| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/26/2013 | US20130341239 Accommodation cassette |
| 12/26/2013 | US20130340943 Bonding apparatus |
| 12/25/2013 | EP2677541A1 Method for wire bonding a power semiconductor chip and the corresponding device |
| 12/25/2013 | EP2677540A1 Electronic device and method of manufacturing the same |
| 12/25/2013 | EP2677539A1 Semiconductor device and process for manufacture thereof |
| 12/25/2013 | EP2677538A1 Wafer level package, chip size package device and method of manufacturing wafer level package |
| 12/25/2013 | EP2677536A1 Method for producing silicon dioxide film |
| 12/25/2013 | EP2677535A1 Method for forming insulating film |
| 12/25/2013 | EP2677261A1 Two-phase cooling system for electronic components |
| 12/25/2013 | EP2528095B1 High performance electronic system with first and second subsystem |
| 12/25/2013 | CN203368339U Thyristor valve assembly |
| 12/25/2013 | CN203368303U IGBT power module |
| 12/25/2013 | CN203367286U Insulated gate bipolar transistor module quick-assembling structure |
| 12/25/2013 | CN203367273U Small-power field effect pair transistor |
| 12/25/2013 | CN203367272U Field effect geminate transistor |
| 12/25/2013 | CN203367271U Array substrate and display device |
| 12/25/2013 | CN203367270U Mould pressing type internal circuit ball grid array integrated circuit |
| 12/25/2013 | CN203367269U Lead frame |
| 12/25/2013 | CN203367268U Semiconductor chip packaging module and packaging structure thereof |
| 12/25/2013 | CN203367267U Solder dosage-self adaptive rectifier structure |
| 12/25/2013 | CN203367266U Encapsulation structure for buffering chip surface solder dosage |
| 12/25/2013 | CN203367265U Base ceramic member |
| 12/25/2013 | CN203367264U QFN-packaging tube casing provided with conductive ring and electronic device |
| 12/25/2013 | CN203367263U A rail-locomotive-used high efficiency heat pipe radiator |
| 12/25/2013 | CN203367262U Temperature control structure for MOS transistor |
| 12/25/2013 | CN203367261U 功率模块 Power Modules |
| 12/25/2013 | CN203367260U Power ceramic casing and power chip packaging structure |
| 12/25/2013 | CN203367241U Power module PCB installation structure and power module |
| 12/25/2013 | CN103477725A A non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate |
| 12/25/2013 | CN103477434A An interposer having an inductor |
| 12/25/2013 | CN103477433A Semiconductor substrate having dot markings, and method for producing same |
| 12/25/2013 | CN103477432A Cooler for use in semiconductor module |
| 12/25/2013 | CN103477431A Thermal interface pad material with perforated liner |
| 12/25/2013 | CN103477430A Casing for electronic equipment with an integrated heat sink |
| 12/25/2013 | CN103477429A Semiconductor device and manufacturing method thereof |
| 12/25/2013 | CN103477428A Semiconductor device and manufacturing method thereof |
| 12/25/2013 | CN103476229A Heat radiating device |
| 12/25/2013 | CN103475357A Semi-active on-chip inductor based on active inductor |
| 12/25/2013 | CN103474558A LED packaging adhesive dispensing technology and LED chip packaging structure thereof |
| 12/25/2013 | CN103474470A Thin film transistor, array substrate and manufacturing method thereof, and display device |
| 12/25/2013 | CN103474438A Thin film transistor array substrate and liquid crystal display panel |
| 12/25/2013 | CN103474422A Single-phase rectifier bridge |
| 12/25/2013 | CN103474420A Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers |
| 12/25/2013 | CN103474419A Inductive element with interrupter region and method for forming |
| 12/25/2013 | CN103474418A Array substrate, manufacturing method of array substrate, and display device of array substrate |
| 12/25/2013 | CN103474417A Three-dimensional interconnection structure and manufacturing method thereof |
| 12/25/2013 | CN103474416A Interconnection structure and its formation method |
| 12/25/2013 | CN103474415A Inductor and its formation method |
| 12/25/2013 | CN103474414A Inductor and its formation method |
| 12/25/2013 | CN103474413A Layering and vapor-entering prevention lead frame for high-power integrated circuits |
| 12/25/2013 | CN103474412A Rectangular array MINIDIP lead frame |
| 12/25/2013 | CN103474411A Package lead frame |
| 12/25/2013 | CN103474410A Power semiconductor packaging piece and wire bonding method thereof |
| 12/25/2013 | CN103474409A Arrangement method designed for high-density lead frames for discrete device |
