H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2002
12/24/2002	US6498381 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
12/24/2002	US6498373 ESD protection CMOS structure with dynamic substrate control
12/24/2002	US6498307 Electronic component package, printing circuit board, and method of inspecting the printed circuit board
12/24/2002	US6498294 Package for high frequency device
12/24/2002	US6498260 Polyepoxides; electronic packages
12/24/2002	US6498112 Graded oxide caps on low dielectric constant (low K) chemical vapor deposition (CVD) films
12/24/2002	US6498110 Ruthenium silicide wet etch
12/24/2002	US6498099 Leadless plastic chip carrier with etch back pad singulation
12/24/2002	US6498098 Method of forming embedded wiring in a groove in an insulating layer
12/24/2002	US6498095 Cvd method for producing an interconnection film by depositing a lower layer to fill a recess performing a cleaning step to remove dissociated reactant gas, and consequently depositing an upper layer that has a smaller impurity concentration than the lower layer
12/24/2002	US6498092 Method of making a semiconductor device having dual damascene line structure using a patterned etching stopper
12/24/2002	US6498090 Semiconductor devices and methods for manufacturing the same
12/24/2002	US6498089 Semiconductor integrated circuit device with moisture-proof ring and its manufacture method
12/24/2002	US6498088 Stacked local interconnect structure and method of fabricating same
12/24/2002	US6498074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners
12/24/2002	US6498056 Apparatus and method for antifuse with electrostatic assist
12/24/2002	US6498055 Semiconductor device, method of manufacturing semiconductor device, resin molding die, and semiconductor manufacturing system
12/24/2002	US6498053 Process of manufacturing a composite structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material
12/24/2002	US6498043 Substrate sensor
12/24/2002	US6497963 Silicon oxycarbides and films having low dielectric constants and heat resistance, used as joints in integrated circuit chips
12/24/2002	US6497943 Surface metal balancing to reduce chip carrier flexing
12/24/2002	US6497805 Method for shorting pin grid array pins for plating
12/24/2002	US6497273 Fixing structure of radiator
12/24/2002	US6497110 Refrigeration system for electronic components having environmental isolation
12/24/2002	CA2145969C Transcription factor aprf
12/19/2002	WO2002102125A1 Heat sink and thermal interface having shielding to attenuate electromagnetic interference
12/19/2002	WO2002101831A1 Semiconductor device and its manufacturing method
12/19/2002	WO2002101830A2 Electronic components with plurality of contoured microelectronic spring contacts
12/19/2002	WO2002101829A1 Method for forming a wafer level chip scale package, and package formed thereby
12/19/2002	WO2002101827A2 High performance flipchip package that incorporates heat removal with minimal thermal mismatch
12/19/2002	WO2002101825A1 Method and structure for buried circuits and devices
12/19/2002	WO2002101822A2 Interconnection in semiconductor device and method for manufacturing the same
12/19/2002	WO2002101820A2 Conductor track arrangement and method for production of an encapsulated conductor coupling
12/19/2002	WO2002101813A1 A substrate for mounting a semiconductor device thereon
12/19/2002	WO2002101812A1 Chip lead frames
12/19/2002	WO2002101772A1 Low inductance grid array capacitor
12/19/2002	WO2002101642A1 Ic card
12/19/2002	WO2002100951A1 Thermosetting resin composition
12/19/2002	WO2002100769A2 A circuit encapsulation technique utilizing electroplating
12/19/2002	WO2002100631A1 Thermal interface, method of making and using
12/19/2002	WO2002079537A3 W-cvd with fluorine-free tungsten nucleation
12/19/2002	WO2002067322A3 Semiconductor device having signal contacts and high current power contacts
12/19/2002	WO2002067321A3 Enhanced die-down ball grid array and method for making the same
12/19/2002	WO2002067292A3 Semiconductor package and method of preparing same
12/19/2002	WO2002065492A3 Integrated transformer
12/19/2002	WO2002043137A3 Bump formation method and bump forming apparatus to semiconductor wafer
12/19/2002	WO2001073883A9 Low-temperature fabrication of thin-film energy-storage devices
12/19/2002	WO2001073868A9 Device enclosures and devices with integrated battery
12/19/2002	US20020193467 Conductive materials with electrical stability for use in electronics devices
12/19/2002	US20020193229 As substrate in which an electric circuit or circuits are formed
12/19/2002	US20020192987 Semiconductor device-socket
12/19/2002	US20020192952 Plasma treatment of tantalum nitride compound films formed by chemical vapor deposition
