Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2002
11/05/2002US6476459 Semiconductor integrated circuit device with capacitor formed under bonding pad
11/05/2002US6476454 Semiconductor device and method of manufacturing the same
11/05/2002US6476453 Semiconductor integrated circuit device having capacitor element
11/05/2002US6476449 Silicide block for ESD protection devices
11/05/2002US6476414 Semiconductor device
11/05/2002US6476410 Backside light emitting chip type light emitting element and insulating substrate therefor
11/05/2002US6476333 Raised contact structures (solder columns)
11/05/2002US6476332 Conductor systems for thick film electronic circuits
11/05/2002US6476331 Printed circuit board for semiconductor package and method for manufacturing the same
11/05/2002US6476330 Wiring substrate and process for producing the same
11/05/2002US6476106 Polyarylene sulfide resin composition for electronic parts encapsulation
11/05/2002US6475962 Dry thermal grease
11/05/2002US6475929 Method of manufacturing a semiconductor structure with treatment to sacrificial stop layer producing diffusion to an adjacent low-k dielectric layer lowering the constant
11/05/2002US6475924 Substrate and process for producing the same
11/05/2002US6475907 Semiconductor device having a barrier metal layer and method for manufacturing the same
11/05/2002US6475901 Method for manufacturing semiconductor device having a multi-layer interconnection
11/05/2002US6475900 Method for manufacturing a metal interconnection having enhanced filling capability
11/05/2002US6475899 Low capacitance wiring layout and method for making same
11/05/2002US6475897 Semiconductor device and method of forming semiconductor device
11/05/2002US6475896 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
11/05/2002US6475891 Method of forming a pattern for a semiconductor device
11/05/2002US6475889 Method of forming vias in silicon carbide and resulting devices and circuits
11/05/2002US6475877 Method for aligning die to interconnect metal on flex substrate
11/05/2002US6475871 Passive multiplexor test structure for integrated circuit manufacturing
11/05/2002US6475853 Stacked semiconductor integrated circuit device and manufacturing method thereof
11/05/2002US6475834 Method of manufacturing a semiconductor component and semiconductor component thereof
11/05/2002US6475832 Open-cavity semiconductor die package
11/05/2002US6475829 Semiconductor device and manufacturing method thereof
11/05/2002US6475827 Method for making a semiconductor package having improved defect testing and increased production yield
11/05/2002US6475824 X-ray detector and method of fabricating the same
11/05/2002US6475821 Circuit substrate, detector, and method of manufacturing the same
11/05/2002US6475817 Method of fabricating integrated circuits, providing improved so-called saw bows
11/05/2002US6475646 Electrocleaning, electropolishing, removing inclusions, rinsing, and forming multi-plated layers on the surface of a thin plate
11/05/2002US6475641 Connecting material and connection structure
11/05/2002US6475629 Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device
11/05/2002US6475555 Process for screening features on an electronic substrate with a low viscosity paste
11/05/2002US6475429 Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same
11/05/2002US6475400 Method for controlling the sheet resistance of thin film resistors
11/05/2002US6475328 Printed circuits; containing cockroach repellent
11/05/2002US6475327 Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier
11/05/2002US6475276 Production of elemental thin films using a boron-containing reducing agent
11/05/2002US6475030 Heat sink fastener
11/05/2002US6474532 Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
11/05/2002US6474409 Apparatus to enhance cooling of electronic device
11/05/2002US6474407 Composite heat sink with high density fins and assembling method for the same
11/05/2002US6474080 Cryopump system with modular electronics
11/05/2002US6474074 Apparatus for dense chip packaging using heat pipes and thermoelectric coolers
11/05/2002CA2180807C Integrated circuit chip package and encapsulation process
10/2002
10/31/2002WO2002087297A1 Electronic apparatus
10/31/2002WO2002087293A2 Support for electrical circuit elements
10/31/2002WO2002087292A2 Pin grid array package socket
10/31/2002WO2002086971A2 Multichip module fabricated on a semiconductor or dielectric wafer and method for manufacturing same
10/31/2002WO2002086970A2 Semiconductor device and method of manufacturing the same
10/31/2002WO2002086969A2 Non-optical signal isolator
10/31/2002WO2002086968A2 Liquid-cooled power semiconductor device heatsink
