Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2002
11/27/2002CN1381890A Semiconductor device and its manufacturing method
11/27/2002CN1381889A IC package and its preparing process
11/27/2002CN1381888A Wiring pad with edge reinforcing structure for integrated circuit
11/27/2002CN1381887A Wiring pad with edge-reinforcing structure
11/27/2002CN1381886A Semiconductor device and packaging and its manufacturing method
11/27/2002CN1381885A I/O port with high voltage tolerance and electrostatic discharge protection circuit
11/27/2002CN1381850A Surface mounted high-molecular based circuit protector and its preparing process
11/27/2002CN1095318C Radiator by using oppositelly bonded fins to form ducts and cooling systme to multi-microprocessor by using blower
11/27/2002CN1095202C Semiconductor device and method for producing semiconductor device
11/27/2002CN1095201C Electronic package with thermally conductive support member and manufacturing method thereof
11/27/2002CN1095199C Method of fabricating semiconductor device with cavity interposed between wirings
11/27/2002CN1095197C 半导体晶片 Semiconductor wafer
11/26/2002US6487712 Method of manufacturing mask for conductive wirings in semiconductor device
11/26/2002US6487088 Package substrate
11/26/2002US6487086 Circuit module
11/26/2002US6487085 High-frequency module and method of manufacturing the same
11/26/2002US6487079 Heat sink and mounting structure for heat sink
11/26/2002US6487077 Heat dissipating device adapted to be applied to a flip chip device
11/26/2002US6487076 Compact heat sink module
11/26/2002US6487073 Thermally conductive electronic device case
11/26/2002US6486829 Integrated electronic circuit comprising an oscillator with passive circuit elements
11/26/2002US6486692 Method of positive mobile iron contamination (PMIC) detection and apparatus of performing the same
11/26/2002US6486682 Determination of dielectric constants of thin dielectric materials in a MOS (metal oxide semiconductor) stack
11/26/2002US6486565 Semiconductor device
11/26/2002US6486564 Heat dissipation module for a BGA IC
11/26/2002US6486563 Wafer scale packaging scheme
11/26/2002US6486562 Circuit device with bonding strength improved and method of manufacturing the same
11/26/2002US6486560 Semiconductor device fabricated by a method of reducing electromigration in copper lines by forming an interim layer of calcium-doped copper seed layer in a chemical solution
11/26/2002US6486559 Copper wiring structure comprising a copper material buried in a hollow of an insulating film and a carbon layer between the hollow and the copper material in semiconductor device and method of fabricating the same
11/26/2002US6486558 Semiconductor device having a dummy pattern
11/26/2002US6486557 Hybrid dielectric structure for improving the stiffness of back end of the line structures
11/26/2002US6486556 Interconnection layer layout comprising cut-out conductive lines that ensure proper profile of overlying passivation layer
11/26/2002US6486555 Semiconductor device having a contact structure using aluminum
11/26/2002US6486554 Molded body for PBGA and chip-scale packages
11/26/2002US6486553 Semiconductor device with increased connection strength between solder balls and wiring layer
11/26/2002US6486551 Wired board and method of producing the same
11/26/2002US6486548 Semiconductor module and power converting apparatus using the module
11/26/2002US6486547 Microelectronic assembly incorporating lead regions defined by gaps in a polymeric sheet
11/26/2002US6486545 Pre-drilled ball grid array package
11/26/2002US6486544 Semiconductor device and method manufacturing the same, circuit board, and electronic instrument
11/26/2002US6486543 Packaged semiconductor device having bent leads
11/26/2002US6486542 Semiconductor-supporting devices, processes for the production of the same, joined bodies and processes for the production of the same
11/26/2002US6486541 Semiconductor device and fabrication method
11/26/2002US6486540 Three-dimensional semiconductor device and method of manufacturing the same
11/26/2002US6486539 Compression layer on the leadframe to reduce stress defects
11/26/2002US6486538 Chip carrier having ventilation channels
11/26/2002US6486537 Semiconductor package with warpage resistant substrate
11/26/2002US6486536 U-shape tape for BOC FBGA package to improve moldability
11/26/2002US6486535 Electronic package with surface-mountable device built therein
11/26/2002US6486534 Integrated circuit die having an interference shield
11/26/2002US6486533 Metallization structures for microelectronic applications and process for forming the structures
11/26/2002US6486531 Contact structure with a lower interconnection having t-shaped portion in cross section and method for forming the same
