H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2002
12/19/2002	US20020191375 CPU cooling structure
12/19/2002	US20020191368 Electronic assembly with laterally connected capacitors and manufacturing method
12/19/2002	US20020191366 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board
12/19/2002	US20020191358 Electrostatic discharge protection device
12/19/2002	US20020190812 High-frequency interconnection for circuits
12/19/2002	US20020190637 Light emission apparatus and method of fabricating the same
12/19/2002	US20020190605 Component with drain for pyroelectrical voltages and a method for production thereof
12/19/2002	US20020190578 Semiconductor integrated circuit device
12/19/2002	US20020190429 Two-stage transfer molding method to encapsulate MMC module
12/19/2002	US20020190397 Heat dissipation type semiconductor package and method of fabricating the same
12/19/2002	US20020190396 Method and apparatus for removing encapsulating material from a packaged microelectronic device
12/19/2002	US20020190394 Bed structure underlying electrode pad of semiconductor device and method for manufacturing same
12/19/2002	US20020190391 Semiconductor device
12/19/2002	US20020190390 Flip-chip bump arrangement for decreasing impedance
12/19/2002	US20020190389 Reduction of electromagnetic interference in integrated circuit device packages
12/19/2002	US20020190388 Method of mounting a circuit component and joint structure therefor
12/19/2002	US20020190383 Semiconductor device and method of fabricating the same
12/19/2002	US20020190382 Semiconductor device having dummy patterns for metal cmp
12/19/2002	US20020190380 Semiconductor device including a pad and a method of manufacturing the same
12/19/2002	US20020190379 W-CVD with fluorine-free tungsten nucleation
12/19/2002	US20020190378 Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same
12/19/2002	US20020190377 Circuit device and method for fabricating the same
12/19/2002	US20020190376 Package having terminated plating layer and its manufacturing method
12/19/2002	US20020190375 Semiconductor device and method of production of same
12/19/2002	US20020190374 Semiconductor device
12/19/2002	US20020190372 Integrated circuit package electrical enhancement
12/19/2002	US20020190371 Semiconductor device and method of production of same
12/19/2002	US20020190370 Siloxirane based no-flow underfill material
12/19/2002	US20020190369 Semiconductor chip, chip-on-chip structure device, and assembling method thereof
12/19/2002	US20020190367 Slice interconnect structure
12/19/2002	US20020190366 Micro BGA package
12/19/2002	US20020190362 Die-up ball grid array package with patterned stiffener opening
12/19/2002	US20020190361 Die-up ball grid array package with die-attached heat spreader
12/19/2002	US20020190360 IC chip packaging for reducing bond wire length
12/19/2002	US20020190358 Deformation-absorbing leadframe for semiconductor devices
12/19/2002	US20020190357 Semiconductor circuit device and process for manufacturing the same
12/19/2002	US20020190355 Permanently on transistor implemented using a double polysilicon layer CMOS process with buried contact
12/19/2002	US20020190354 Semiconductor package and fabrication method of the same
12/19/2002	US20020190353 Plastic package structure for communication component
12/19/2002	US20020190352 Semiconductor device and method for fabricating the same
12/19/2002	US20020190349 Semiconductor device and method of manufacturing same
12/19/2002	US20020190348 Semiconductor device having anti-fuse structure
12/19/2002	US20020190337 Method and apparatus for the sensing of a temperature and/or the provision of heat
12/19/2002	US20020190336 Semiconductor device
12/19/2002	US20020190333 ESD protection devices and methods for reducing trigger voltage
12/19/2002	US20020190330 Semiconductor device, memory system and electronic apparatus
12/19/2002	US20020190325 Power semiconductor device
12/19/2002	US20020190285 Power supply apparatus using power semiconductor switching element
12/19/2002	US20020190278 Integrated circuit
12/19/2002	US20020190276 Process for the formation of RuSixOy-containing barrier layers for high-k dielectrics
12/19/2002	US20020190266 Semiconductor package having a resin cap member
12/19/2002	US20020190262 Light emitting device
12/19/2002	US20020190252 In-line electrical monitor for measuring mechanical stress at the device level on a semiconductor wafer
12/19/2002	US20020190107 Method for forming a micro column grid array (CGA)
12/19/2002	US20020190106 Method for hermetic sealing of electronic parts
12/19/2002	US20020189860 Printed-wiring substrate and method for fabricating the printed-wiring substrate