10/31/2002WO2002086967A2 Method for producing metallic bit line contacts
10/31/2002WO2002086965A1 Contact structure for an integrated semiconductor device
10/31/2002WO2002086964A1 Wiring method and element arranging method using the same, and method of producing image display devices
10/31/2002WO2002086961A1 Electropolishing metal layers on wafers having trenches or vias with dummy structures
10/31/2002WO2002086952A1 Mixed-signal semiconductor structure
10/31/2002WO2002086947A2 A method for making a metal-insulator-metal capacitor using plate-through mask techniques
10/31/2002WO2002086812A1 Ic chip module and ic card
10/31/2002WO2002085339A1 Phase change thermal interface composition having induced bonding property
10/31/2002WO2002061835A9 Semiconductor device and its manufacturing method
10/31/2002WO2002052647A3 Semiconductor device comprising an arrangement of an electrically programmable non-volatile memory element
10/31/2002WO2001056082A9 Auto-aligning power transistor package
10/31/2002WO2001056063A9 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners
10/31/2002US20020162082 Method for making an interconnect layer and a semiconductor device including the same
10/31/2002US20020162079 Automated wiring pattern layout method
10/31/2002US20020161100 Embedding resin, wiring substrate using same and process for producing wiring substrate using same
10/31/2002US20020160903 Method for manufacturing aluminum nitride sintered body in which via hole is made
10/31/2002US20020160626 Vaporizing a dialkoxydialkylsilicon for chemical vapor deposition on a semiconductor and introducing oxygen and an inert gas to activate plasma polymerisation; low dielectric constant; humidity and heat resistance
10/31/2002US20020160624 Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition
10/31/2002US20020160608 Copper-based metal polishing composition, method for manufacturing a semiconductor device, polishing composition, aluminum-based metal polishing composition, and tungsten-based metal polishing composition
10/31/2002US20020160607 Electrode pad in semiconductor device and method of producing the same
10/31/2002US20020160602 Method for forming metal wiring layer
10/31/2002US20020160599 Semiconductor device and wiring forming method in semiconductor device
10/31/2002US20020160597 Wafer level package and the process of the same
10/31/2002US20020160576 Monolithic integrated circuit incorporating an inductive component and process for fabricating such an integrated circuit
10/31/2002US20020160575 High coupling ratio stacked-gate flash memory and the method of making the same
10/31/2002US20020160571 High coupling ratio stacked-gate flash memory and the method of making the same
10/31/2002US20020160563 Practical air dielectric interconnections by post-processing standard CMOS wafers
10/31/2002US20020160552 Terminal land frame and method for manufacturing the same
10/31/2002US20020160191 Low maturing temperature porcelain compositions useful for the fabrication of dental restorations.
10/31/2002US20020160190 Nanotechnology for magnetic components
10/31/2002US20020160185 Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
10/31/2002US20020159243 Wiring board
10/31/2002US20020159242 Module with built-in electronic elements and method of manufacture thereof
10/31/2002US20020159237 Cooling arrangement for high density packaging of electronic components
10/31/2002US20020159236 Structure and method for constructing circuit module suitable for hand-held electronic equipment
10/31/2002US20020159234 Clip for heat sink
10/31/2002US20020159208 ESD protection circuit for mixed-voltage I/O by using stacked NMOS transistors with substrate triggering technique
10/31/2002US20020159010 Liquid crystal display device and manufacturing method of same
10/31/2002US20020158723 Integrated circuit interconnect system
10/31/2002US20020158647 Apparatus for manufacturing semiconductor device, method for manufacturing semiconductor device, inspection apparatus for semiconductor device, and inspection method for semiconductor device
10/31/2002US20020158643 Method and apparatus for generating values for selected pixels used in evaluating semiconductor wafer bumps
10/31/2002US20020158348 Semiconductor structure and method for reducing charge damage
10/31/2002US20020158347 Resin -encapsulated packing lead member for the same and method of fabricating the lead member
10/31/2002US20020158346 Semiconductor chip having pads with plural junctions for different assembly methods
10/31/2002US20020158345 Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly
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