11/26/2002US6486529 Structure of merged vertical capacitor inside spiral conductor for RF and mixed-signal applications
11/26/2002US6486528 Silicon segment programming apparatus and three terminal fuse configuration
11/26/2002US6486527 Vertical fuse structure for integrated circuits containing an exposure window in the layer over the fuse structure to facilitate programming thereafter
11/26/2002US6486526 Crack stop between neighboring fuses for protection from fuse blow damage
11/26/2002US6486515 ESD protection network used for SOI technology
11/26/2002US6486514 Wiring line assembly for thin film transistor array substrate and a method for fabricating the same
11/26/2002US6486506 Flash memory with less susceptibility to charge gain and charge loss
11/26/2002US6486497 Liquid crystal device, projection type display device and driving circuit
11/26/2002US6486494 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof
11/26/2002US6486415 Compliant layer for encapsulated columns
11/26/2002US6486085 Aluminum nitride sintered bodies and semiconductor-producing members including same
11/26/2002US6486077 Silicon nitride film, semiconductor device, and method for fabricating semiconductor device
11/26/2002US6486066 Method of generating integrated circuit feature layout for improved chemical mechanical polishing
11/26/2002US6486063 Semiconductor device manufacturing method for a copper connection
11/26/2002US6486059 Dual damascene process using an oxide liner for a dielectric barrier layer
11/26/2002US6486056 Process for making integrated circuit structure with thin dielectric between at least local interconnect level and first metal interconnect level
11/26/2002US6486053 Semiconductor device and fabricating method therefor
11/26/2002US6486052 Package having terminated plating layer and its manufacturing method
11/26/2002US6486051 Method for relieving bond stress in an under-bond-pad resistor
11/26/2002US6486049 Method of fabricating semiconductor devices with contact studs formed without major polishing defects
11/26/2002US6486036 Method and apparatus for process control of alignment in dual damascene processes
11/26/2002US6486026 Method of forming DRAM circuitry
11/26/2002US6486018 Methods of electrically contacting to conductive plugs, methods of forming contact openings, and methods of forming dynamic random access memory circuitry
11/26/2002US6486006 Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection
11/26/2002US6486005 Semiconductor package and method for fabricating the same
11/26/2002US6486004 Method and apparatus for application of spray adhesive to a leadframe for chip bonding
11/26/2002US6486003 Expandable interposer for a microelectronic package and method therefor
11/26/2002US6486002 Tape design to reduce warpage
11/26/2002US6486001 Fabricating method of semiconductor device
11/26/2002US6486000 Semiconductor package and fabricating method thereof
11/26/2002US6485999 Wiring arrangements having electrically conductive cross connections and method for producing same
11/26/2002US6485992 Process for making wafers for ion implantation monitoring
11/26/2002US6485843 Apparatus and method for mounting BGA devices
11/26/2002US6485816 Laminated radiation member, power semiconductor apparatus, and method for producing the same
11/26/2002US6485815 Multi-layered dielectric layer including insulating layer having Si-CH3 bond therein and method for fabricating the same
11/26/2002US6485814 High density thin film circuit board and method of production thereof
11/26/2002US6485778 Maintaining a level surface on a pool of adhesive material for applying the adhesive material to the lead fingers by contacting the lead fingers with the pool of adhesive material
11/26/2002US6484948 Authentication method, authentication apparatus, authentication system and IC card
11/26/2002US6484922 Apparatus and method of clamping semiconductor devices using sliding finger supports
11/26/2002US6484708 Resin sealed electronic device
11/26/2002US6484521 Spray cooling with local control of nozzles
11/26/2002US6484395 Ultra-miniature electrical contacts and method of manufacture
11/26/2002US6484394 Encapsulation method for ball grid array semiconductor package
11/24/2002CA2387252A1 Electronic device having dewing prevention structure and dewing prevention structure of electronic device
11/21/2002WO2002093994A2 Method and apparatus for cooling electronic components
11/21/2002WO2002093649A2 Electronic module and method for assembling same
11/21/2002WO2002093648A2 Semiconductor device interconnect
11/21/2002WO2002093647A2 Electronic package with high density interconnect and associated methods
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