H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2002
11/19/2002	US6482689 Stacked local interconnect structure and method of fabricating same
11/19/2002	US6482680 Flip-chip on lead frame
11/19/2002	US6482676 Method of mounting semiconductor chip part on substrate
11/19/2002	US6482675 Substrate strip for use in packaging semiconductor chips and method for making the substrate strip
11/19/2002	US6482674 Semiconductor package having metal foil die mounting plate
11/19/2002	US6482673 Semiconductor device, method of making the same, circuit board, flexible substrate, and method of making substrate
11/19/2002	US6482656 Method of electrochemical formation of high Tc superconducting damascene interconnect for integrated circuit
11/19/2002	US6482521 Structure with blended polymer conformal coating of controlled electrical resistivity
11/19/2002	US6482520 Thermal management system
11/19/2002	US6482262 Deposition of transition metal carbides
11/19/2002	CA2072826C Glasser for electronic substrates and products using said glasses
11/14/2002	WO2002091496A2 Reversible field-programmable electric interconnects
11/14/2002	WO2002091474A1 Semiconductor device and its manufacturing method
11/14/2002	WO2002091467A2 Protective housing for memory
11/14/2002	WO2002091466A2 An improved die mounting on a substrate
11/14/2002	WO2002091465A1 Heat radiating member
11/14/2002	WO2002091456A1 Method for the industrial production of a slot for anchoring a plastic moulding resin
11/14/2002	WO2002091450A2 Ordered two-phase dielectric film, and semiconductor device containing the same
11/14/2002	WO2002091432A2 Microelectronic structure comprising a hydrogen barrier layer
11/14/2002	WO2002091405A1 High-frequency module device
11/14/2002	WO2002091395A1 Interface materials and methods of production and use thereof
11/14/2002	WO2002090083A1 Method of producing metal insert polyphenylene sulfide resin molded component, the molded component and semiconductor producing device having it
11/14/2002	WO2002076164A3 Electronic module with fluid dissociation electrodes and methods
11/14/2002	WO2002073699A3 Nanofabrication
11/14/2002	WO2002073661A3 Extraction method of defect density and size distributions
11/14/2002	WO2002069373A9 Gallium nitride material based semiconductor devices including thermally conductive regions
11/14/2002	WO2002067291A3 Arrangement of a semi-conductor chip on a substrate
11/14/2002	WO2002065573B1 Solid electrolyte cell and production method thereof
11/14/2002	WO2002059968A3 Integrated circuits protected against reverse engineering using an apparent metal contact line terminating on field oxide and method
11/14/2002	US20020170020 Method and system of modifying integrated circuit power rails
11/14/2002	US20020169063 Protective coating of such as resorcinol, isophthalic acid and terephthalic acid copolyester; photoyellowing resistance; gloss retention; solvent resistance; recyclability
11/14/2002	US20020168872 Insulators for high density circuits
11/14/2002	US20020168871 Lossless co-planar wave guide in CMOS process
11/14/2002	US20020168845 Semiconductor copper bond pad surface protection
11/14/2002	US20020168832 Method and apparatus for marking microelectronic dies and microelectronic devices
11/14/2002	US20020168827 Suppressing electric charges generated on substrate and which flow to ground potential through substrate prevents damages to substrate due to charge-up
11/14/2002	US20020168815 Which has a manufacture-related memory cell defect pattern formed of defective memory cells, by using the memory cell defect pattern to generate a circuit identification number for the integrated circuit
11/14/2002	US20020168813 Stitch and select implementation in twin MONOS array
11/14/2002	US20020168801 Design and processing of antifuse structure
11/14/2002	US20020168799 Die mounting on a substrate
11/14/2002	US20020168798 On dielectric substrate; compact, lightweight
11/14/2002	US20020168797 Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
11/14/2002	US20020168796 Resin sealing; metal substrate
11/14/2002	US20020168795 Monitoring, transmission means encapsulated in one-piece package; integrated circuit
11/14/2002	US20020168526 Exfoliation; compression
11/14/2002	US20020168522 Nanotechnology for electronic and opto-electronic devices
11/14/2002	US20020168510 High dielectric constant composite material and multilayer wiring board using the same
11/14/2002	US20020168480 Epoxy molding materials; blend of surface modified silica in epoxy resin
11/14/2002	US20020167978 Device supporting apparatus
11/14/2002	US20020167828 Leadframe-based module DC bus design to reduce module inductance
11/14/2002	US20020167804 Polymeric encapsulation material with fibrous filler for use in microelectronic circuit packaging
