H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2002
11/12/2002	US6479327 Semiconductor device and method for manufacturing the same
11/12/2002	US6479326 Heat sink for microchip application
11/12/2002	US6479323 Method for attaching a lead frame to a heat spreader/heat slug structure
11/12/2002	US6479322 Semiconductor device with two stacked chips in one resin body and method of producing
11/12/2002	US6479319 Contact escape pattern
11/12/2002	US6479318 Method of manufacturing a substrate with directionally anisotropic warping
11/12/2002	US6479314 Method of producing vacuum container
11/12/2002	US6479310 Method for testing a semiconductor integrated circuit device
11/12/2002	US6479308 Semiconductor fuse covering
11/12/2002	US6479307 Method of monitoring loss of silicon nitride
11/12/2002	US6479167 Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith
11/12/2002	US6479110 A dielectric material having two or more phases comprising: a first phase consisting of silicon, carbon, oxygen and hydrogen, and atleast one second phase consisting of carbon and hydrogen and multiplicity of nanometer-sized pores
11/12/2002	US6479095 Composite material for heat sinks for semiconductor devices and method for producing the same
11/12/2002	US6478997 Pure carbon fiber core and an outer jacket of substantially pure polymer, especially polyethylene, material.
11/12/2002	US6478944 Functional Sn-Bi alloy plating using a substitute material for Pb
11/12/2002	US6478935 Semiconductor device plating apparatus
11/12/2002	US6478212 Bond pad structure and method for reduced downward force wirebonding
11/12/2002	US6478082 Heat dissipating apparatus with nest wind duct
11/12/2002	US6478076 Mechanical assembly for fabricating an alloy film on a face of a heat exchanger for an integrated circuit
11/12/2002	US6477844 Thermoelectric conversion device and method of manufacturing the same
11/07/2002	WO2002089540A1 Printed circuit board, its manufacturing method, and csp manufacturing methdo
11/07/2002	WO2002089539A1 Integrated cooling of a printed circuit board structure
11/07/2002	WO2002089538A2 Finned heat sink assemblies
11/07/2002	WO2002089260A2 Separable power delivery connector
11/07/2002	WO2002089257A2 Connection housing for an electronic component
11/07/2002	WO2002089209A1 High-frequency module and its manufacturing method
11/07/2002	WO2002089208A2 Arrangement comprising at least two different electronic semiconductor circuits
11/07/2002	WO2002089207A2 High performance, low cost microelectronic circuit package with interposer
11/07/2002	WO2002089206A1 Heat sink
11/07/2002	WO2002089205A2 Relay connector for an electronic component and a method for producing the same
11/07/2002	WO2002089204A1 Semiconductor device
11/07/2002	WO2002089197A1 Method for bonding wafers to produce stacked integrated circuits
11/07/2002	WO2002089191A2 Improvement of titanium disilicide resistance in narrow active regions of semiconductor devices
11/07/2002	WO2002089184A2 Method for manufacturing a semiconductor device and support plate therefor
11/07/2002	WO2002089177A2 A contact structure of a wiring line and method manufacturing the same, and thin film transistor array substrate including the contact structure and method manufacturing the same
11/07/2002	WO2002089152A1 Conductive materials with electrical stability for use in electronics devices
11/07/2002	WO2002088252A1 Addition-curable silicone gel composition
11/07/2002	WO2002087870A1 Electric circuit components having multiple electric characteristics and methods of making such components
11/07/2002	WO2002054447A3 System and method for prototyping and fabricating complex microwave circuits
11/07/2002	WO2002052641A3 Contact and via structure and method of fabrication
11/07/2002	WO2002037564A3 Film material comprising metal spikes and method for the production thereof
11/07/2002	WO2002019424A3 Electronic assembly comprising solderable thermal interface and methods of manufacture
11/07/2002	WO2001093314A9 Ball grid array with pre-slotted substrate
11/07/2002	WO2001041207A9 Packaging of integrated circuits and vertical integration
11/07/2002	WO2001018863A9 Method for manufacturing fusible links in a semiconductor device
11/07/2002	US20020165079 Aluminum nitride sintered bodies and members for semiconductor-producing apparatuses
11/07/2002	US20020164895 Integrated power delivery with flex circuit interconnection for high density high power circuits for integrated circuits and systems
11/07/2002	US20020164893 Interconnect for microelectronic structures with enhanced spring characteristics
11/07/2002	US20020164891 Porous low dielectric film
