Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2002
12/17/2002US6495083 Method of underfilling an integrated circuit chip
12/17/2002US6493935 Interleaving a bondwire between two bondwires coupled to a same terminal
12/17/2002US6493933 Method of making flexible electronic circuitry
12/17/2002CA2245540C Dual-curing coating formulation and method
12/17/2002CA2213034C A semiconductor device with a passivation film
12/12/2002WO2002100145A1 Thermal enhanced extended surface tape for integrated circuit heat dissipation
12/12/2002WO2002100142A1 Wiring board and its production method
12/12/2002WO2002100140A2 Circuit board with at least one electronic component
12/12/2002WO2002099930A1 Socket connector and contact for use in a socket connector
12/12/2002WO2002099903A1 Superconductive wire production method
12/12/2002WO2002099894A1 Gate feed structure for reduced size field effect transistors
12/12/2002WO2002099883A2 Electronic device and relative fabrication method
12/12/2002WO2002099882A2 Mmic with off-chip bias feed system
12/12/2002WO2002099881A2 Heatsink assembly and method of manufacturing the same
12/12/2002WO2002099880A1 Semiconductor device
12/12/2002WO2002099879A1 Heat sink and its manufacturing method
12/12/2002WO2002099878A1 Power semiconductor module
12/12/2002WO2002099877A2 Enhanced performance surface mount semiconductor package devices and methods
12/12/2002WO2002099876A1 Semiconductor device
12/12/2002WO2002099873A2 Dual damascene multi-level metallization
12/12/2002WO2002099871A2 Plastic housing comprising several semiconductor chips and a wiring modification plate, and method for producing the plastic housing in an injection-moulding mould
12/12/2002WO2002099851A2 Temperature controlled vacuum chuck
12/12/2002WO2002099850A2 Interchangeable microdeposition head apparatus and method
12/12/2002WO2002099849A2 Apparatus for microdeposition of multiple fluid materials
12/12/2002WO2002099848A2 Formation of printed circuit board structures using piezo microdeposition
12/12/2002WO2002099845A2 Electronic chip and electronic chip assembly
12/12/2002WO2002099164A2 Electroless-plating solution and semiconductor device
12/12/2002WO2002098955A1 Organosilicate polymer and insulating film therefrom
12/12/2002WO2002098576A1 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
12/12/2002WO2002098575A1 Over-clocking in a microdeposition control system to improve resolution
12/12/2002WO2002098574A1 Microdeposition apparatus
12/12/2002WO2002098573A1 Waveform generator for microdeposition control system
12/12/2002WO2002081996A3 Orientation-independent thermosyphon heat spreader
12/12/2002US20020188857 Protected storage of a datum in an integrated circuit
12/12/2002US20020187665 IC socket
12/12/2002US20020187663 Contact assembly for land grid array interposer or electrical connector
12/12/2002US20020187657 Semiconductor device and method for manufacturing the same
12/12/2002US20020187648 Material removal method for forming a structure
12/12/2002US20020187638 Method for fabricating semiconductor device
12/12/2002US20020187634 Fine pitch system and method for reinforcing bond pads in semiconductor devices
12/12/2002US20020187632 Process for the formation of RuSixOy-containing barrier layers for high-k dielectrics
12/12/2002US20020187631 Copper interconnect structure having stuffed diffusion barrier
12/12/2002US20020187625 Semiconductor device have multiple wiring layers and method of producing the same
12/12/2002US20020187624 Method for forming metal line of semiconductor device
12/12/2002US20020187613 Method of forming memory device having capacitor including layer of high dielectric constant
12/12/2002US20020187604 Semiconductor devices and manufacturing methods thereof
12/12/2002US20020187598 DRAM device and method of manufacturing the same
12/12/2002US20020187591 Packaging process for semiconductor package
12/12/2002US20020187590 Ball grid array packages with thermally conductive containers
12/12/2002US20020187588 Stacked semiconductor device manufacturing method
12/12/2002US20020187587 Method of manufacturing a semiconductor structure having stacked semiconductor devices
12/12/2002US20020187586 Multi chip semiconductor package and method of construction
12/12/2002US20020187585 Ball grid array module and method of manufacturing same
12/12/2002US20020187584 Two-stage transfer molding method to encapsulate mmc module
12/12/2002US20020187582 Inspectable buried test structures and methods for inspecting the same
12/12/2002US20020187364 Electrodeposition; electronics
12/12/2002US20020187355 High speed electroplating; uniform deposits
12/12/2002US20020187353 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same
12/12/2002US20020187334 Two-metal tab tape, double-sided csp tape, bga tape and method for manufacturing the same
12/12/2002US20020187319 Electrical device having metal pad bonded with metal wiring and manufacturing method thereof
12/12/2002US20020187318 Lead frame and production process thereof and production process of thermally conductive substrate
12/12/2002US20020187261 Using an Atomic Layer Deposition
12/12/2002US20020187256 Atomic Layer Deposition using a boron compound as a reducing agent.
