Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2002
11/21/2002WO2002093646A1 Carrier with metal bumps for semiconductor die packages
11/21/2002WO2002093645A1 Improved surface mount package
11/21/2002WO2002093644A2 Heat exchanger
11/21/2002WO2002093643A1 High performance heat sink for printed circuit boards
11/21/2002WO2002093642A2 Integrated sensor packaging and methods of making the same
11/21/2002WO2002093637A2 Product comprising a substrate and a chip attached to the substrate
11/21/2002WO2002093185A1 Wafer map display apparatus and method for semiconductor test system
11/21/2002WO2002092897A1 Thermal management material, devices and methods therefor
11/21/2002WO2002092878A2 Electroless plating method and device, and substrate processing method and apparatus
11/21/2002WO2002084736A8 Microelectronic spring with additional protruding member
11/21/2002WO2002081981A3 Thermoelectric device for dna genomic and proteonic chips and thermo-optical seitching circuits
11/21/2002WO2002069680A3 Adapter for plastic-leaded chip carrier (plcc) and other surface mount technology (smt) chip carriers
11/21/2002WO2002069368A3 Multiple material stacks with a stress relief layer between a metal structure and a passivation layer and method
11/21/2002WO2002066256A3 Process for the manufacture of printed circuit boards with plated resistors
11/21/2002WO2002061825A3 Electronic assembly with high capacity thermal interface and methods of manufacture
11/21/2002WO2002058143A9 Cvd diamond enhanced microprocessor cooling system
11/21/2002WO2002052633A3 Assembly for mounting an integrated circuit on a support
11/21/2002WO2002045165A3 Compact semiconductor structure and a method for producing the same
11/21/2002WO2002025732A3 Power module with integrated capacitor
11/21/2002WO2002017362A8 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
11/21/2002WO2002001630A3 Hermetic high frequency module and method for producing the same
11/21/2002US20020173930 Method and device for determining an operating temperature of a semiconductor component
11/21/2002US20020173306 Methods & systems for providing information to a home system regarding a wireless unit roaming in a visited system
11/21/2002US20020173192 Power semiconductor module with pressure contact means
11/21/2002US20020173175 Interposer member having apertures for relieving stress and increasing contact compliancy
11/21/2002US20020173146 Metal plated spring structure
11/21/2002US20020173144 Method of manufacturing a semiconductor device
11/21/2002US20020173142 Etching opening in dielectric; forming barrier
11/21/2002US20020173133 Overcoating semiconductor with bonding pads; passivation layer; cutting into chips
11/21/2002US20020173132 Integrated circuit having an antifuse and a method of manufacture
11/21/2002US20020173116 Photolithography; vapor deposition
11/21/2002US20020173096 Semiconductor integrated circuit and method of manufacturing same
11/21/2002US20020173082 Method of fabricating tape attachment chip-on-board assemblies
11/21/2002US20020173081 Bonding carrier to circuit; wire bonding; applying ultrasonic frequency
11/21/2002US20020173077 Heat conductive stiffeners; heat dissipation; die bonding
11/21/2002US20020173076 Multilayer laminate; high capacitance; wire bonding pad; sealing
11/21/2002US20020173075 Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor
11/21/2002US20020173073 Fabricating process for forming multi-layered metal bumps by electroless plating
11/21/2002US20020173071 Multilayer metal sheets; photosensitive chips; radiation transparent glues
11/21/2002US20020173070 Semiconductors packages
11/21/2002US20020173069 Multilayer, semiconductor substrate; polyimide dielectric; adhesive and protective coatings
11/21/2002US20020173056 Measuring deformation angle
11/21/2002US20020173055 For disconnecting (via cutting fuses) a defective memory cell; photoresists; semiconductors
11/21/2002US20020172826 Nanoscale catalyst compositions from complex and non-stoichiometric compositions
11/21/2002US20020172820 Lasers
11/21/2002US20020172811 Laminated diffusion barrier
11/21/2002US20020172768 Irradiating alternately an organometal compound as a source material and either of oxygen radicals, nitrogen radicals and a mixture of oxygen radicals and nitrogen radicals as an oxidizing or nitriding agent for depositing monoatomic layer