11/07/2002	US20020164887 Etching method and etching apparatus, method for manufacturing semiconductor device, and semiconductor device
11/07/2002	US20020164886 Method for processing coating film and method for manufacturing semiconductor element with use of the same method
11/07/2002	US20020164881 Method for manufacturing semiconductor device
11/07/2002	US20020164872 Forming connecting structures; overcoating semiconductor with metal connector; silicon carbide barrier; dielectric; multilayer
11/07/2002	US20020164869 Applying, curing multilayer dielectric
11/07/2002	US20020164867 High-frequency line
11/07/2002	US20020164865 Semiconductor device and manufacturing method thereof
11/07/2002	US20020164863 Plasma enhanced liner
11/07/2002	US20020164851 Guard mesh for noise isolation in highly integrated circuits
11/07/2002	US20020164840 Stress buffer layer
11/07/2002	US20020164838 High density integrated circuits; multilayer semiconductor dies, dielectrics
11/07/2002	US20020164837 Filling gap between chip and substrate with adhesive; applying ultrasonic oscillation
11/07/2002	US20020164537 Electronic device and defect repair method thereof
11/07/2002	US20020164488 Ceramic substrate board and a metal alloy layer consisting mainly of aluminum formed on a surface portion of the ceramic substrate board, wherein the Vickers hardness of the metal alloy layer is not less than 25 and not more than 40.
11/07/2002	US20020164483 Intercalating and then exfoliating flakes of graphite to form exfoliated particles; forming a substrate by compressing the particles into a coherent article formed of graphene layers; and producing a controlled directional alignment
11/07/2002	US20020164482 Nanotechnology for biomedical products
11/07/2002	US20020164475 Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate
11/07/2002	US20020164391 Split-mold and method for manufacturing semiconductor device by using the same
11/07/2002	US20020163787 Surface mount type electronic component
11/07/2002	US20020163784 Memory module having balanced data i/o contacts pads
11/07/2002	US20020163781 Integrated cooling of a printed circuit board structure
11/07/2002	US20020163396 Method and apparatus for synthesizing high-frequency signals for wireless communications
11/07/2002	US20020163343 Apparatus and method for testing fuses
11/07/2002	US20020163290 Color selection electrode, method of producing color selection electrode and cathode ray tube
11/07/2002	US20020163086 Semiconductor device and manufacturing method thereof
11/07/2002	US20020163085 Pb-free solder-connected structure and electronic device
11/07/2002	US20020163084 Electronic component and process for manufacturing the same
11/07/2002	US20020163083 Semiconductor device
11/07/2002	US20020163081 Semiconductor device and method of manufacturing the same
11/07/2002	US20020163079 Integrated circuit device and method of producing the same
11/07/2002	US20020163078 Lead frame for an integrated circuit chip (integrated circuit peripheral support)
11/07/2002	US20020163076 Isolated thermal interface
11/07/2002	US20020163075 Semiconductor package with embedded heat-dissipating device
11/07/2002	US20020163074 Power device with a plastic molded package and direct bonded substrate
11/07/2002	US20020163073 Multi-layer substrate for an IC chip
11/07/2002	US20020163072 Method for bonding wafers to produce stacked integrated circuits
11/07/2002	US20020163071 Chip mount, methods of making same and methods for mounting chips thereon
11/07/2002	US20020163070 High frequency power device with a plastic molded package and direct bonded substrate
11/07/2002	US20020163069 Method for forming wafer level package having serpentine-shaped electrode along scribe line and package formed
11/07/2002	US20020163068 Semiconductor device
11/07/2002	US20020163067 Three-dimensionally embodied circuit with electrically connected semiconductor chips
11/07/2002	US20020163066 Semiconductor package and method for fabricating the same
11/07/2002	US20020163065 Chip carrier, and method of testing a chip using the chip carrier
11/07/2002	US20020163064 Enhanced BGA grounded heatsink
11/07/2002	US20020163063 Semiconductor device
11/07/2002	US20020163062 Multiple material stacks with a stress relief layer between a metal structure and a passivation layer
11/07/2002	US20020163060 Component of gallium arsenide and fabrication method
11/07/2002	US20020163058 Semiconductor high dielectric constant decoupling capacitor structures and process for fabrication
11/07/2002	US20020163057 Reversible field-programmable electric interconnects
11/07/2002	US20020163055 Flip-chip assembly of protected micromechanical devices
11/07/2002	US20020163047 Semiconductor device

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