H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2002
10/30/2002	CN1377077A 半导体器件 Semiconductor devices
10/30/2002	CN1376740A Silicon composition low dielectric film, semiconductor device and method for producing low dielectric films
10/30/2002	CN1376554A Dielectric base plate for laser process and process method thereof, semiconductor components and manufacturing method thereof
10/30/2002	CN1093733C Printed circuit board fitted with electronic device
10/30/2002	CN1093689C Semiconductor chip package and manufacture thereof
10/30/2002	CN1093680C Electrode modification using unzippable polymer paste
10/30/2002	CN1093565C Composite material and use thereof
10/29/2002	US6473702 System and method for integrated singulation and inspection of semiconductor devices
10/29/2002	US6473311 Gate area relief strip for a molded I/C package
10/29/2002	US6473310 Insulated power multichip package
10/29/2002	US6473308 Stackable chip package with flex carrier
10/29/2002	US6473306 Heat sink assembly retainer for electronic integrated circuit package
10/29/2002	US6473305 Fastening system and method of retaining temperature control devices used on semiconductor dies
10/29/2002	US6473303 Cooling device for a high-power semiconductor module
10/29/2002	US6472798 Piezoelectric acoustic components
10/29/2002	US6472764 Method and apparatus for implementing selected functionality on an integrated circuit device
10/29/2002	US6472763 Semiconductor device with bumps for pads
10/29/2002	US6472762 Enhanced laminate flipchip package using a high CTE heatspreader
10/29/2002	US6472761 Solid-state image pickup apparatus and manufacturing method thereof
10/29/2002	US6472760 Nanomachining of integrated circuits
10/29/2002	US6472759 Ball grid array type semiconductor device
10/29/2002	US6472757 Conductor reservoir volume for integrated circuit interconnects
10/29/2002	US6472755 Semiconductor device comprising copper interconnects with reduced in-line copper diffusion
10/29/2002	US6472754 Semiconductor device with improved arrangements to avoid breakage of tungsten interconnector
10/29/2002	US6472750 Process for realizing an intermediate dielectric layer for enhancing the planarity in semiconductor electronic devices
10/29/2002	US6472749 Semiconductor device having a shortened wiring length to reduce the size of a chip
10/29/2002	US6472748 System and method for providing MMIC seal
10/29/2002	US6472747 Mixed analog and digital integrated circuits
10/29/2002	US6472746 Semiconductor device having bonding wires serving as external connection terminals
10/29/2002	US6472745 Semiconductor device
10/29/2002	US6472744 Semiconductor module including a plurality of semiconductor devices detachably
10/29/2002	US6472743 Semiconductor package with heat dissipating structure
10/29/2002	US6472742 Thermal gap control
10/29/2002	US6472741 Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same
10/29/2002	US6472740 Self-supporting air bridge interconnect structure for integrated circuits
10/29/2002	US6472738 Compound semiconductor device
10/29/2002	US6472737 Lead frame decoupling capacitor, semiconductor device packages including the same and methods
10/29/2002	US6472736 Stacked structure for memory chips
10/29/2002	US6472732 BGA package and method for fabricating the same
10/29/2002	US6472731 Solder clad lead frame for assembly of semiconductor devices and method
10/29/2002	US6472730 Semiconductor device and method of manufacturing the same
10/29/2002	US6472729 Semiconductor device
10/29/2002	US6472727 Semiconductor device and manufacturing method thereof
10/29/2002	US6472726 Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment
10/29/2002	US6472725 Technique for attaching die to leads
10/29/2002	US6472724 Electronic device structure capable of preventing malfunction caused by electromagnetic wave coming from outside
10/29/2002	US6472723 Substrate contacts and shielding devices in a semiconductor component
10/29/2002	US6472719 Method of manufacturing air gap in multilevel interconnection
10/29/2002	US6472704 Semiconductor device having contact hole and method of manufacturing the same
10/29/2002	US6472700 Semiconductor device with isolation insulator, interlayer insulation film, and a sidewall coating film
10/29/2002	US6472697 Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application
10/29/2002	US6472609 Printed-wiring substrate and method for fabricating the printed-wiring substrate
