Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2002
10/31/2002US20020158344 Configuration with at least two stacked semiconductor chips and method for forming the configuration
10/31/2002US20020158343 Semiconductor device and wiring tape for semiconductor device
10/31/2002US20020158342 Nanofabrication
10/31/2002US20020158341 Semiconductor package
10/31/2002US20020158340 Method for providing semiconductor device and corresponding semiconductor device
10/31/2002US20020158339 Wiring structure of a semiconductor integrated circuit and a method of forming the wiring structure
10/31/2002US20020158338 Semiconductor device and method of manufacturing the same
10/31/2002US20020158337 Multilayer interconnect structure containing air gaps and method for making
10/31/2002US20020158336 Ruthenium interconnect for an integrated circuit and method for its fabrication
10/31/2002US20020158335 High performance, low cost microelectronic circuit package with interposer
10/31/2002US20020158334 Microelectronic device having signal distribution functionality on an interfacial layer thereof
10/31/2002US20020158333 Semiconductor device and method for manufacturing semiconductor device
10/31/2002US20020158332 Heat conductive molded body and manufacturing method thereof and semiconductor device
10/31/2002US20020158331 Semiconductor device and its manufacturing method
10/31/2002US20020158330 Circuit board having a heating means and a hermetically sealed multi-chip package
10/31/2002US20020158326 Semiconductor device and semiconductor device manufacturing method
10/31/2002US20020158324 Semiconductor device, method of manufacturing electronic device, electronic device, and portable infromation terminal
10/31/2002US20020158323 Storage apparatus, card type storage apparatus, and electronic apparatus
10/31/2002US20020158321 Method of forming semiconductor device utilizing die active surfaces for laterally extending die internal and external connections
10/31/2002US20020158319 Semiconductor device
10/31/2002US20020158317 Semiconductor package and method of preparing same
10/31/2002US20020158316 Multiple-step inner lead of leadframe
10/31/2002US20020158315 Lead frame having semiconductor device mounted thereon and method for fabricating the same
10/31/2002US20020158307 Laminated body, capacitor, electronic part, and method and device for manufacturing the laminated body, capacitor, and electronic part
10/31/2002US20020158304 Semiconductor power component comprising a safety fuse
10/31/2002US20020158300 Fault tolerant electrical circuit and method
10/31/2002US20020158286 Symmetric device with contacts self aligned to gate
10/31/2002US20020158276 FET circuit block with reduced self-heating
10/31/2002US20020158193 Overlay alignment metrology using diffraction gratings
10/31/2002US20020158110 Structure to accommodate increase in volume expansion during solder reflow
10/31/2002US20020158052 Method and system for processing one or more microstructures of a multi-material device
10/31/2002US20020157958 Common electrode wire for plating
10/31/2002US20020157860 Interconnection structure of semiconductor element
10/31/2002US20020157821 Multi-load thermal regulating system with multiple serial evaporators
10/31/2002US20020157820 Multi-load thermal regulating system having electronic valve control
10/31/2002US20020157819 Graphite-based thermal dissipation component
10/31/2002US20020157818 Anisotropic thermal solution
10/31/2002US20020157813 Flat evaporator
10/31/2002US20020157760 Method of producing ceramic multilayer substrate
10/31/2002US20020157698 A temperature controller for a semiconductor
10/31/2002US20020157686 Process and apparatus for treating a workpiece such as a semiconductor wafer
10/31/2002US20020157247 Heat-resistant electronic systems and circuit boards
10/31/2002DE10202694A1 Rohrleitung, die den Wirkungsgrad einer aktiven Gegenfluß-Wärmesenke mit zwei Durchläufen verbessert Pipeline which improves the efficiency of an active counterflow heat sink with two passes
10/31/2002DE10162948A1 Halbleiterbauelement eines LGA-Typs und Verfahren zum Anbringen des Halbleiterbauelements A semiconductor device of a LGA type, and method of mounting of the semiconductor component
10/31/2002DE10142472A1 Electronic high voltage and power component comprises external contact pins and/or external contact lug protruding from a housing and partially surrounded by a heat conducting protective layer based on an organic ceramic
10/31/2002DE10137956A1 Electronic component comprises a semiconductor chip on an island embedded in a flat plastic housing having an exposed surface of the island in the center of its lower side and metallic external edge contacts arranged on its edge sides