12/12/2002US20020186554 Method for manufacturing a scalable high frequency integrated circuit package
12/12/2002US20020186552 Module component and method of manufacturing the same
12/12/2002US20020186549 Alternative method used to package multi media card by transfer molding
12/12/2002US20020186545 Power module
12/12/2002US20020186542 Heat sink of module with built-in IC
12/12/2002US20020186540 Heat sink mounting assembly
12/12/2002US20020186539 Heat sink for chip stacking applications
12/12/2002US20020186538 Cooling module and the system using the same
12/12/2002US20020186537 Heat sink and thermal interface having shielding to attenuate electromagnetic interference
12/12/2002US20020186114 Inductor for integrated circuit
12/12/2002US20020186100 Isolating energy conditioning shield assembly
12/12/2002US20020186091 High-frequency semiconductor device
12/12/2002US20020186089 High frequency semiconductor integrated circuit capable of switching between characteristics
12/12/2002US20020185966 Mounting led on each of plurality of divisions of substrate aggregation, forming transparent layer, cutting off at division lines, forming second transparent layer, cutting off, forming reflector film on outside walls, dividing at lines
12/12/2002US20020185753 Die corner alignment structure
12/12/2002US20020185752 Potted hybrid integrated circuit and method for manufacturing potted hybrid integrated circuit
12/12/2002US20020185751 Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof
12/12/2002US20020185750 Die-up ball grid array package with printed circuit board attachable heat spreader
12/12/2002US20020185749 Mask repattern process
12/12/2002US20020185747 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
12/12/2002US20020185746 Ball grid array IC package and manufacturing method thereof
12/12/2002US20020185745 COF packaged semiconductor
12/12/2002US20020185743 Wafer level chip-scale package and a method for manufacturing
12/12/2002US20020185742 Semiconductor device and method of manufacturing the same
12/12/2002US20020185741 Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation
12/12/2002US20020185740 Semiconductor device having multilevel interconnections and method of manufacturing the same
12/12/2002US20020185738 Integrated circuit having a passive device integrally formed therein
12/12/2002US20020185736 Semiconductor device with elongated interconnecting member and fabrication method thereof
12/12/2002US20020185734 Die-up ball grid array package with printed circuit board attachable heat spreader
12/12/2002US20020185731 Method and apparatus providing redundancy for fabricating highly reliable memory modules
12/12/2002US20020185730 System-on-a-chip with multi-layered metallized through-hole interconnection
12/12/2002US20020185728 Thermal transfer plate
12/12/2002US20020185727 IC package with dual heat spreaders
12/12/2002US20020185726 Heat pipe thermal management of high potential electronic chip packages
12/12/2002US20020185724 Mechanically registered and interconnected chip
12/12/2002US20020185723 Flat-type semiconductor stack
12/12/2002US20020185722 Die-up ball grid array package with enhanced stiffener
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