10/29/2002	US6472608 Semiconductor device
10/29/2002	US6472598 Electromagnetic interference shield device with conductive encapsulant and dam
10/29/2002	US6472336 Forming an encapsulating layer after deposition of a dielectric comprised of corrosive material
10/29/2002	US6472330 Method for forming an interlayer insulating film, and semiconductor device
10/29/2002	US6472329 Etching aluminum over refractory metal with successive plasmas
10/29/2002	US6472318 Method of fabricating semiconductor device having trench interconnection
10/29/2002	US6472317 Dual damascene arrangement for metal interconnection with low k dielectric constant materials in dielectric layers
10/29/2002	US6472316 Photolithography overlay control
10/29/2002	US6472313 Semiconductors; heat resistance
10/29/2002	US6472312 Methods for inhibiting microelectronic damascene processing induced low dielectric constant dielectric layer physical degradation
10/29/2002	US6472308 Borderless vias on bottom metal
10/29/2002	US6472307 Methods for improved encapsulation of thick metal features in integrated circuit fabrication
10/29/2002	US6472305 Method of manufacturing bonded structure of film substrate and semiconductor chip
10/29/2002	US6472304 Wire bonding to copper
10/29/2002	US6472303 Method of forming a contact plug for a semiconductor device
10/29/2002	US6472293 Method for manufacturing an interconnect structure for stacked semiconductor device
10/29/2002	US6472286 Bipolar ESD protection structure
10/29/2002	US6472261 Method of forming an integrated circuit contact structure having gate electrode protection for self-aligned contacts with zero enclosure
10/29/2002	US6472257 High quality factor, integrated inductor and production method thereof
10/29/2002	US6472253 Programmable semiconductor device structures and methods for making the same
10/29/2002	US6472251 Method for integrated circuit packaging
10/29/2002	US6472250 Method for producing a chip module
10/29/2002	US6472249 Semiconductor device having sealing film formed on the surface having columnar electrode formed thereon and method of manufacturing the same
10/29/2002	US6472247 Solid-state imaging device and method of production of the same
10/29/2002	US6472233 MOSFET test structure for capacitance-voltage measurements
10/29/2002	US6472232 Semiconductor temperature monitor
10/29/2002	US6472230 Re-settable tristate programmable device
10/29/2002	US6472122 Very thin layer of alumina, zerconia, or other ceramic, less than 25 microns thick,
10/29/2002	US6471538 Contact structure and production method thereof and probe contact assembly using same
10/29/2002	US6471533 Retention module for securing heat sink
10/29/2002	US6471524 IC socket
10/29/2002	US6470962 Retaining tool of heat radiator
10/29/2002	US6470594 Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps
10/29/2002	US6470545 Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate
10/24/2002	WO2002084746A2 Optoelectronic component array and method for the production of an optoelectronic component array
10/24/2002	WO2002084737A2 Arrangement and method of arrangement of stacked dice in an integrated electronic device
10/24/2002	WO2002084736A1 Microelectronic spring with additional protruding member
10/24/2002	WO2002084735A1 Radiating structural body of electronic part and radiating sheet used for the radiating structural body
10/24/2002	WO2002084734A1 Electronic part with a lead frame
10/24/2002	WO2002084733A1 Radiation type bga package and production method therefor
10/24/2002	WO2002084730A1 An integrated silicon contactor and a device and method for manufacturing same
10/24/2002	WO2002084586A1 Connection by deposition of a conductive material bead on a connecting zone delimited by an insulating mask
10/24/2002	WO2002084213A1 Periodic patterns and technique to control misalignment
10/24/2002	WO2002083981A1 Device and method for electroless plating
10/24/2002	WO2002061804A3 Semiconductor package with lid heat spreader
10/24/2002	WO2002015270A3 Seal for authenticating objects and a method for producing and verifying said seal
10/24/2002	WO2001063648A9 Method of using optical proximity effects to create electrically blown fuses with sub-critical dimension neck downs
10/24/2002	WO2000035262A3 Method for mounting an electronic component

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