H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2002
11/14/2002	DE10139986A1 Electronic component comprises a semiconductor chip having an active front side with semiconductor structures and a passive rear side without semiconductor structures
11/14/2002	DE10129846C1 Process for electrically contacting switching elements used in communications networks comprises applying a first layer on a first switching component, forming a hole in the first layer, and further processing
11/14/2002	DE10122837A1 Power semiconductor module terminal elements, protruding from surface of housing
11/14/2002	DE10122721A1 Stacked structure for an image sensor has substrates forming an enclosed space in which sensor is located
11/14/2002	DE10122720A1 Stack arrangement for an image sensor chip for electrically connecting to a circuit board
11/14/2002	DE10122393A1 Flexible Leiterfolie mit einer elektronischen Schaltung Flexible conductor film with an electronic circuit
11/14/2002	DE10122324A1 Flexible integrierte monolithische Schaltung Flexible integrated monolithic circuit
11/14/2002	DE10121549A1 Bauelement auf GaAs und Herstellungsverfahren On GaAs device and manufacturing method
11/14/2002	DE10121495A1 Conductor strip arrangement comprises a first layer made from a first insulating material, a conductor strip arranged on the first layer and made from an electrically conducting material, and a second layer arranged on the exposed surface
11/14/2002	DE10120520A1 Halbleiterbauelement und Herstellungsverfahren A semiconductor device and manufacturing method
11/14/2002	DE10120402A1 Housing for power semiconductor module with plastics body
11/14/2002	DE10120257A1 Anschlußträger für ein elektronisches Bauelement und Verfahren zu dessen Herstellung Terminal carrier for an electronic component and method for its production
11/14/2002	CA2442034A1 Interface materials and methods of production and use thereof
11/13/2002	EP1257156A2 Flexible conductor foil comprising an electronic circuit
11/13/2002	EP1257004A1 Metal article with multilayer coating
11/13/2002	EP1256983A2 Flexible integrated monolithic circuit
11/13/2002	EP1256982A1 Electronic Module and its Assembling Process
11/13/2002	EP1256981A1 Metal article coated with near-surface doped tin or tin alloy
11/13/2002	EP1256980A2 Ball grid array package with a heat spreader and method for making the same
11/13/2002	EP1256979A1 Passivation layer on a semiconductor device with a ferroelectric layer
11/13/2002	EP1256978A2 Method of forming low dielectric constant insulation film for semiconductor device
11/13/2002	EP1256264A1 Cooling device
11/13/2002	EP1256263A2 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management
11/13/2002	EP1256262A1 Package for microwave components
11/13/2002	EP1256163A1 Rectifier system
11/13/2002	EP1256131A1 Leadframe interposer
11/13/2002	EP1256130A2 Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessor
11/13/2002	EP1256129A1 Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation
11/13/2002	EP1256128A1 Encapsulation for an electrical component and method for producing the same
11/13/2002	EP1256125A1 Electron beam modification of cvd deposited films, forming low dielectric constant materials
11/13/2002	EP0891648B1 Gas-insulated high-voltage semiconductor valve means
11/13/2002	EP0878024A4 Adaptable mmic array
11/13/2002	CN2520567Y Backplate of radiator
11/13/2002	CN2520522Y Air shield fastener structure of heat sink
11/13/2002	CN1379617A 半导体器件 Semiconductor devices
11/13/2002	CN1379616A Multi layer circuit board and its manufacturing method
11/13/2002	CN1379509A Terminal used on electric connector and terminal member having carrier
11/13/2002	CN1379478A Semiconductor device
11/13/2002	CN1379469A Ring semiconductor controlled rectifier assembly
11/13/2002	CN1379468A Electrostatic protector of chip
11/13/2002	CN1379467A Semiconductor package
11/13/2002	CN1379466A Connecting pad with insulation intensifying structure and its making method
11/13/2002	CN1379465A Fin type heat radiator
11/13/2002	CN1379450A Formation method of insulating film and manufacturing method of semiconductor device
11/13/2002	CN1379304A Cooling apparatus equipped with radiator
11/13/2002	CN1094257C 半导体器件封装 The semiconductor device package
11/13/2002	CN1094253C 半导体装置之金属布线制造方法 The method of manufacturing a metal wiring of a semiconductor device
11/13/2002	CN1094252C 半导体器件和制造半导体器件的方法 The method of manufacturing a semiconductor device and a semiconductor device
