H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2002
12/05/2002	US20020179941 Semiconductor device and method of manufacturing the same
12/05/2002	US20020179921 Compliant hermetic package
12/05/2002	US20020179920 Package base which allows mounting of a semiconductor element and electrode-wiring terminals on a mounting surface
12/05/2002	US20020179919 Process for the production of an optoelectronic semiconductor component
12/05/2002	US20020179908 Semiconductor device and method of manufacturing the same
12/05/2002	US20020179904 Contact structure production method
12/05/2002	US20020179903 Semiconductor device
12/05/2002	US20020179896 Method and apparatus for forming an integrated circuit electrode having a reduced contact area
12/05/2002	US20020179833 SPM physical characteristic measuring method, measurement program, and SPM device
12/05/2002	US20020179721 Electronic module or label with a fixing adhesive forming a barrier for coating resin, and a medium including a module or label of this kind
12/05/2002	US20020179692 Pin attachment by a surface mounting method for fabricating organic pin grid array packages
12/05/2002	US20020179689 Pillar connections for semiconductor chips and method of manufacture
12/05/2002	US20020179687 Bondhead lead clamp apparatus and method
12/05/2002	US20020179685 Lead bonding method for SMD package
12/05/2002	US20020179568 Treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer
12/05/2002	US20020179460 Surface package type semiconductor package and method of producing semiconductor memory
12/05/2002	US20020179335 Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
12/05/2002	US20020179330 Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor
12/05/2002	US20020179328 Method of mounting electronic parts with Sn-Zn solder free of Pb without reduction in bonding strength
12/05/2002	US20020179327 Semiconductor chip soldering land pattern
12/05/2002	US20020179325 Electrical connection with inwardly deformable contact
12/05/2002	US20020179290 Heatsink assembly and method of manufacturing the same
12/05/2002	US20020179289 Power module and method of manufacturing the same
12/05/2002	US20020179287 Heat sink and process and molding tool for production of same
12/05/2002	US20020179286 Apparatus to enhance cooling of electronic device
12/05/2002	US20020179285 Folded-fin heat sink assembly and method of manufacturing same
12/05/2002	US20020179284 Orientation-independent thermosyphon heat spreader
12/05/2002	US20020179244 Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer
12/05/2002	US20020179241 Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method
12/05/2002	US20020179140 Power converter, and photovoltaic element module and power generator using the same
12/05/2002	US20020178600 Method of manufacturing alignment mark
12/05/2002	DE10215572A1 Ceramic electronic component used in electronics comprises ceramic body, terminal electrodes on body, and connecting clamps for connecting electrodes using tin-containing solder
12/05/2002	DE10201657A1 Halbleiterbauelement Semiconductor device
12/05/2002	DE10159369A1 Lasermarkierer und Lasermarkierungsverfahren Laser marking and laser marking process
12/05/2002	DE10157250C1 Semiconducting switch module has circuit for protection against overvoltages arranged in housing and on substrate and electrically connected and thermally coupled to semiconducting body
12/05/2002	DE10126955A1 Integrierte Schaltung mit energieabsorbierender Struktur Integrated circuit with energy absorbing structure
12/05/2002	DE10126655A1 Circuit board for electronic equipment, has electronic component on first surface with first and second contact surfaces connected by solder or adhesive to first and second contact points with access to track
12/05/2002	DE10126566C1 Integrated circuit has parallel active strip-shaped regions, contact plane with contacts at regular intervals occupy different lengths in width direction of regions in adjacent regions
12/05/2002	DE10126508A1 Device for packaging electronic components by injection molding used for e.g. chip size packaging comprises electronic components arranged on a first side of a system support in a predetermined position
12/05/2002	DE10125697A1 Leistungshalbleitermodul und Verfahren zum Herstellen eines Leistungshalbleitermoduls The power semiconductor module and method for manufacturing a power semiconductor module
12/05/2002	DE10125695A1 Power semiconductor structure for causing a coolant to pass through to cool a power semiconductor element has a cooling element and a push-contact casing containing the power semiconductor element.