12/19/2002	US20020192950 Si-rich surface layer capped diffusion barriers
12/19/2002	US20020192946 Semiconductor device and method of manufacturing the same
12/19/2002	US20020192935 Semiconductor die including conductive columns
12/19/2002	US20020192928 Semiconductor chip and its manufacturing method
12/19/2002	US20020192926 High contrast lithography alignment marks for semiconductor manufacturing
12/19/2002	US20020192920 Passive devices and modules for transceiver and manufacturing method thereof
12/19/2002	US20020192895 Fabrication techniques for addressing cross-point diode memory arrays
12/19/2002	US20020192886 Semiconductor device and manufacturing method thereof
12/19/2002	US20020192879 Laser-assisted silicide fuse programming
12/19/2002	US20020192876 Transfer molding of integrated circuit packages
12/19/2002	US20020192875 Method for fabricating a circuit device
12/19/2002	US20020192874 Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device
12/19/2002	US20020192873 Method of fabricating a redundant pinout configuration for signal enhancement in an IC package
12/19/2002	US20020192872 Method of manufacturing semiconductor device
12/19/2002	US20020192871 Semiconductor device
12/19/2002	US20020192869 Semiconductor package and fabrication method of the same
12/19/2002	US20020192867 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof
12/19/2002	US20020192866 Semiconductor device and semiconductor chip for use therein
12/19/2002	US20020192865 Process for mounting electronic device and semiconductor device
12/19/2002	US20020192863 Multimedia chip package
12/19/2002	US20020192862 BGA package and method of fabrication
12/19/2002	US20020192861 Method and apparatus for filling a gap between spaced layers of a semiconductor
12/19/2002	US20020192860 Semiconductor device and method for fabricating the same
12/19/2002	US20020192859 Methods of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip
12/19/2002	US20020192858 Method for fabricating a circuit device
12/19/2002	US20020192857 Method for fabricating a circuit device
12/19/2002	US20020192856 Method for connecting a chip to an antenna in a contactless smart card radio frequency identification device
12/19/2002	US20020192855 Semiconductor device and method for manufacturing the same
12/19/2002	US20020192854 Method for packing semiconductor die
12/19/2002	US20020192846 Control signal transmitting method with package power pin and related integrated circuit package structure
12/19/2002	US20020192577 Forming first separated features on a surface, forming second separated features on surface interleaved between first separated features, and illuminating first and second separated features and detecting an interference pattern
12/19/2002	US20020192540 Fuel cells and batteries including metal-carbon composite powders
12/19/2002	US20020192492 Protective coating of tin/tin alloy having an outer surface doped for wisker-growth inhibition; e.g., gold or palladium dopes; used as an electrical connector or lead frame for integrated circuits; solderability; corrosion resistance
12/19/2002	US20020192488 Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member
12/19/2002	US20020192477 Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith
12/19/2002	US20020192464 Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same
12/19/2002	US20020192453 Composite material having a high thermal conductivity and method for manufacturing the composite material
12/19/2002	US20020192443 Electronic package interconnect structure comprising lead-free solders
12/19/2002	US20020192374 Method of forming CVD titanium film
12/19/2002	US20020192368 Method for the production of metal-carbon composite powders
12/19/2002	US20020192363 Electroless process for the preparation of particle enhanced electric contact surfaces
12/19/2002	US20020192320 Method and apparatus for filling a gap between spaced layers of a semiconductor
12/19/2002	US20020191835 Capacitive alignment structure and method for chip stacking
12/19/2002	US20020191383 Stackable ball grid array package
12/19/2002	US20020191382 Surface-mount device and method for manufacturing the surface-mount device
12/19/2002	US20020191380 Method and device for interconnecting, electronic components in three dimensions
12/19/2002	US20020191378 Semiconductor power element heat dissipation board, and conductor plate therefor and heat sink material and solder material
12/19/2002	US20020191377 Material of heat-dissipating plate on which semiconductor is mounted, method for fabricating the same, and ceramic package produced by using the same

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