H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2002
12/26/2002	US20020195719 Insitu radiation protection of integrated circuits
12/26/2002	US20020195718 Process for mounting electronic device and semiconductor device
12/26/2002	US20020195717 Intercrossedly-stacked dual-chip semiconductor package and method of fabricating the same
12/26/2002	US20020195716 Copper plated PTH barrels and methods for fabricating
12/26/2002	US20020195714 Method for forming conductor reservoir volume for integrated circuit interconnects
12/26/2002	US20020195713 Integrated circuit devices with contact hole alignment and methods of fabricating the same
12/26/2002	US20020195712 Semiconductor device, semiconductor device pattern designing method, and semiconductor device pattern designing apparatus
12/26/2002	US20020195711 Dual damascene circuit with upper wiring and interconnect line positioned in regions formed as two layers including organic polymer layer and low-permittivity layer
12/26/2002	US20020195708 Molded ball grid array
12/26/2002	US20020195707 Extension of fatigue life for C4 solder ball to chip connection
12/26/2002	US20020195706 Semiconductor apparatus with misalignment mounting detection
12/26/2002	US20020195705 Semiconductor apparatus with decoupling capacitor
12/26/2002	US20020195703 Semiconductor electronic parts
12/26/2002	US20020195702 Method and apparatus for conducting heat in a flip-chip assembly
12/26/2002	US20020195701 Electronic component and method for producing the electronic component
12/26/2002	US20020195699 Packaged die on PCB with heat sink encapsulant
12/26/2002	US20020195698 Semiconductor device
12/26/2002	US20020195697 Stacked mass storage flash memory package
12/26/2002	US20020195696 Packaging substrate for electronic elements and electronic device having packaged structure
12/26/2002	US20020195695 Substrate for semiconductor device, manufacturing method thereof, semiconductor device, and frame main body
12/26/2002	US20020195694 Transverse hybrid LOC package
12/26/2002	US20020195693 Packaging structure integrating passive devices
12/26/2002	US20020195692 Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same
12/26/2002	US20020195691 Multilevel leadframe for a packaged integrated circuit and method of fabrication
12/26/2002	US20020195690 Aluminum-silicon carbide semiconductor substrate and method for producing the same
12/26/2002	US20020195689 Transient voltage suppressor structure
12/26/2002	US20020195688 Reducing relative stress between HDP layer and passivation layer
12/26/2002	US20020195687 Integrated circuit device having cyanate ester buffer coat and method of fabricating same
12/26/2002	US20020195685 Microelectronic assemblies having compliant layers
12/26/2002	US20020195678 Semiconductor integrated circuit device
12/26/2002	US20020195676 Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system
12/26/2002	US20020195665 Novel umos-like gate-controlled thyristor structure for ESD protection
12/26/2002	US20020195664 Electrostatic discharge protection device
12/26/2002	US20020195662 Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor
12/26/2002	US20020195648 Semiconductor device having an ESD protective circuit
12/26/2002	US20020195647 Nonvolatile semiconductor memory and manufacturing method thereof
12/26/2002	US20020195639 Method and structure for reducing contact aspect ratios
12/26/2002	US20020195638 Formation of a frontside contact on silicon-on-insulator substrate
12/26/2002	US20020195632 Semiconductor memory device
12/26/2002	US20020195625 Semiconductor chip with fuse unit
12/26/2002	US20020195614 Ball grid array chip packages having improved testing and stacking characteristics
12/26/2002	US20020195602 Structure and method for fabricating double-sided semiconductor structures and devices utilizing the formation of a compliant substrate for materials used to form the same
12/26/2002	US20020195286 Power conversion apparatus and mobile object incorporating thereof
12/26/2002	US20020195272 Multilayered substrate for semiconductor device
12/26/2002	US20020195270 High frequency module device and method for its preparation
12/26/2002	US20020195238 Cooling device
12/26/2002	US20020195232 Heat sink and information processor using heat sink
