H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2002
11/21/2002	US20020170746 Organic packages with solders for reliable flip chip connections
11/21/2002	US20020170743 Integrated inductance
11/21/2002	US20020170742 Conductive wiring layer structure
11/21/2002	US20020170705 Evaporator of CPL cooling apparatus having fine wick structure
11/21/2002	US20020170703 Heat-dissipating module
11/21/2002	US20020170702 Method of cooling devices
11/21/2002	US20020170660 Method for producing ceramic substrate
11/21/2002	US20020170593 Non-stoichiometric non- equilibrium material, and the material is a nanostructured material.
11/21/2002	US20020170173 Method of production of circuit board, semiconductor device, and plating system
11/21/2002	DE10218767A1 Elektronischer Baustein für die Oberflächenmontage Electronic component for surface mount
11/21/2002	DE10138042A1 Electronic component has at least one semiconducting chip on first side of and electrically connected to wiring plate, conducting track structures and solder connection contacts on other side
11/21/2002	DE10130602A1 Arrangement with semiconducting chip has first wire end connected to second nailhead contact with chip connection pad, second end connected to first nailhead contact by wedge contact
11/21/2002	DE10124047A1 Electronic component comprises a semiconductor chip arranged a system support with inner flat conductor sections having a metal alloy plating on the contact connecting surfaces
11/21/2002	DE10123456A1 Heat exchanger consists of open pored metal foam, whereby at least some cells contained in metal foam are connected together so that fluid medium can flow through metal foam
11/21/2002	DE10123232A1 Semiconductor module used as a MOSFET, JFET or thyristor has a damping material having electromagnetically damping properties provided in a sealing composition arranged within a housing
11/21/2002	DE10122221A1 Power electronics module with base plate and substrate soldered to it has base plate recess with at least dimensions of substrate and with wall regions inclined from out to in
11/20/2002	EP1259103A1 Multilayer printed wiring board and method for producing multilayer printed wiring board
11/20/2002	EP1258921A2 Angle mounted fan-sink
11/20/2002	EP1258181A1 Device for accommodating electronic components
11/20/2002	EP1258040A1 Vertical conduction flip-chip device with bump contacts on single surface
11/20/2002	EP1257877A2 Method of using optical proximity effects to create electrically blown fuses with sub-critical dimension neck downs
11/20/2002	EP0995348B1 Clamping device, tool and method of mounting tools
11/20/2002	EP0920422B1 Crytalline form of 4-[5-methyl-3-phenylisoxazol-4-yl]benzenesulfonamide
11/20/2002	CN2521757Y Overlay crystal welding pad allocation on chip for reducing impedance
11/20/2002	CN2521756Y Ball lock array IC socket with slit tube clamping tin ball
11/20/2002	CN2521755Y Combined radiator
11/20/2002	CN2521753Y Overlay crystal chip conducting scab and redistribution lead wire layer allocation
11/20/2002	CN2521651Y Central processor radiator
11/20/2002	CN1381160A Method for producing ceramic substrate
11/20/2002	CN1381071A Integrated circuit with programmable memory element
11/20/2002	CN1381070A Semiconductor device, method of manufacture thereof, circuit board and electronic device
11/20/2002	CN1381069A Module with built-in electronic elements and method of manufacture thereof
11/20/2002	CN1380694A Static discharge protection component capable of recording static discharge
11/20/2002	CN1380693A Static discharge buffer device
11/20/2002	CN1380692A Semiconductor device having test elements
11/20/2002	CN1380691A Base plate connection sheet for sphere grid several-group type chip packaging structure
11/20/2002	CN1380666A Surface-mounted capacitor
11/20/2002	CN1380665A Ceramic electronic element
11/20/2002	CN1094655C Forming polyimide coatings by screen printing method
11/19/2002	US6484307 Method for fabricating and checking structures of electronic circuits in a semiconductor substrate
11/19/2002	US6484302 Auto-contactor system and method for generating variable size contacts
11/19/2002	US6484301 System for and method of efficient contact pad identification
11/19/2002	US6484060 Layout for measurement of overlay error
11/19/2002	US6483718 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
11/19/2002	US6483714 Multilayered wiring board
11/19/2002	US6483708 Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
