H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2002
12/12/2002	US20020185721 Chip size package having concave pattern in the bump pad area of redistribution patterns and method for manufacturing the same
12/12/2002	US20020185720 Die-up ball grid array package with attached stiffener ring
12/12/2002	US20020185719 Chip-scaled package and manufacturing method thereof
12/12/2002	US20020185718 Semiconductor device packaging structure
12/12/2002	US20020185717 High performance flipchip package that incorporates heat removal with minimal thermal mismatch
12/12/2002	US20020185716 Metal article coated with multilayer finish inhibiting whisker growth
12/12/2002	US20020185715 Stress isolating die attach structure and method
12/12/2002	US20020185713 Lead frame
12/12/2002	US20020185712 Circuit encapsulation technique utilizing electroplating
12/12/2002	US20020185710 Chip scale surface mount package for semiconductor device and process of fabricating the same
12/12/2002	US20020185706 Semiconductor device
12/12/2002	US20020185704 Methods of fabricating carrier substrates and semiconductor devices
12/12/2002	US20020185694 Semiconductor device with address programming circuit
12/12/2002	US20020185684 Method and structure for buried circuits and devices
12/12/2002	US20020185671 Semiconductor device having a metal insulator metal capacitor
12/12/2002	US20020185666 Bi-level digit line architecture for high density drams
12/12/2002	US20020185664 Grounded fill in a large scale integrated circuit
12/12/2002	US20020185661 Semiconductor device and process for producing the same
12/12/2002	US20020185519 Bondhead lead clamp apparatus
12/12/2002	US20020185309 Method for mounting electronic part and paste material
12/12/2002	US20020185308 Depopulation of a ball grid array to allow via placement
12/12/2002	US20020185306 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
12/12/2002	US20020185305 Packaging substrate with electrostatic discharge protection
12/12/2002	US20020185303 Wiring circuit board and method for producing same
12/12/2002	US20020185270 Flexible glove-like heat sink
12/12/2002	US20020185269 Heat sink, method of manufacturing the same, and cooling apparatus using the same
12/12/2002	US20020185268 Thermal interface wafer and method of making and using the same
12/12/2002	US20020185263 Cooling apparatus for electronic devices
12/12/2002	US20020185260 Liquid cooled heat exchanger with enhanced flow
12/12/2002	US20020185259 Angle mounted fan-sink
12/12/2002	US20020184907 Integrated circuits heat exchangers comprising channels having miniaturized electromechanical structures(MEMS), piezoelectric activators and seals
12/12/2002	US20020184758 Method of fabricating semiconductor chip assemblies
12/12/2002	US20020184754 Coupling spaced bond pads to a contact
12/12/2002	DE10224789A1 Vergossene integrierte Hybridschaltung und Verfahren zur Herstellung der vergossenen integrierten Hybridschaltung Encapsulated hybrid integrated circuit and methods for preparing the encapsulated hybrid integrated circuit
12/12/2002	DE10222670A1 Elektrische Vorrichtung, welche eine Metallkontaktstelle besitzt, auf die eine Metallverdrahtung gebondet ist, und ein Herstellungsverfahren davon An electrical device which has a metal pad to which a metal wiring is bonded, and a manufacturing method thereof
12/12/2002	DE10222608A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
12/12/2002	DE10162979A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
12/12/2002	DE10127052A1 Verbindung eines Halbleiterbauelements mit einem Kühlkörper, Halbleiterbauelement, Kühlkörper und Verfahren Connecting a semiconductor device to a heat sink, semiconductor device, heat sink and method
12/12/2002	DE10127010A1 Electronic component with semiconductor chip, has substrate attached via adhesive layer on to active chip surface
12/12/2002	DE10127009A1 Plastic housing used for packing semiconductor chips comprises semiconductor chips arranged in lines and gaps
12/12/2002	DE10126628A1 Halbleiterstruktur mit ESD-Schutzeinrichtung Semiconductor structure with ESD protection device
12/12/2002	DE10126296A1 Production of an electronic component, especially a chip, mounted on a support comprises spraying or casting an elastic material using a spray or casting mold to form elastic material
12/12/2002	DE10125636A1 Cooler for electrical and/or electronic components has cooling body with 2 cooling surfaces, hollow spaces in body forming cooling channel entirely within body joining coolant inlet and outlet
12/12/2002	DE10124774A1 Halbleiterbauelement mit zumindest einem Halbleiterchip auf einem als Substrat dienenden Basischip und Verfahren zu dessen Herstellung A semiconductor device comprising at least a semiconductor chip on a substrate serving as a base chip and process for its preparation