12/26/2002	US20020195231 Laminated heat transfer device and method of producing thereof
12/26/2002	US20020195229 Heatsink design for uniform heat dissipation
12/26/2002	US20020195228 Thermal enhanced extended surface tape for integrated circuit heat dissipation
12/26/2002	US20020195171 Conductive paste and semiconductor component having conductive bumps made from the conductive paste
12/26/2002	US20020194731 Fabrication method and structure of an integrated circuit package
12/25/2002	CN2528189Y Small phase change heat-transfer device
12/25/2002	CN2528113Y Multi-chip packaging assembly
12/25/2002	CN2528112Y Multiplate plane spherical grid array package body
12/25/2002	CN2528111Y Radiator
12/25/2002	CN2528110Y Radiator combination
12/25/2002	CN2528109Y Packaged memory body for packaging multiple memory body chip
12/25/2002	CN2528051Y Radiator combination
12/25/2002	CN2528049Y Cpu散热片 Cpu heatsink
12/25/2002	CN1387746A Printed circuit board assembly
12/25/2002	CN1387681A Metal redistribution layer having solderable pads and wire bondable pads
12/25/2002	CN1387676A Improved apparatus and method for integrated circuit planarization
12/25/2002	CN1387284A Electric contactor and electric connection device using same
12/25/2002	CN1387261A 半导体装置 Semiconductor device
12/25/2002	CN1387258A Bonding area
12/25/2002	CN1387257A Stabilizing plate of heat radiator
12/25/2002	CN1387256A Crystal covered chip and crystal covered package substrate
12/25/2002	CN1387255A Crystal covered package substrate
12/25/2002	CN1387254A IC package structure without anti-welding film and its method
12/25/2002	CN1387253A High-density IC package structure and its method
12/25/2002	CN1387252A Semiconductor package with heat sink structure
12/25/2002	CN1387244A Bound board with electric conductor, method for mfg. semiconductor device and semiconductor device
12/25/2002	CN1387242A Method for forming packaging of flip-chip semiconductor, and semiconductor package and substrate thereby
12/25/2002	CN1387241A Method for forming packaging of flip-chip semiconductor
12/25/2002	CN1387240A Method for mfg. stacked semiconductor device
12/25/2002	CN1387239A Circuit board, semiconductor device mfg. method, and electroplating system
12/25/2002	CN1387203A Structure of transient over-voltage protector element
12/25/2002	CN1097313C Lead frame mfg. method
12/25/2002	CN1097312C Lead frame and mfg. method therefor, and semiconductor device using same
12/25/2002	CN1097303C Method for mfg. semiconductor device
12/25/2002	CN1097302C Method for forming plug in semiconductor device
12/25/2002	CN1097249C Card-like data substrate and lead frame used therein
12/24/2002	US6498726 Heat dissipation in electrical apparatus
12/24/2002	US6498724 Heat dissipation device for a computer
12/24/2002	US6498710 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
12/24/2002	US6498551 Millimeter wave module (MMW) for microwave monolithic integrated circuit (MMIC)
12/24/2002	US6498398 Semiconductor device having through holes selectively through isolation material covering wirings that are relatively far apart
12/24/2002	US6498397 Seed layer with annealed region for integrated circuit interconnects
12/24/2002	US6498396 Semiconductor chip scale package and ball grid array structures
12/24/2002	US6498395 Heat sink with cooling fins for semiconductor package
12/24/2002	US6498394 IC packages with diamond substrate thermal conductor
12/24/2002	US6498393 Semiconductor device and method for the fabrication thereof
12/24/2002	US6498392 Semiconductor devices having different package sizes made by using common parts
12/24/2002	US6498391 Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the same
12/24/2002	US6498390 Integrated circuit package that includes a thermally conductive tape which attaches a thermal element to a plastic housing
12/24/2002	US6498389 Ultra-thin semiconductor package device using a support tape
12/24/2002	US6498388 Semiconductor module with improved solder joint reliability
12/24/2002	US6498387 Wafer level package and the process of the same
12/24/2002	US6498385 Post-fuse blow corrosion prevention structure for copper fuses

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