11/19/2002	US6483707 Heat sink and thermal interface having shielding to attenuate electromagnetic interference
11/19/2002	US6483706 Heat dissipation for electronic components
11/19/2002	US6483705 Electronic module including a cooling substrate and related methods
11/19/2002	US6483703 Retaining clamp for cooling fins
11/19/2002	US6483702 Apparatus and methods for attaching thermal spreader plate to an electronic card
11/19/2002	US6483692 Capacitor with extended surface lands and method of fabrication therefor
11/19/2002	US6483669 Integrated lead suspension with IC chip and method of manufacture
11/19/2002	US6483652 Method for producing solid-state imaging device
11/19/2002	US6483406 High-frequency module using slot coupling
11/19/2002	US6483401 Substrate for packaging electronic component and piezoelectric resonance component using the same
11/19/2002	US6483374 Semiconductor integrated circuit
11/19/2002	US6483328 Probe card for probing wafers with raised contact elements
11/19/2002	US6483193 Fabrication process for a semiconductor device with damascene interconnect lines of the same level separated by insulators with different dielectric constants
11/19/2002	US6483192 Semiconductor device and method of manufacturing the same
11/19/2002	US6483191 Semiconductor device having reinforced coupling between solder balls and substrate
11/19/2002	US6483190 Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method
11/19/2002	US6483189 Semiconductor device
11/19/2002	US6483188 Rf integrated circuit layout
11/19/2002	US6483187 Heat-spread substrate
11/19/2002	US6483186 High power monolithic microwave integrated circuit package
11/19/2002	US6483185 Power module substrate, method of producing the same, and semiconductor device including the substrate
11/19/2002	US6483184 Semiconductor apparatus substrate, semiconductor apparatus, and method of manufacturing thereof and electronic apparatus
11/19/2002	US6483182 Integrated-circuit case
11/19/2002	US6483181 Multi-chip package
11/19/2002	US6483180 Lead frame design for burr-free singulation of molded array packages
11/19/2002	US6483179 Solid-state image pickup apparatus and fabricating method thereof
11/19/2002	US6483178 Semiconductor device package structure
11/19/2002	US6483177 Leaded semiconductor packages and method of trimming and singulating such packages
11/19/2002	US6483176 Semiconductor with multilayer wiring structure that offer high speed performance
11/19/2002	US6483175 Wiring board and semiconductor device using the same
11/19/2002	US6483173 Solution to black diamond film delamination problem
11/19/2002	US6483170 RF power transistor
11/19/2002	US6483169 Extruded heat spreader
11/19/2002	US6483166 Semiconductor configuration having an optical fuse
11/19/2002	US6483162 Semiconductor device having improved metal line structure and manufacturing method therefor
11/19/2002	US6483160 Micromechanical enclosure
11/19/2002	US6483147 Through wafer backside contact to improve SOI heat dissipation
11/19/2002	US6483138 Semiconductor apparatus formed by SAC (self-aligned contact)
11/19/2002	US6483128 Connecting device for power semiconductor modules with compensation for mechanical stresses
11/19/2002	US6483045 Via plug layout structure for connecting different metallic layers
11/19/2002	US6483044 Interconnecting substrates for electrical coupling of microelectronic components
11/19/2002	US6483043 Chip assembly with integrated power distribution between a wafer interposer and an integrated circuit chip
11/19/2002	US6483042 Substrate for mounting semiconductor integrated circuit device
11/19/2002	US6483040 Package and method of manufacturing the same
11/19/2002	US6483039 Substrate of semiconductor package
11/19/2002	US6483038 Memory card
11/19/2002	US6483030 Snap lid image sensor package
11/19/2002	US6482990 Prostaglandin E analogues
11/19/2002	US6482741 Copper wiring structure comprising a copper material buried in a hollow of an insulating film and a carbon layer between the hollow and the copper material in semiconductor device and method fabricating the same
11/19/2002	US6482735 Method for improved metal fill by treatment of mobility layers
11/19/2002	US6482734 Diffusion barrier layer for semiconductor device and fabrication method thereof
11/19/2002	US6482733 Protective layers prior to alternating layer deposition
11/19/2002	US6482730 Method for manufacturing a semiconductor device
11/19/2002	US6482702 Method of forming and recognizing an identification mark for read-only memory

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