10/31/2002DE10121241A1 Integrated circuit has high frequency signal connections arranged at center of package to minimize path lengths
10/31/2002DE10120928C1 Production of contact joint between semiconductor chip and substrate comprises applying hardenable conducting adhesive on contact surfaces of substrate and chip, joining, and hardening adhesive to form contact joint
10/31/2002DE10120687A1 Encapsulated organic-electronic circuit has electronic components especially made of organic material and arranged between at least two layers forming barrier
10/31/2002DE10120408A1 Elektronisches Bauteil mit Halbleiterchips und elektronische Baugruppe aus gestapelten Halbleiterchips Electronic component with semiconductor chips and electronic assembly of stacked semiconductor chips
10/31/2002DE10119873A1 Verfahren zur Herstellung von Metall/Halbleiter-Kontakten A process for the production of metal / semiconductor contacts
10/31/2002DE10119523A1 Substrate such as wafer for manufacture of electronic or micro-mechanical chips, has multiplexer for selecting components of process-monitoring circuitry
10/31/2002DE10119004A1 Electronic component with semiconductor chip has conductive wiring clips which engage side of chip and make contact with connection pads
10/31/2002DE10103294C1 Träger mit einer Metallfläche und mindestens ein darauf angeordneter Chip, insbesondere Leistungshalbleiter Support with a metal surface and at least one chip arranged thereon, in particular power semiconductor
10/31/2002CA2443754A1 Phase change thermal interface composition having induced bonding property
10/30/2002EP1253685A1 Cooler, semiconductor laser light source, semiconductor laser light source unit, method for producing semiconductor laser light source unit, and solid laser
10/30/2002EP1253642A2 A semiconductor device and a method of manufacturing the same
10/30/2002EP1253641A2 Semiconductor device provided with fuse and method of disconnecting fuse
10/30/2002EP1253640A2 Improved leadframe-based chip scale package
10/30/2002EP1253639A2 A fluid-cooled heat sink for electronic components
10/30/2002EP1253638A2 A heat sink for electronic components
10/30/2002EP1253637A2 Semiconductor device including heat sinks and manufacturing method therefor
10/30/2002EP1253636A1 Electronic equipment
10/30/2002EP1252655A1 Microwave ic package with dual mode wave guide
10/30/2002EP1252654A2 A method for transferring and stacking of semiconductor devices
10/30/2002EP1196485A4 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants
10/30/2002EP1151033A4 Thermally conductive composite material
10/30/2002EP0944909B1 Electroceramic component and method for its manufacture
10/30/2002CN2519595Y Baffle-free self-assembling radiator
10/30/2002CN2519594Y Structure for fixing circuit board
10/30/2002CN2519417Y Multichip packaging structure with radiating member
10/30/2002CN2519416Y Multichip packaging structure with radiation member
10/30/2002CN2519414Y Radiating fin device for heating electron element
10/30/2002CN2519413Y Combined radiator
10/30/2002CN2519412Y Cooling device assembly
10/30/2002CN2519411Y Cooling device
10/30/2002CN2519410Y Radiator module
10/30/2002CN2519409Y Semiconductor packaging assembly with central lead wire
10/30/2002CN2519325Y Improved thin radiator
10/30/2002CN2519324Y Radiator fixed device assembly for computer
10/30/2002CN2519322Y Heat radiator
10/30/2002CN2519321Y Radiator device
10/30/2002CN2519320Y Combination of radiator device
10/30/2002CN1377516A Universal energy conditioning interposer with circuit architecture
10/30/2002CN1377512A Dual water attachment process
10/30/2002CN1377511A Method for producing integrated circuit having at least one metalilized surface
10/30/2002CN1377219A Manufacturing method for circuit device
10/30/2002CN1377216A 线路板 PCB
10/30/2002CN1377215A Manufacturing method for circuit device
10/30/2002CN1377094A Diode suitable for technology of automatic aligning to metallic silicide
10/30/2002CN1377088A Electrostatic protector of integrated circuit
10/30/2002CN1377087A Arrangement method with uniformly distributed current for preventing electrostatic discharge
10/30/2002CN1377086A Guider for preventing destroy of electrostatic discharge and its method
10/30/2002CN1377085A Electrostatic discharge protector
10/30/2002CN1377084A Diode-triggered electrostatic discahrge protector
10/30/2002CN1377082A 半导体装置 Semiconductor device
10/30/2002CN1377081A Interconnection mechanism for semiconductor packages
10/30/2002CN1377080A High-efficacy cooler
10/30/2002CN1377079A Composite material and application thereof
10/30/2002CN1377078A Heat radiator with special structure and semiconductor device with it
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