H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2002
10/24/2002	US20020157082 Inter-dice wafer level signal transfer methods for integrated circuits
10/24/2002	US20020157076 Fabrication method for a semiconductor device with dummy patterns
10/24/2002	US20020156538 Data processing system and associated control chip and printed circuit board
10/24/2002	US20020156189 Epoxy resin composition and curing product therof
10/24/2002	US20020155744 Electrical connector
10/24/2002	US20020155743 PGA socket and contact
10/24/2002	US20020155728 Incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip, which are movable to compensate for thermal expansion, to provide a compact unit.
10/24/2002	US20020155722 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes
10/24/2002	US20020155719 Semiconductor device and manufacturing method thereof
10/24/2002	US20020155702 Manufacturing method of semiconductor device
10/24/2002	US20020155695 Dual damascene process using an oxide liner for a dielectric barrier layer
10/24/2002	US20020155680 Method for reducing plasma damage to a gate oxide of a metal-oxide semiconductor wafer
10/24/2002	US20020155678 Method for fabricating an integrated circuit, in particular an antifuse
10/24/2002	US20020155677 Electronic device with interleaved portions for use in integrated circuits
10/24/2002	US20020155672 Method of forming metal fuse
10/24/2002	US20020155655 Electromagnetic interference; forming channel; filling with electroconductive material; coupling to guard ring
10/24/2002	US20020155642 Semiconductor die package including carrier with mask
10/24/2002	US20020155640 Semiconductor package with heat-dissipating structure and method of making the same
10/24/2002	US20020155639 Preferential etching of semiconductor structure using gaseous mixture of nirogen and hydrogen
10/24/2002	US20020155638 Method for fabricating semiconductor device
10/24/2002	US20020155637 Flip chip interconnected structure and a fabrication method thereof
10/24/2002	US20020155286 Adhesive composition and adhesive sheet for semiconductor devices
10/24/2002	US20020155264 Monolithic ceramic sunstrate, manufacturing and designing methods therefor, and electronic device
10/24/2002	US20020155263 Method for forming interconnect structure with low dielectric constant
10/24/2002	US20020155261 Method for forming interconnect structure with low dielectric constant
10/24/2002	US20020155219 From titanium chloride and ammonia; aftertreatment with hydrogen gas
10/24/2002	US20020154872 Protective member and optical module
10/24/2002	US20020154485 Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
10/24/2002	US20020154483 Computer system having removable processor and modular thermal unit
10/24/2002	US20020154482 Press - contact type semiconductor device
10/24/2002	US20020154462 Double-triggered electrostatic discharge protection circuit
10/24/2002	US20020154379 Electrochromic rearview mirror assembly incorporating a display/signal light
10/24/2002	US20020154366 Infrared data communication module and method of making the same
10/24/2002	US20020153977 Apparatus and method for angled coaxial to planar structure broadband transition
10/24/2002	US20020153916 Method of identifying and analyzing semiconductor chip defects
10/24/2002	US20020153620 Semiconductor wafer edge marking
10/24/2002	US20020153619 Semiconductor chip having pads with plural junctions for different assembly methods
10/24/2002	US20020153618 Semiconductor device
10/24/2002	US20020153617 Flip chip interconnected structure and a fabrication method thereof
10/24/2002	US20020153616 High-frequency semiconductor device
10/24/2002	US20020153609 Semiconductor circuit device having gate array area and method of making thereof
10/24/2002	US20020153608 Land grid array semiconductor device and method of mounting land grid array semiconductor devices
10/24/2002	US20020153606 Integrated circuit packages assembled utilizing fluidic self-assembly
10/24/2002	US20020153605 Packaging structure for ball grid array
10/24/2002	US20020153604 Die support structure
10/24/2002	US20020153603 System of a package fabricated on a semiconductor or dielectric wafer
10/24/2002	US20020153602 Ball grid array chip packages having improved testing and stacking characteristics
10/24/2002	US20020153601 Multi-chip package
10/24/2002	US20020153600 Double sided chip package
10/24/2002	US20020153599 Multi-chip package
10/24/2002	US20020153597 Fine pitch lead frame lead and method
10/24/2002	US20020153596 Lead frame and semiconductor package formed using it
10/24/2002	US20020153593 Bypass circuits for reducing plasma damage
10/24/2002	US20020153590 High-speed stacked capacitor in SOI structure
10/24/2002	US20020153589 Contact structure with a lower interconnection having t-shaped portion in cross section and method for forming the same
10/24/2002	US20020153588 Semiconductor device provided with fuse and method of disconnecting fuse
10/24/2002	US20020153585 Semiconductor switching device