11/12/2002	US6480989 Integrated circuit design incorporating a power mesh
11/12/2002	US6480986 IC substrate noise modeling including extracted capacitance for improved accuracy
11/12/2002	US6480577 Active matrix substrate, method of manufacturing same, and flat-panel image sensor
11/12/2002	US6480514 Device for cooling diode lasers
11/12/2002	US6480472 Mobile station supervision of the forward dedicated control channel when in the discontinuous transmission mode
11/12/2002	US6480388 Back plate assembly for motherboard
11/12/2002	US6480387 Heat sink assembly
11/12/2002	US6480386 Heat sink assembly with pressing wedges
11/12/2002	US6480385 Electronic assembly and cooling thereof
11/12/2002	US6480384 Clip for heat sink
11/12/2002	US6480383 Electronic component cooling apparatus
11/12/2002	US6480017 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing
11/12/2002	US6479974 Stacked voltage rails for low-voltage DC distribution
11/12/2002	US6479904 Semiconductor device with registration accuracy measurement mark
11/12/2002	US6479903 Flip chip thermally enhanced ball grid array
11/12/2002	US6479902 Semiconductor catalytic layer and atomic layer deposition thereof
11/12/2002	US6479901 Semiconductor device having interconnected external electrode pads and wire bonding pads
11/12/2002	US6479900 Semiconductor device and method of manufacturing the same
11/12/2002	US6479898 Dielectric treatment in integrated circuit interconnects
11/12/2002	US6479895 High performance air cooled heat sinks used in high density packaging applications
11/12/2002	US6479894 Layout method for thin and fine ball grid array package substrate with plating bus
11/12/2002	US6479893 Ball-less clip bonding
11/12/2002	US6479890 Semiconductor microsystem embedded in flexible foil
11/12/2002	US6479889 Semiconductor device package, and fabrication method thereof
11/12/2002	US6479888 Semiconductor device and a method of manufacturing the same
11/12/2002	US6479887 Circuit pattern tape for wafer-scale production of chip size semiconductor packages
11/12/2002	US6479886 Integrated circuit package with EMI shield
11/12/2002	US6479884 Interim oxidation of silsesquioxane dielectric for dual damascene process
11/12/2002	US6479883 Electrostatic discharge protection circuit
11/12/2002	US6479873 Semiconductor device with self-aligned contact structure
11/12/2002	US6479870 ESD device with salicide layer isolated by shallow trench isolation for saving one salicide block photomask
11/12/2002	US6479845 Pattern for routing power and ground for an integrated circuit chip
11/12/2002	US6479760 Printed wiring board for semiconductor plastic package
11/12/2002	US6479759 Submount, electronic assembly and process for producing the same
11/12/2002	US6479758 Wiring board, semiconductor package and semiconductor device
11/12/2002	US6479756 Flexible wiring substrate and its manufacturing method
11/12/2002	US6479409 Fabrication of a semiconductor device with an interlayer insulating film formed from a plasma devoid of an oxidizing agent
11/12/2002	US6479408 Semiconductor device and method of manufacturing the same
11/12/2002	US6479407 Semiconductor device and process for producing the same
11/12/2002	US6479402 Method to improve adhesion of molding compound by providing an oxygen rich film over the top surface of a passivation layer
11/12/2002	US6479395 Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
11/12/2002	US6479384 Process for fabricating a semiconductor device
11/12/2002	US6479382 Dual-sided semiconductor chip and method for forming the chip with a conductive path through the chip that connects elements on each side of the chip
11/12/2002	US6479380 Semiconductor device and manufacturing method thereof
11/12/2002	US6479379 Self-aligned etch stop for polycrystalline silicon plugs on a semiconductor device
11/12/2002	US6479378 Process for forming electrical interconnects in integrated circuits
11/12/2002	US6479377 Method for making semiconductor devices having contact plugs and local interconnects
11/12/2002	US6479376 Process improvement for the creation of aluminum contact bumps
11/12/2002	US6479375 Method of forming a semiconductor device having a non-peeling electrode pad portion
11/12/2002	US6479366 Method of manufacturing a semiconductor device with air gaps formed between metal leads
11/12/2002	US6479348 Method of making memory wordline hard mask extension
11/12/2002	US6479342 Semiconductor devices and manufacturing methods thereof

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