafer-in-process to prevent radiant energy from being directly transmitted into the photoresist material overlaying the vias.
10/22/2002US6469595 Isolating energy conditioning shield assembly
10/22/2002US6469592 High-frequency interconnection for circuits
10/22/2002US6469400 Semiconductor memory device
10/22/2002US6469399 Semiconductor package
10/22/2002US6469398 Semiconductor package and manufacturing method thereof
10/22/2002US6469397 Resin encapsulated electrode structure of a semiconductor device, mounted semiconductor devices, and semiconductor wafer including multiple electrode structures
10/22/2002US6469396 Integrated circuit chip having input/output terminals for testing and operation
10/22/2002US6469395 Semiconductor device
10/22/2002US6469394 Conductive interconnect structures and methods for forming conductive interconnect structures
10/22/2002US6469393 Semiconductor package and mount board
10/22/2002US6469392 Conductive lines with reduced pitch
10/22/2002US6469391 Semiconductor device having silicon oxide sidewalls
10/22/2002US6469390 Device comprising thermally stable, low dielectric constant material
10/22/2002US6469389 Contact plug
10/22/2002US6469387 Semiconductor device formed by calcium doping a copper surface using a chemical solution
10/22/2002US6469386 Lead frame and method for plating the same
10/22/2002US6469385 Integrated circuit with dielectric diffusion barrier layer formed between interconnects and interlayer dielectric layers
10/22/2002US6469384 Unmolded package for a semiconductor device
10/22/2002US6469383 Flip-chip transition interface structure
10/22/2002US6469382 Semiconductor device substrate and method of manufacturing semiconductor device
10/22/2002US6469381 Carbon-carbon and/or metal-carbon fiber composite heat spreader
10/22/2002US6469380 Resin sealed semiconductor device utilizing a clad material heat sink
10/22/2002US6469379 Chain extension for thermal materials
10/22/2002US6469378 Power semiconductor module of high isolation strength
10/22/2002US6469377 Semiconductor device
10/22/2002US6469376 Die support structure
10/22/2002US6469375 High bandwidth 3D memory packaging technique
10/22/2002US6469374 Superposed printed substrates and insulating substrates having semiconductor elements inside
10/22/2002US6469373 Semiconductor apparatus with improved thermal and mechanical characteristic under-fill layer and manufacturing method therefor
10/22/2002US6469370 Semiconductor device and method of production of the semiconductor device
10/22/2002US6469364 Programmable interconnection system for electrical circuits
10/22/2002US6469363 Integrated circuit fuse, with focusing of current
10/22/2002US6469351 Electrostatic breakdown prevention circuit for semiconductor device
10/22/2002US6469339 A void within an opening filled with bpteos film suppresses occurrence of crystal defects in the silicon substrate, and the semiconductor device ensuring high reliability and high yield is obtained.
10/22/2002US6469336 Structure for reducing contact aspect ratios
10/22/2002US6469331 Monolithic integrated circuit with several capacitors forming bypass to ground
10/22/2002US6469330 Process for manufacturing integrated devices comprising microstructures and associated suspended electrical interconnections
10/22/2002US6469327 Semiconductor device with efficiently arranged pads
10/22/2002US6469316 Test structure to monitor the effects of polysilicon pre-doping
10/22/2002US6469260 Wiring boards, semiconductor devices and their production processes
10/22/2002US6469259 Wiring board
10/22/2002US6469258 Circuit board for semiconductor package
10/22/2002US6469257 Integrated circuit packages
10/22/2002US6469256 Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
10/22/2002US6469255 Composite wiring board and manufacturing method thereof
10/22/2002US6469248 Hybrid circuit with a heat dissipation system
10/22/2002US6469109 Copper clad laminates
10/22/2002US6469086 Plastic molding compound, composite body, and filler for a plastic molding compound
10/22/2002US6468927 Method of depositing a nitrogen-doped FSG layer
10/22/2002US6468907 Forming a chemical enhancer layer at the contact hole and the bottom of the trench and then selectively forming copper, using metal organic chemical vapor deposition (mocvd); high quality thin copper film; dual damacene
10/22/2002US6468905 Methods of restricting silicon migration
10/22/2002US6468899 Contactless local interconnect process utilizing self-aligned silicide
10/22/2002US6468898 Method of manufacturing semiconductor device
10/22/2002US6468894 Metal interconnection structure with dummy vias
10/22/2002US6468892 Front side coating for bump devices
10/22/2002US6468891 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
10/22/2002US6468889 Backside contact for integrated circuit and method of forming same
10/22/2002US6468883 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections
10/22/2002US6468845 Semiconductor apparatus having conductive thin films and manufacturing apparatus therefor
10/22/2002US6468836 Laterally situated stress/strain relieving lead for a semiconductor chip package
10/22/2002US6468834 Method of fabricating a BGA package using PCB and tape in a die-up configuration
10/22/2002US6468832 Method to encapsulate bumped integrated circuit to create chip scale package
10/22/2002US6468831 Method of fabricating thin integrated circuit units
10/22/2002US6468830 Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor
10/22/2002US6468813 Method of automatically identifying and skipping defective work pieces for wire-bonding operation
10/22/2002US6468704 Method for improved photomask alignment after epitaxial process through 90° orientation change
10/22/2002US6468640 Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device
10/22/2002US6468639 Plating resistant and protective insulating film is achieved with a coating material of a single type of insulating material
10/22/2002US6468638 Electrically coupling an electrical interconnect layer on a flexible layer to blocks of a substrate; forming displays such as flat panel displays
10/22/2002US6468447 Comprising copper powder and glass powder, wherein glass powder is substantially lead free
10/22/2002US6468413 Electrochemical etch for high tin solder bumps
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