10/24/2002	US20020153582 High-frequency module and method for manufacturing the same
10/24/2002	US20020153576 Semiconductor device
10/24/2002	US20020153571 Electrostatic discharge protection structures having high holding current for latch-up immunity
10/24/2002	US20020153570 Two-stage ESD protection circuit with a secondary ESD protection circuit having a quicker trigger-on rate
10/24/2002	US20020153551 Method for making a metal-insulator-metal capacitor using plate-through mask techniques
10/24/2002	US20020153548 Semiconductor device and method of manufacturing the same
10/24/2002	US20020153541 Cluster globular semiconductor device
10/24/2002	US20020153539 Semiconductor integrated circuit device and method of manufacturing the same
10/24/2002	US20020153538 Integrated circuit element, printed circuit board and electronic device having input/output terminals for testing and operation
10/24/2002	US20020153257 Preparing active part comprising wafer provided with conductive connection pads on one face and the base being provided with conductive pins, electrolytic deposition of conductive metal on the pin; oxidation, nitrizing
10/24/2002	US20020153256 Method and apparatus for depositing and controlling the texture of a thin film
10/24/2002	US20020153166 Conductive pads layout for BGA packaging structure
10/24/2002	US20020153154 Underfill coating for LOC package
10/24/2002	US20020152955 Apparatus and method for depositing an electroless solution
10/24/2002	US20020152926 Immersing the substrate in a copper plating bath; immersing an activator in copper plating bath; performing a direct contact between activator and substrate to deposit copper on substrate
10/24/2002	US20020152761 Spray cooling with local control of nozzles
10/24/2002	US20020152610 Electronic circuit device and method of production of the same
10/24/2002	EP1145612A3 Method for mounting an electronic component
10/24/2002	DE10216019A1 Container used for a semiconductor sensor comprises a housing part provided with a housing hollow space for a sensor element, a lid for closing the hollow space, and connecting lines
10/24/2002	DE10216017A1 Semiconductor component used e.g. as an integrated circuit of a vehicle comprises a polysilicon resistor, and metal conductors each electrically connected to the resistor at each end via contacts
10/24/2002	DE10163361A1 Halbleitervorrichtung Semiconductor device
10/24/2002	DE10157887A1 Basisverbindungssubstrat, Herstellungsverfahren davon, Halbleiteranordnung und Herstellungsverfahren davon Based compound substrate, manufacturing method thereof, semiconductor device and manufacturing method thereof
10/24/2002	DE10135812C1 Integrated semiconductor circuit for memory module has signal input points coupled via programmable switches to internal function elements
10/24/2002	DE10130592C1 Module component used for storage modules for data processing comprises a main module and sub-modules
10/24/2002	DE10120685C1 Encapsulated organic-electronic circuit has electronic components especially made of organic material and arranged between at least two layers forming barrier
10/24/2002	DE10118402A1 Contact chain total resistance measurement method for testing semiconductor chips, involves measuring voltage and current in probe pads to obtain total resistance, by selectively connecting n-type doped layers to substrate
10/24/2002	DE10118384A1 Anordnung zur Kühlung eines Leistungs-Halbleiterelementes Arrangement for cooling a power semiconductor element
10/24/2002	DE10114897A1 Elektronisches Bauteil Electronic component
10/23/2002	EP1251561A2 Semiconductor switching device
10/23/2002	EP1251560A1 Cluster globular semiconductor device
10/23/2002	EP1251558A2 Semiconductor device
10/23/2002	EP1251557A2 Method of manufacturing semiconductor devices and semiconductor device
10/23/2002	EP1251546A2 Electronic device sealed under vacuum containing a getter and method of operation
10/23/2002	EP1250717A2 Ldmos power package with a plurality of ground signal paths
10/23/2002	EP1250715A1 Method of fabricating copper interconnections in semiconductor devices
10/23/2002	EP1250713A1 System and method for contacting switching circuits
10/23/2002	EP1250709A1 Electronic package with integrated capacitor
10/23/2002	EP1208607A4 Passivation of gan based fets
10/23/2002	EP1183642B1 Integrated circuit device which is secured against attacks resulting from controlled destruction of an additional layer
10/23/2002	EP1105545B1 Preparation of metal-matrix composite materials with high particulate loadings by concentration
10/23/2002	EP0946646B1 Thermosetting encapsulants for electronics packaging
10/23/2002	EP0944671B1 Thermally reworkable binders for flip-chip devices
10/23/2002	EP0806063B1 Array of leads assembled with electric components and corresponding method of assembling

1 ... 1715 1716 1717 1718 1719 1720 1721 1722 1723 1724 1725 1726 1727 1728 1729 1730 1731 1732 1733 1734 1735 ... 2262