H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2002
11/07/2002	US20020163040 Power mosfet with integrated drivers in a common package
11/07/2002	US20020163025 Mixed metal nitride and boride barrier layers
11/07/2002	US20020163019 Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits
11/07/2002	US20020163018 Radio frequency semiconductor apparatus
11/07/2002	US20020163015 Plastic semiconductor package
11/07/2002	US20020162997 Semiconductor chip
11/07/2002	US20020162973 Methods and systems for processing a device, methods and systems for modeling same and the device
11/07/2002	US20020162738 Methods of producing ultra -low resistivity tantalum films.
11/07/2002	US20020162684 Mounting substrate and structure having semiconductor element mounted on substrate
11/07/2002	US20020162677 Process for fabricating a component, such as a capacitor in an integrated circuit, and integrated-circuit component
11/07/2002	US20020162647 Heat sink device manufacture
11/07/2002	US20020162645 Heatsink assembly having stabilzation plate
11/07/2002	US20020162338 Laser module, peltier module, and peltier module integrated heat spreader
11/07/2002	DE10114572A1 Träger für eine elektrische Schaltung, insbesondere für einen elektrischen Schalter Carrier for an electric circuit, in particular for an electric switch
11/06/2002	EP1255334A1 Fault tolerant electrical circuit and method
11/06/2002	EP1255300A2 Semiconductor package
11/06/2002	EP1255299A2 Power semiconductor device with pressure contact
11/06/2002	EP1255298A2 Power device with a plastic molded package and direct bonded substrate
11/06/2002	EP1255297A2 Electrically isolated power device package
11/06/2002	EP1255295A1 Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit
11/06/2002	EP1255290A2 A method to form a low parasitic capacitance CMOS device
11/06/2002	EP1255289A2 Method for processing a coating film and method for manufacturing a semiconductor element with use of the same method
11/06/2002	EP1255288A2 Component on GaAs and method for making the same
11/06/2002	EP1254924A1 Heat conductive silicone composition and semiconductor device
11/06/2002	EP0843895B1 Method of manufacturing a metal interconnect structure for an integrated circuit with improved electromigration reliability
11/06/2002	CN2520095Y Radiation device for electronic equipment
11/06/2002	CN2519998Y Snap fastener structure for CPU sink
11/06/2002	CN2519997Y Snap fastener for sink
11/06/2002	CN2519948Y CPU sink fixator assembly
11/06/2002	CN2519946Y Sink fan module set
11/06/2002	CN1378420A High frequency module and its producing method
11/06/2002	CN1378283A Output buffer with good static discahrge protection effect
11/06/2002	CN1378282A Static discharge protective circuit of low leakage current
11/06/2002	CN1378281A Silicon controlled rectifier and method for realising static discharging protection and locking resisting
11/06/2002	CN1378280A Static discharge protective semiconductor device
11/06/2002	CN1378279A Static discharge protective circuit triggered by low voltage
11/06/2002	CN1378278A Silicon controlled rectifier circuit of high triggered current
11/06/2002	CN1378277A Static discharging protector
11/06/2002	CN1378276A Wiring and wiring production method and wiring board and wiring board production method
11/06/2002	CN1378254A Method for producing chip, seal device, metal mold and runner and semiconductor device
11/06/2002	CN1378117A Method for producing radiator with high density radiation fins
11/06/2002	CN1378093A Substrate device, electrooptic device and its producing method and electronic instrument
11/06/2002	CN1093984C Resin sealed semiconductor unit and its producing method
11/06/2002	CN1093866C Use of silicon-modified epoxy resin as casting material for electrical working or electronic assembly
11/05/2002	US6477692 Method and apparatus for channel-routing of an electronic device
11/05/2002	US6477286 Integrated optoelectronic device, and integrated circuit device
11/05/2002	US6477054 Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via
11/05/2002	US6477050 Tilt-away processor retention module with hold-down screw device
11/05/2002	US6477049 Fixture assembly for a heat sink
11/05/2002	US6477048 Heat sink clip
11/05/2002	US6477047 Temperature sensor mounting for accurate measurement and durability