| 12/25/2013 | CN103474408A Gold and silver alloy bonding wire with gold-plated layer on surface and preparation method thereof |
| 12/25/2013 | CN103474407A Semiconductor package structure |
| 12/25/2013 | CN103474406A Copper-free flat packaging piece of AAQFN frame product and manufacturing process thereof |
| 12/25/2013 | CN103474405A Electromagnetic interference prevention overvoltage protection device |
| 12/25/2013 | CN103474404A Loop parallel type heat pipe radiator |
| 12/25/2013 | CN103474403A Non-metallic heat radiation film, production equipment, and manufacturing process |
| 12/25/2013 | CN103474402A Semiconductor package structure |
| 12/25/2013 | CN103474401A Support plate structure and chip packaging structure and manufacturing method thereof |
| 12/25/2013 | CN103474400A Boron-free oxidation dumet wire and manufacturing processes thereof |
| 12/25/2013 | CN103474367A Method for forming micro convex point packaging structure of chip |
| 12/25/2013 | CN103474363A Packaging technology based on organic substrate technology and packaging structure |
| 12/25/2013 | CN103474361A Packaging process and packaging structure of embedded substrate with active chip embedment function |
| 12/25/2013 | CN103474329A Method for manufacturing film pattern |
| 12/25/2013 | CN103473593A Intelligent card, intelligent card contact pad carrier plate and method for manufacturing same |
| 12/25/2013 | CN103472645A Array substrate, manufacturing method thereof and display device |
| 12/25/2013 | CN102585228B Organic silicon electronic-pouring sealant with high refractive index and high transparency, as well as preparation and application thereof |
| 12/25/2013 | CN102479787B Semiconductor integrated circuit device and manufacturing method thereof as well as layout of semiconductor memory device |
| 12/25/2013 | CN102468220B Metal interconnection structure, and forming method thereof |
| 12/25/2013 | CN102362345B Semiconductor element substrate, method for manufacturing same, and semiconductor device |
| 12/25/2013 | CN102291936B 印刷线路板 Printed circuit boards |
| 12/25/2013 | CN102254901B Semiconductor structure having electromagnetic interference resisting structure and method manufacturing same |
| 12/25/2013 | CN102203940B Supporting body for semiconductor component, semiconductor element and method for production of supporting body |
| 12/25/2013 | CN102192921B Semiconductor chip used for evaluation, evaluation system, and repairing method thereof |
| 12/25/2013 | CN102165576B Semiconductor device and semiconductor device manufacturing method |
| 12/25/2013 | CN102157478B Integrated circuit package and methods for manufacturing same |
| 12/25/2013 | CN102122649B Display device and manufacturing method of same |
| 12/25/2013 | CN101939910B Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device and atomic clock |
| 12/25/2013 | CN101894795B Integrated circuit system with hierarchical capacitor and method of manufacture thereof |
| 12/25/2013 | CN101861072B Heat radiating device |
| 12/25/2013 | CN101859762B Semiconductor device and manufacturing method thereof |
| 12/25/2013 | CN101752240B Group III nitride semiconductor substrate production method, and group III nitride semiconductor substrate |
| 12/25/2013 | CN101651152B 半导体器件 Semiconductor devices |
| 12/24/2013 | US8614909 Internal supply testing in memory devices configured for stacked arrangements |
| 12/24/2013 | US8614680 Touch substrate and touch display panel |
| 12/24/2013 | US8614517 Semiconductor device and method of manufacturing the same |
| 12/24/2013 | US8614514 Micro-spring chip attachment using ribbon bonds |
| 12/24/2013 | US8614511 Three dimensional semiconductor memory device and method of fabricating the same |
| 12/24/2013 | US8614510 Semiconductor device including a metal wiring with a metal cap |
| 12/24/2013 | US8614509 Semiconductor device having a multi-layered line and manufacturing method of the same |
| 12/24/2013 | US8614507 Semiconductor devices having lower and upper interconnection structures that exhibit reduced coupling |
| 12/24/2013 | US8614506 RFID tags with bumped substrate, and apparatuses and methods for making |
| 12/24/2013 | US8614505 Semiconductor device with heat spreader |
| 12/24/2013 | US8614504 Chip package and method for making same |
| 12/24/2013 | US8614503 Common drain exposed conductive clip for high power semiconductor packages |
| 12/24/2013 | US8614502 Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device |
| 12/24/2013 | US8614500 Film forming apparatus, film forming method, and semiconductor device |