12/05/2002	DE10125029A1 Semiconducting device has contact devices externally contactable for making at least one temporary electrical signal connection between main and auxiliary integrated circuits
12/05/2002	DE10124592A1 Heat sink for cooling component, is formed from folded sheet metal with spaced apart sections and abutting sections
12/05/2002	CA2447913A1 Folded-fin heat sink assembly and method of manufacturing same
12/05/2002	CA2433637A1 Interface materials and methods of production and use thereof
12/04/2002	EP1263054A2 Hermetically sealing package for optical semiconductor device and optical semiconductor module
12/04/2002	EP1263046A1 Contact Arrangement
12/04/2002	EP1263045A1 High power semiconductor module
12/04/2002	EP1263044A2 A cap for reducing cross-talk between devices on a common substrate and a method of manufacture therefor
12/04/2002	EP1263043A1 Electronic element with a shielding
12/04/2002	EP1263042A1 Semiconductor package with recessed lead frame and recessed lead frame
12/04/2002	EP1263041A2 Semiconductor Module
12/04/2002	EP1263040A2 High performance heat sink for electronics cooling
12/04/2002	EP1263039A2 Housing for power converter, and for photovoltaic element module and power generator using the same
12/04/2002	EP1263038A2 Electronic component and mobile communication device using such electronic component
12/04/2002	EP1262996A1 Semiconductor integrated circuit device
12/04/2002	EP1262804A1 Semiconductor device and method for manufacture thereof
12/04/2002	EP1262782A2 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
12/04/2002	EP1262094A1 Method for producing bond pads on a printed circuit
12/04/2002	EP1261999A2 Method and apparatus for delivering power to high performance electronic assemblies
12/04/2002	EP1261989A1 Metal-insulator-metal capacitor and a method for producing same
12/04/2002	EP1261988A1 Group iii nitride based fets and hemts with reduced trapping and method for producing the same
12/04/2002	EP1261938A1 Reinforced integrated circuit
12/04/2002	EP1261833A1 High performance cold plate for electronic cooling
12/04/2002	EP1016137B1 Housing for receiving a planar power transistor
12/04/2002	EP0860023B1 A flip-chip assembly
12/04/2002	CN2524374Y Automatic IC radiator laying apparatus
12/04/2002	CN2524373Y 散热器 Heat sink
12/04/2002	CN2524275Y Fixer assembly
12/04/2002	CN1383207A High-current triggered electrostatic discharge protector
12/04/2002	CN1383206A 半导体器件 Semiconductor devices
12/04/2002	CN1383205A Heat radiator for computer CPU chip
12/04/2002	CN1383204A Plate-type thermotube and its mfg. method
12/04/2002	CN1383203A Heat sink using phase state conversion of fluid
12/04/2002	CN1383197A Mfg. method of semiconductor device and semiconductor device
12/04/2002	CN1095413C Making method of radiator
12/03/2002	US6490713 Method and apparatus for automatically generating multi-terminal nets, and program storage medium storing program for executing automatic multi-terminal net generation method
12/03/2002	US6490170 Package substrate
12/03/2002	US6490162 Heatsink retainer
12/03/2002	US6490161 Peripheral land grid array package with improved thermal performance
12/03/2002	US6490160 Vapor chamber with integrated pin array
12/03/2002	US6490147 High-Q micromechanical device and method of tuning same
12/03/2002	US6489866 Microwave module
12/03/2002	US6489860 Surface acoustic wave duplexer with first and second package ground patterns
12/03/2002	US6489854 Electronic apparatus for automatically detecting the length of network transmission lines
12/03/2002	US6489850 Crosstalk suppression in differential AC coupled multichannel IC amplifiers
12/03/2002	US6489799 Integrated circuit device having process parameter measuring circuit
12/03/2002	US6489793 Temperature control of electronic devices using power following feedback
12/03/2002	US6489689 Semiconductor device
12/03/2002	US6489688 Area efficient bond pad placement
12/03/2002	US6489687 Semiconductor device and method of manufacturing the same, manufacturing device, circuit board, and electronic equipment
12/03/2002	US6489685 Component built-in module and method of manufacturing the same
12/03/2002	US6489684 Reduction of electromigration in dual damascene connector
12/03/2002	US6489683 Variable grain size in conductors for semiconductor vias and trenches
12/03/2002	US6489682 Ball grid array semiconductor package and substrate therefor
12/03/2002	US6489681 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components
12/03/2002	US6489680 Semiconductor device
12/03/2002	US6489679 High-frequency package
12/03/2002	US6489678 High performance multi-chip flip chip package
12/03/2002	US6489677 Optical semiconductor device package and optical semiconductor module having the same

1 ... 1702 1703 1704 1705 1706 1707 1708 1709 1710 1711 1712 1713 1714 1715 1716 1717 1718 1719 1720 1721 1722 ... 2262