H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2002
11/28/2002	US20020175741 Device and method for limiting the extent to which circuits in integrated circuit dice electrically load bond pads and other circuit nodes in the dice
11/28/2002	US20020175438 Apparatus and method for filling high aspect ratio via holes in electronic substrates
11/28/2002	US20020175426 Semiconductor device and method of production of same
11/28/2002	US20020175425 Semiconductor device having an integral protection circuit
11/28/2002	US20020175424 Process of forming metal surfaces compatible with a wire bonding and semiconductor integrated circuits manufactured by the process
11/28/2002	US20020175423 High performance silicon contact for flip chip
11/28/2002	US20020175422 Flip-chip with matched lines and ground plane
11/28/2002	US20020175421 Semiconductor device
11/28/2002	US20020175420 Method of reducing junction spiking through a wall surface of an overetched contact via
11/28/2002	US20020175419 Electropolishing metal layers on wafers having trenches or vias with dummy structures
11/28/2002	US20020175418 Ultra thin, single phase, diffusion barrier for metal conductors
11/28/2002	US20020175417 Semiconductor device having a dual damascene interconnect spaced from a support structure
11/28/2002	US20020175416 Semiconductor device and blowout method of fuse
11/28/2002	US20020175415 Semiconductor device having multi-layered wiring
11/28/2002	US20020175414 Novel copper metal structure for the reduction of intra-metal capacitance
11/28/2002	US20020175411 Bonding pad
11/28/2002	US20020175410 BGA substrate via structure
11/28/2002	US20020175409 Semiconductor device and method for fabricating the semiconductor device
11/28/2002	US20020175408 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
11/28/2002	US20020175407 Flip chip package, circuit board thereof and packaging method thereof
11/28/2002	US20020175406 Dual die memory
11/28/2002	US20020175405 Insulators for high density circuits
11/28/2002	US20020175404 Electronic device having dewing prevention structure and dewing prevention structure of electronic device
11/28/2002	US20020175403 Thermal interface material and heat sink configuration
11/28/2002	US20020175402 Structure and method of embedding components in multi-layer substrates
11/28/2002	US20020175401 Semiconductor package with stacked chips
11/28/2002	US20020175399 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
11/28/2002	US20020175398 Slot apparatus for programmable multi-chip module
11/28/2002	US20020175397 Wiring substrate and method for producing the same
11/28/2002	US20020175396 Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same
11/28/2002	US20020175395 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof
11/28/2002	US20020175387 Optical electronic apparatus and method for producing the same
11/28/2002	US20020175381 Semiconductor device having chamfered silicide layer and method for manufacturing the same
11/28/2002	US20020175379 Polysilicon resistor semiconductor device
11/28/2002	US20020175378 SOI substrate having an etch stop layer, and fabrication method thereof, SOI integrated circuit fabricated thereon, and method of fabricating SOI integrated circuit using the same
11/28/2002	US20020175362 Use of ALN as copper passivation layer and thermal conductor
11/28/2002	US20020175326 Sub-nanoscale electronic devices and processes
11/28/2002	US20020175316 For accelerating heat conductance; tin, bismuth, indium, and lead alloys formed via heat treatment; adhesion
11/28/2002	US20020175298 Method of manufacturing semiconductor device
11/28/2002	US20020175204 Sealing system for electronic device and sealing method therefor
11/28/2002	US20020175153 Circuit and method for heating an adhesive to package or rework a semiconductor die
11/28/2002	US20020174997 Conductive cap, electronic component, and method of forming insulating film of conductive cap
11/28/2002	US20020174980 Vortex heatsink for high performance thermal applications
11/28/2002	US20020174947 Thermoplastic adhesive preform for heat sink attachment
11/28/2002	US20020174660 Thin-film thermoelectric cooling and heating devices for DNA genomic and proteomic chips, thermo-optical switching circuits, and IR tags
11/28/2002	US20020174627 Surface package type semiconductor package and method of producing semiconductor memory
11/28/2002	DE10163429A1 HF-Schaltungschip, HF-Schaltungsvorrichtung mit HF-Schaltungschip und Herstellungsverfahren davon RF circuit chip, RF circuit device having RF circuit die and production method thereof
11/28/2002	DE10144462C1 Electronic component used as a semiconductor component comprises a passive component, and a semiconductor chip electrically connected to a wiring structure