12/12/2002	CA2448488A1 Heatsink assembly and method of manufacturing the same
12/11/2002	EP1265464A2 Electronic component and method of manufacturing the same
12/11/2002	EP1265288A2 Semiconductor structure with buried conductive lines and method of electrically contacting of buried conductive lines
12/11/2002	EP1265286A2 Integrated circuit structure
12/11/2002	EP1265281A2 Thermally conductive molded article and method of making the same
12/11/2002	EP1265280A1 Resin component for encapsulating semiconductor and semiconductor device using it
12/11/2002	EP1265275A2 Thermal stability improvement of CoSi2 film by stuffing in titanium
12/11/2002	EP1265164A2 Method and apparatus for circuit design
12/11/2002	EP1264377A1 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial-shielded energy pathways
12/11/2002	EP1264351A1 Integrated component comprising a metal-insulator-metal capacitor
12/11/2002	EP1264349A1 A die attachment surface having pedestals for receiving components and method of using the attachment
12/11/2002	EP1264344A1 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same
12/11/2002	EP1264343A2 Apparatus and method for passive phase change thermal management
12/11/2002	EP1264341A2 Method of preventing bridging between polycrystalline micro-scale features
12/11/2002	EP1264338A1 Method for adjusting an electrical parameter on an integrated electronic component
12/11/2002	EP1263838A1 Polyalkylene polysulphides
12/11/2002	EP1205013B1 Solid-state laser cooling
12/11/2002	EP0758113B1 Test mode matrix circuit for an embedded microprocessor core
12/11/2002	CN2525679Y Flexible heat tube
12/11/2002	CN2525678Y Radiator
12/11/2002	CN2525677Y Radiator of CPU radiator
12/11/2002	CN2525676Y Welding ball allocation on chip
12/11/2002	CN2525582Y Radiator sheet
12/11/2002	CN2525581Y Computer microprocessor radiator
12/11/2002	CN1385054A Electric module structure formed with polymer shrunk material
12/11/2002	CN1384979A Method for production of chip-card type portable storage medium
12/11/2002	CN1384978A Use of additional bonding finger to improve wire bond density
12/11/2002	CN1384977A 半导体装置 Semiconductor device
12/11/2002	CN1384975A Reworkable thermosetting resin composition
12/11/2002	CN1384819A 前列腺素e类似物 E prostaglandin analogs
12/11/2002	CN1384700A Manufacture of multi-layered ceramic substrate
12/11/2002	CN1384606A Surface mounted electronic element
12/11/2002	CN1384550A Semiconductor module and its making process
12/11/2002	CN1384544A Semiconductor chip with ID mark and semiconductor device producing method and equipment wherewith
12/11/2002	CN1384543A Flexible integrated monochip circuit
12/11/2002	CN1384542A Moulded resin package with cavity structure
12/11/2002	CN1384540A Topological process of wiring diagram, semiconductor device and optical patter-correcting method
12/11/2002	CN1384143A Semiconductor packing epoxy resin composition and its making process and semiconductor device
12/11/2002	CN1096138C Protective circuit and electric circuit using protective circuit
12/11/2002	CN1096117C Interconnection semiconductor device and its making method
12/11/2002	CN1096116C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/11/2002	CN1096110C Solder bump fabrication methods and structure including titanium barrier layer
12/11/2002	CN1095865C Protective material for semiconductor element, semiconductor element provided with said protective material, and semiconductor device provided with said semiconductor element
12/10/2002	US6493231 Electrical apparatus
12/10/2002	US6493229 Heat sink chip package
12/10/2002	US6493228 Heat radiation packaging structure for an electric part and packaging method thereof
12/10/2002	US6493056 Interposer device
12/10/2002	US6492829 Contactor for inspection
12/10/2002	US6492739 Semiconductor device having bumper portions integral with a heat sink
12/10/2002	US6492738 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
12/10/2002	US6492737 Electronic device and a method of manufacturing the same
12/10/2002	US6492736 Power mesh bridge
12/10/2002	US6492735 Semiconductor device with alloy film between barrier metal and interconnect
12/10/2002	US6492734 Semiconductor device including damascene wiring and a manufacturing method thereof
12/10/2002	US6492731 Composite low dielectric constant film for integrated circuit structure
12/10/2002	US6492730 Method for fabricating semiconductor integrated circuit

1 ... 1699 1700 1701 1702 1703 1704 1705 1706 1707 1708 1709 1710 1711 1712 1713 1714 1715 1716 1717 1718 1719 ... 2262