11/05/2002	US6477046 Ball grid array package and method using enhanced power and ground distribution circuitry
11/05/2002	US6477045 Heat dissipater for a central processing unit
11/05/2002	US6477034 Interposer substrate with low inductance capacitive paths
11/05/2002	US6476881 Liquid crystal display device and defect repairing method therefor
11/05/2002	US6476704 MMIC airbridge balun transformer
11/05/2002	US6476663 Method for reducing supply noise near an on-die thermal sensor
11/05/2002	US6476508 Temperature control structure for integrated circuit
11/05/2002	US6476507 Resin sealing method and resin sealing apparatus
11/05/2002	US6476506 Packaged semiconductor with multiple rows of bond pads and method therefor
11/05/2002	US6476505 Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners
11/05/2002	US6476504 Adhesive pattern for attaching semiconductor chip onto substrate
11/05/2002	US6476503 Semiconductor device having columnar electrode and method of manufacturing same
11/05/2002	US6476502 Semiconductor device and manufacturing method thereof
11/05/2002	US6476501 Semiconductor device, manufacturing method for semiconductor device and mounting method for the same
11/05/2002	US6476500 Semiconductor device
11/05/2002	US6476499 Semiconductor chip, chip-on-chip structure device and assembling method thereof
11/05/2002	US6476498 Elimination of flux divergence in integrated circuit interconnects
11/05/2002	US6476497 Concentric metal density power routing
11/05/2002	US6476495 Transistor which can minimize the DC resistance of the wiring and lead formed on a semiconductor chip
11/05/2002	US6476494 Silver-tin alloy solder bumps
11/05/2002	US6476492 Semiconductor device having a capacitor and an interconnect layer with molybdenum-containing tungsten
11/05/2002	US6476491 Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion and method for fabricating the same
11/05/2002	US6476490 Contact openings, electrical connections and interconnections for integrated circuitry
11/05/2002	US6476489 Apparatus and manufacturing method for semiconductor device adopting NA interlayer contact structure
11/05/2002	US6476487 Solder circuit
11/05/2002	US6476486 Ball grid array package with supplemental electronic component
11/05/2002	US6476485 Thin-film structure having reliably removable oxide layer formed on bump exposed at surface of insulating layer and manufacturing method therefor
11/05/2002	US6476484 Heat sink dissipator for adapting to thickness change of a combination of a CPU and a CPU carrier
11/05/2002	US6476483 Method and apparatus for cooling a silicon on insulator device
11/05/2002	US6476482 Chip-size integrated circuit package having slits formed in an insulator tape
11/05/2002	US6476481 High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
11/05/2002	US6476480 Press-fit IC power package and method therefor
11/05/2002	US6476479 Semiconductor device and method of fabricating the same
11/05/2002	US6476478 Cavity semiconductor package with exposed leads and die pad
11/05/2002	US6476477 Electronic assembly providing shunting of electrical current
11/05/2002	US6476476 Integrated circuit package including pin and barrel interconnects
11/05/2002	US6476474 Dual-die package structure and method for fabricating the same
11/05/2002	US6476473 Memory module having backup function
11/05/2002	US6476472 Integrated circuit package with improved ESD protection for no-connect pins
11/05/2002	US6476471 Microelectronic-device assemblies and methods that exclude extraneous elements from sensitive areas
11/05/2002	US6476470 Integrated circuit packaging
11/05/2002	US6476469 Quad flat non-leaded package structure for housing CMOS sensor
11/05/2002	US6476468 Transverse hybrid LOC package
11/05/2002	US6476467 Semiconductor device and process for producing the same
11/05/2002	US6476466 Ball grid array type semiconductor package having a flexible substrate
11/05/2002	US6476465 Integrated circuit package for mounting
11/05/2002	US6476464 Low resistance hermetic lead structure
11/05/2002	US6476463 Microwave integrated circuit multi-chip-module
11/05/2002	US6476461 Arrangement of stacked, spherically-shaped semiconductors

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