11/21/2002US20020172245 Semiconductor laser array
11/21/2002US20020172026 Electronic package with high density interconnect and associated methods
11/21/2002US20020172025 Structure and method for fabrication of a leadless chip carrier with embedded inductor
11/21/2002US20020172024 Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged
11/21/2002US20020172022 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
11/21/2002US20020172021 Multi-layer wiring substrate
11/21/2002US20020172011 Electronic unit having desired heat radiation properties
11/21/2002US20020172008 High-performance heat sink for printed circuit boards
11/21/2002US20020172007 Spray evaporative cooling system and method
11/21/2002US20020171157 Electronic device
11/21/2002US20020171156 Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment
11/21/2002US20020171154 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
11/21/2002US20020171153 Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding
11/21/2002US20020171152 Flip-chip-type semiconductor device and manufacturing method thereof
11/21/2002US20020171151 Method for forming interconnects on semiconductor substrates and structures formed
11/21/2002US20020171149 Structure for connecting interconnect lines with interposed layer including metal layers and metallic compound layer
11/21/2002US20020171147 Structure of a dual damascene via
11/21/2002US20020171146 Compound structure for reduced contact resistance
11/21/2002US20020171145 BGA type semiconductor device, tape carrier for semiconductor device, and semiconductor device using said tape carrier
11/21/2002US20020171144 Die-up ball grid array package with a heat spreader and method for making the same
11/21/2002US20020171143 Bumped die and wire bonded board-on-chip package
11/21/2002US20020171142 Integrated circuits, minimizing electromigration failure and degradation of an interconnect structure formed in porous low-K dielectric material.
11/21/2002US20020171141 Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set
11/21/2002US20020171140 Tape carrier package (TCP) on which semiconductor chips are mounted and method of manufacuturing the same
11/21/2002US20020171139 High performance air cooled heat sinks used in high density packaging applications
11/21/2002US20020171138 Multilayer wiring board and semiconductor device
11/21/2002US20020171137 Semiconductor package substrate, semiconductor package
11/21/2002US20020171136 Semiconductor device with stack of semiconductor chips
11/21/2002US20020171135 Semiconductor device and package with high heat radiation effect
11/21/2002US20020171134 Electrically isolated power device package
11/21/2002US20020171133 Systems for testing and packaging integrated circuits
11/21/2002US20020171132 Reworkable and thermally conductive adhesive and use thereof
11/21/2002US20020171131 Component and method for manufacture
11/21/2002US20020171130 Tape carrier package
11/21/2002US20020171129 Ball grid array substrate strip with warpage-preventive linkage structure
11/21/2002US20020171128 Semiconductor device and method for producing the same
11/21/2002US20020171127 Apparatus for routing signals
11/21/2002US20020171126 Power chip scale package
11/21/2002US20020171124 Insulators for high density circuits
11/21/2002US20020171120 Semiconductor device
11/21/2002US20020171119 Semiconductor device with copper fuse section
11/21/2002US20020171117 Integrated circuit device
11/21/2002US20020171115 High frequency semiconductor device
11/21/2002US20020171112 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration
11/21/2002US20020171111 Semiconductor device
11/21/2002US20020171109 Semiconductor device with SOI structure and method of manufacturing the same
11/21/2002US20020171098 Semiconductor device
11/21/2002US20020170944 Void-free die attachment method with low melting metal
11/21/2002US20020170942 Method for forming a flip chip semiconductor package
11/21/2002US20020170901 Equipotential fault tolerant integrated circuit heater
11/21/2002US20020170898 High-speed, precision, laser-based method and system for processing material of one or more targets within a field
11/21/2002US20020170883 Prevents crystal original pits effects during particle measurement.
11/21/2002US20020170748 Capacitor plate for substrate components
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