Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2002
12/05/2002US20020182837 Providing device having open circuit comprising a pair of wires; forming a polymer block over separated ends of wire; exposing to energy beam to increase conductivity of polymer and electrically connect wire ends
12/05/2002US20020182836 Forming an alloy layer over a silicon-containing substrate, annealing alloy layer to form a metal alloy silicide, removing any remaining alloy layer
12/05/2002US20020182832 Method and article for filling apertures in a high performance electronic substrate
12/05/2002US20020182821 Method of manufacturing an alignment mark
12/05/2002US20020182817 Resist mask for measuring the accuracy of overlaid layers
12/05/2002US20020182816 Material removal method for forming a structure
12/05/2002US20020182803 Semiconductor devices having contact plugs and local interconnects and methods for making the same
12/05/2002US20020182782 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
12/05/2002US20020182781 Chip on board and heat sink attachment methods
12/05/2002US20020182780 Method of minimizing package-shift effects in integrated circuits by using a thick metallic overcoat
12/05/2002US20020182779 Heat sink method and system
12/05/2002US20020182778 Flexible package fabrication method
12/05/2002US20020182776 Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate
12/05/2002US20020182774 Die-attach method and assemblies using film and epoxy bonds
12/05/2002US20020182773 Method for bonding inner leads of leadframe to substrate
12/05/2002US20020182771 Carrier for wafer-scale package, wafer-scale package including the carrier, and methods
12/05/2002US20020182770 Lead-bond type chip package and manufacturing method thereof
12/05/2002US20020182398 Rigid-printed wiring board and production method of the rigid-printed wiring board
12/05/2002US20020182397 Thermal management material, devices and methods therefor
12/05/2002US20020182370 Semiconductor packaging part and method producing the same
12/05/2002US20020182332 Method for producing a heat transfer medium and device
12/05/2002US20020181522 Laser diode matching circuit and method of impedance matching therefor
12/05/2002US20020181218 Electronic structure
12/05/2002US20020181211 Circuit board and method for manufacturing the same, and electronic apparatus comprising it
12/05/2002US20020181206 Reusable thermal solution attachment mechanism and methods of using same
12/05/2002US20020181205 Securing heat sinks
12/05/2002US20020181204 Securing heat sinks
12/05/2002US20020181203 Heat sink device retainer
12/05/2002US20020181201 Heat dissipating structure of webpad
12/05/2002US20020181185 Multi-layer wiring board
12/05/2002US20020181177 CDM ESD protection design using deep N-well structure
12/05/2002US20020180567 Microwave circuit
12/05/2002US20020180553 Off-chip bias feed system
12/05/2002US20020180511 Externally programmable antifuse
12/05/2002US20020180110 Laser marker and laser marking method
12/05/2002US20020180067 Semiconductor device and alignment sensing method for semiconductor device
12/05/2002US20020180065 Semiconductor device
12/05/2002US20020180064 Metallized surface wafer level package structure
12/05/2002US20020180063 Semiconductor module
12/05/2002US20020180062 Flip chip package of monolithic microwave integrated circuit
12/05/2002US20020180061 Land grid array stiffener use with flexible chip carriers
12/05/2002US20020180060 Semiconductor device and a method of manufacturing the same
12/05/2002US20020180059 Semiconductor device and production process thereof
12/05/2002US20020180058 Semiconductor device and method for fabricating the same
12/05/2002US20020180057 Chip stack-type semiconductor package
12/05/2002US20020180056 Bonding pad structure
12/05/2002US20020180055 Semiconductor device, manufacturing method thereof, and monolithic microwave integrated circuit
12/05/2002US20020180054 Contact structure for an integrated semiconductor device
12/05/2002US20020180052 Polish or etch stop layer
12/05/2002US20020180051 Waterproofing, antisoilant
12/05/2002US20020180047 Method of fabricating a semiconductor device
12/05/2002US20020180044 Si-rich surface layer capped diffusion barriers
12/05/2002US20020180043 Semiconductor device and method for manufacturing semiconductor devices
12/05/2002US20020180041 Semiconductor device and method for manufacturing the same
12/05/2002US20020180040 Super thin/super thermal ball grid array package
12/05/2002US20020180037 Semiconductor device
12/05/2002US20020180035 Semiconductor package with heat sink
12/05/2002US20020180034 Heat dissipation device having a load centering mechanism
12/05/2002US20020180033 Electronic component, communication device, and manufacturing method for electronic compoent
12/05/2002US20020180032 Package for reducing cross-talk between devices on a device substrate and a method of manufacture therefor
12/05/2002US20020180031 Semiconductor device
12/05/2002US20020180030 Laminated-chip semiconductor device
12/05/2002US20020180029 Semiconductor device with intermediate connector
12/05/2002US20020180027 Semiconductor module and method of making the device
12/05/2002US20020180026 Semiconductor wafer designed to avoid probed marks while testing
12/05/2002US20020180025 Semiconductor device and method of stacking semiconductor chips
12/05/2002US20020180023 Structure of a multi chip module having stacked chips
12/05/2002US20020180022 Semiconductor device
12/05/2002US20020180021 Three-dimension multi-chip stack package technology
12/05/2002US20020180020 Three-dimension multi-chip stack package technology
12/05/2002US20020180019 Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device
12/05/2002US20020180018 Leadframe locking structures and method therefor
12/05/2002US20020180017 Wafer level package having a side package
12/05/2002US20020180016 Critically aligned optical MEMS dies for large packaged substrate arrays and method of manufacture
12/05/2002US20020180015 Semiconductor module
12/05/2002US20020180014 Enhanced performance surface mount semiconductor package devices and methods
12/05/2002US20020180012 Graded metallic leads for connection to microelectronic elements
12/05/2002US20020180011 Lead frame, semiconductor device using the same and method of producing the semiconductor device
12/05/2002US20020180010 Semiconductor device and manufacturing method thereof
12/05/2002US20020180009 Technique for attaching die to leads
12/05/2002US20020180008 Leads under chip in conventional IC package
12/05/2002US20020180007 Semiconductor chip package
12/05/2002US20020180005 Semiconductor device and manufacturing method thereof
12/05/2002US20020180004 Circuitized substrate for high-frequency applications
12/05/2002US20020180001 System and method for ESD protection
12/05/2002US20020179998 Fuse area structure including protection film on sidewall of fuse opening in semiconductor device and method of forming the same
12/05/2002US20020179994 Power semiconductor device manufactured using a chip-size package
12/05/2002US20020179991 Integrated circuit connecting pad
12/05/2002US20020179990 Use of DAR coating to modulate the efficiency of laser fuse blows
12/05/2002US20020179989 Hermetically sealing package for optical semiconductor and optical semiconductor module
12/05/2002US20020179986 MEMS wafer level package
12/05/2002US20020179977 Integrated radio frequency circuits
12/05/2002US20020179973 Electronic device and method for manufacturing the same
12/05/2002US20020179972 Electronic device and method for manufacturing the same
12/05/2002US20020179971 Semiconductor integrated device having an electrostatic breakdown protection circuit
12/05/2002US20020179969 Electronic circuit
12/05/2002US20020179955 Semiconductor device comprising MIM-type capacitor and method of manufacturing the same
12/05/2002US20020179952 MIM capacitor and manufacturing method therefor
12/05/2002US20020179951 Semiconductor device and method of manufacturing the same
12/05/2002US20020179945 Power semiconductor device
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