12/19/2002	US20020189859 Printed circuit board and its manufacturing method
12/19/2002	US20020189853 BGA substrate with direct heat dissipating structure
12/19/2002	US20020189852 Fabricating method of semiconductor devices, fabricating method of printed wired boards, and printed wired board
12/19/2002	US20020189835 Semiconductor device
12/19/2002	US20020189834 Electronic element with a shielding
12/19/2002	US20020189832 Conductive cap, electronic component, and method of forming insulating film of conductive cap
12/19/2002	US20020189796 Active heat sink structure with directed air flow
12/19/2002	US20020189795 Thermal gap control
12/19/2002	US20020189794 Cooler for electrical and/ or electronic components, linked to present cooling needs
12/19/2002	US20020189792 Forced oscillatory flow type heat pipe and designing method for the same
12/19/2002	US20020189791 Liquid circulation cooler
12/19/2002	US20020189790 Heat sink
12/19/2002	US20020189789 CPU cooling arrangement
12/19/2002	US20020189742 Glass ceramic multilayer substrate manufacturing method and glass ceramic multilayer substrate product
12/19/2002	US20020189400 Well-controlled microstructure and morphology; electrocatalytic devices
12/19/2002	US20020189364 Method and apparatus for non-destructive testing of leaded packages
12/19/2002	US20020189094 Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
12/19/2002	US20020189091 Method of making printed circuit board
12/19/2002	DE10164049A1 Passive Bauelementstruktur und zugehöriges integriertes Schaltkreisbauelement und Halbleiterbauelement Passive component structure and related integrated circuit device and semiconductor device
12/19/2002	DE10161593A1 Flacher Halbleiterstapel Flat semiconductor stack
12/19/2002	DE10128756A1 Verpackung für ein elektronisches Bauelement Packaging for an electronic component
12/19/2002	DE10128707A1 Component used in electronics industry comprises substrate, structured silicon layer, and structured conducting layer containing strip conductors and arranged between substrate and silicon layer
12/19/2002	DE10128241A1 Production of an IC chip component comprises providing a base material layer with a photolacquer, removing the photolacquer, fixing a chip on each chip carrier surface, contacting with connecting contacts, and further processing
12/19/2002	DE10127934A1 Strip conductor arrangement used in integrated circuits comprises first insulating layer, second insulating layer, third insulating layer, strip conductors, electrical contact electrically coupling strip conductors in first and third layers
12/19/2002	DE10127385A1 Integrated circuit has screen for protecting strip conductor section from electromagnetic radiation and projects onto plane on both sides of strip conductor section
12/19/2002	DE10127351A1 Electronic chip comprises several external contacts of which at least two are provided with a plurality of nano-tubes for purposes of contacting an external contact of another electronic chip
12/19/2002	DE10126568A1 Elektronisches Bauelement Electronic component
12/19/2002	DE10126565A1 Device for heat dissipation in an integrated circuit having many levels is arranged in at least one of these levels
12/19/2002	DE10126310A1 Circuit board device for semiconductor memory device, has circuit board pads arranged in single columnar arrangement
12/19/2002	DE10123198A1 Housing with circuit-board arrangement, has part of heat-sink extending through opening in circuit-board
12/19/2002	CA2448338A1 High performance flipchip package that incorporates heat removal with minimal thermal mismatch
12/18/2002	EP1267596A2 Printed circuit board and its manufacturing method
12/18/2002	EP1267406A2 Electromagnetic wave suppressor sheet
12/18/2002	EP1267405A2 Semiconductor device and method for fabricating the same
12/18/2002	EP1267404A2 Package for an electronic device
12/18/2002	EP1267403A2 Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system
12/18/2002	EP1267402A2 Semiconductor device and method of production of same
12/18/2002	EP1267401A2 Semiconductor device and method of production of same
12/18/2002	EP1267400A2 Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using this composite material member
12/18/2002	EP1267399A2 Electronic device having a cap body sealed to a substrate and method for manufacturing the same
12/18/2002	EP1267391A1 A method to fabricate RF inductors with minimum area
12/18/2002	EP1267248A1 Protected storage of a data in an integrated circuit
12/18/2002	EP1266936A1 Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the composition
12/18/2002	EP1266926A1 Adhesive polyimide resin and adhesive laminate

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