11/28/2002	DE10128271C1 Diode manufacturing method uses shaker with reception openings for alignment of diode chips before adhering to lower conductor layers provided by base plate
11/28/2002	DE10124970A1 Electronic component has a semiconductor chip mounted on a semiconductor chip connecting plate in the center of a flat lead frame of the support
11/28/2002	DE10123362A1 Wafer for electronic chip manufacture has electronic chips and memory device with stored classification map with position and classification information for at least one part of chip
11/28/2002	DE10122363A1 Halbleitermodul Semiconductor module
11/28/2002	DE10121970A1 Leistungshalbleitermodul in Druckkontaktierung Power semiconductor module in pressure contact
11/28/2002	DE10121657A1 Mikroelektronische Struktur mit einer Wasserstoffbarrierenschicht Microelectronic structure with a hydrogen barrier layer
11/28/2002	DE10120917C1 Anordnung mit wenigstens zwei zentrierten gestapelten Halbleiterchips Arrangement with at least two centered stacked semiconductor chips
11/28/2002	DE10120256C1 Anschlußgehäuse für ein elektronisches Bauelement Connection housing for an electronic component
11/28/2002	CA2447860A1 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield
11/27/2002	EP1261033A2 On chip inductive structure
11/27/2002	EP1261031A2 Tape for forming resin tie bar on a lead frame
11/27/2002	EP1261030A1 Bonding pad for integrated circuit
11/27/2002	EP1261029A2 Semiconductor device and method of production of same
11/27/2002	EP1261028A2 Cooling arrangement for an electronic apparatus
11/27/2002	EP1261027A2 Electronic device having dewing prevention structure
11/27/2002	EP1261026A1 Device having resin package and method of producing the same
11/27/2002	EP1261021A2 Method of production of circuit board, semiconductor device, and plating system
11/27/2002	EP1260991A1 Porous materials
11/27/2002	EP1260614A1 Tin plating
11/27/2002	EP1260606A2 Low dielectric constant material and method of processing by cvd
11/27/2002	EP1260555A1 Resin compositions
11/27/2002	EP1260551A1 Flame-retardant epoxy resin composition and laminate made with the same
11/27/2002	EP1260125A2 Thermal management system
11/27/2002	EP1260121A1 A printed circuit board assembly with improved bypass decoupling for bga packages
11/27/2002	EP1259988A2 Functional lid for rf power package
11/27/2002	EP1259987A1 Heat-conducting adhesive compound and a method for producing a heat-conducting adhesive compound
11/27/2002	EP1259986A2 Device for packing electronic components using injection moulding technology
11/27/2002	EP1259984A2 Nitride layer forming methods
11/27/2002	EP1259983A1 Electrical connection between two surfaces of a substrate and method for producing same
11/27/2002	EP1259982A1 Method of reducing the specific resistance of an electrically conducting molybdenum layer
11/27/2002	EP1259566A1 Thermosetting resin composition
11/27/2002	EP1112612B1 Array with light-emitting power semiconductor component and corresponding production method
11/27/2002	EP1020104B1 Method for mounting semiconductor element to circuit board, and semiconductor device
11/27/2002	EP0932500A4 Method to control cavity dimensions of fired multilayer circuit boards on a support
11/27/2002	EP0862794B1 Sealing material with wavelength converting effect and its production process, process of fabricating a light emitting semiconductor device and light emitting semiconductor device
11/27/2002	EP0730781B1 A lead frame having layered conductive planes
11/27/2002	CN2523025Y Coloured semiconductor packaging assembly
11/27/2002	CN2523024Y Stacked wafer
11/27/2002	CN2523023Y Radiating device combination
11/27/2002	CN2523022Y Central processing unit radiating device with triangle wave-plate radiating fin
11/27/2002	CN2522922Y CPU radiating fan with fastening device
11/27/2002	CN2522921Y 计算机cpu散热器 Computer cpu heatsink
11/27/2002	CN2522920Y CPU radiator fin fastener
11/27/2002	CN2522916Y Radiating body structure
11/27/2002	CN1382296A Method for identifying integrated circuit
11/27/2002	CN1382011A Manufacturing method for multilayer ceramic substrate
11/27/2002	CN1381952A Compound semiconductor switched circuit device
11/27/2002	CN1381928A 电连接器 The electrical connector
11/27/2002	CN1381927A PGA socket and contact
11/27/2002	CN1381924A Needle gate array contact and needle gate array socket
11/27/2002	CN1381906A Luminous device
11/27/2002	CN1381891A Semiconductor packaging device and mounting method of semiconductor packaging device

1 ... 1704 1705 1706 1707 1708 1709 1710 1711 1712 1713 1714 1715 1716 1717 1718 1719 1720 1721 1722 1723 1724 ... 2262