11/14/2002	US20020167800 Radial Finned Heat Sink
11/14/2002	US20020167798 Heat-dissipating assembly having heat sink and dual hot-swapped fans
11/14/2002	US20020167795 Fluid-cooled heat sink for electronic components
11/14/2002	US20020167783 Flexible conductor foil with an electronic circuit
11/14/2002	US20020167581 Methods and systems for thermal-based laser processing a multi-material device
11/14/2002	US20020167348 Apparatus for adjusting input capacitance of semiconductor device and fabricating method
11/14/2002	US20020167093 Semiconductor device, resin sealing method and resin sealing device
11/14/2002	US20020167092 Interposer, packages including the interposer, and methods
11/14/2002	US20020167091 Semiconductor device having aluminum conductors
11/14/2002	US20020167089 Copper dual damascene interconnect technology
11/14/2002	US20020167088 Semiconductor device and a method of manufacturing the same
11/14/2002	US20020167085 Semiconductor device and method of fabricating the same
11/14/2002	US20020167084 Structure and method for fabrication of a leadless chip carrier with embedded antenna
11/14/2002	US20020167083 RF circuit chip, RF circuit device having the same, and manufacturing method therefor
11/14/2002	US20020167081 Semiconductor device
11/14/2002	US20020167079 Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same
11/14/2002	US20020167078 Electronic component with a semiconductor chip and method of producing an electronic component
11/14/2002	US20020167077 Flip-chip package with underfill having low density filler
11/14/2002	US20020167076 Semiconductor package and semiconductor package mounting method
11/14/2002	US20020167075 Carrier with metal bumps for semiconductor die packages
11/14/2002	US20020167074 Lead frame and bottom lead semiconductor package using the lead frame
11/14/2002	US20020167073 Semiconductor device with analysis prevention feature
11/14/2002	US20020167072 Electrostatically actuated micro-electro-mechanical devices and method of manufacture
11/14/2002	US20020167071 Guard ring for protecting integrated circuits
11/14/2002	US20020167068 Silicon on sapphire structure (devices) with buffer layer
11/14/2002	US20020167065 Semiconductor module
11/14/2002	US20020167062 Semiconductor device having a support structure
11/14/2002	US20020167060 Module and electronic device
11/14/2002	US20020167053 Charge device model protection circuit
11/14/2002	US20020167032 Semiconductor device and method for fabricating the same
11/14/2002	US20020166845 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
11/14/2002	US20020166839 Enhanced interface thermoelectric coolers with all-metal tips
11/14/2002	US20020166695 Gate area relief strip for a molded I/C package
11/14/2002	US20020166689 High frequency semiconductor device housing package and mounting structure for mounting the same
11/14/2002	US20020166688 Microelectronic connections with liquid conductive elements
11/14/2002	US20020166687 Encapsulation arrangement
11/14/2002	US20020166686 Sheet for electronic parts and method of producing the same
11/14/2002	US20020166684 Ceramic multilayer circuit boards mounted on a patterned metal support substrate and method of making
11/14/2002	US20020166681 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
11/14/2002	US20020166680 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
11/14/2002	US20020166660 Anisotropic thermal solution
11/14/2002	US20020166658 Graphite-based thermal dissipation component
11/14/2002	US20020166654 Finned Heat Sink Assemblies
11/14/2002	US20020166358 Production method of multi-gauge strips
11/14/2002	DE10218155A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
11/14/2002	DE10160088A1 Chipträger und Verfahren zum Testen eines Chips, das den Chipträger verwendet Chip carrier and a method for testing chips using the chip carrier
11/14/2002	DE10152202A1 Production of copper metallization comprises preparing contact region in substrate, opening hole through an insulating layer to contact region, depositing tantalum carbide nitride barrier layer in hole, and depositing layer of copper
11/14/2002	DE10144207A1 Structure for rapid data transfer via glass fibers/optical waveguides has electronic semiconductor circuits to group single semiconductor circuits and a common carrier metallized to produce electrically conductive contacts.
11/14/2002	DE10142116A1 Electronic component used as logical unit comprises first semiconductor chip and second semiconductor chip each having contact surfaces on their active surfaces, substrate with contact connection surfaces and external contact surfaces

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