H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2002
12/31/2002	US6501107 Addressable fuse array for circuits and mechanical devices
12/31/2002	US6501104 High speed semiconductor photodetector
12/31/2002	US6500769 Semiconductor device and method for fabricating the same
12/31/2002	US6500762 Method of depositing a copper seed layer which promotes improved feature surface coverage
12/31/2002	US6500761 Method for improving the adhesion and durability of CVD tantalum and tantalum nitride modulated films by plasma treatment
12/31/2002	US6500753 Method to reduce the damages of copper lines
12/31/2002	US6500751 Method of forming recessed thin film landing pad structure
12/31/2002	US6500750 Semiconductor device and method of formation
12/31/2002	US6500749 Method to improve copper via electromigration (EM) resistance
12/31/2002	US6500748 Semiconductor device and method of manufacturing the same
12/31/2002	US6500746 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
12/31/2002	US6500725 Microelectronic fabrication method providing alignment mark and isolation trench of identical depth
12/31/2002	US6500722 Inductor recognition method, layout inspection method, computer readable recording medium in which a layout inspection program is recorded and process for a semiconductor device
12/31/2002	US6500706 Bit-line interconnection scheme for eliminating coupling noise in stack DRAM cell with capacitor under bit-line (CUB) in stand-alone or embedded DRAM
12/31/2002	US6500698 Method for fabricating a stacked semiconductor chip package
12/31/2002	US6500697 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes
12/31/2002	US6500696 Face to face chip
12/31/2002	US6500685 Method for evaluating molding material with dams formed on a semiconductor substrate to define slits for capturing fillers contained in the molding material
12/31/2002	US6500684 Method and apparatus of manufacturing semiconductor device
12/31/2002	US6500675 Manufacturing method of semiconductor device having capacitive element
12/31/2002	US6500564 Semiconductor encapsulating epoxy resin composition and semiconductor device
12/31/2002	US6500528 Enhancements in sheet processing and lead formation
12/31/2002	US6500355 Wafer conductive structure for preventing plasma damage
12/31/2002	US6500024 Circuit protection mechanism for CPU socket
12/31/2002	US6500019 Electrical socket
12/27/2002	WO2002103852A2 Method and apparatus for non-destructive testing of leaded packages
12/27/2002	WO2002103809A1 Encapsulated photovoltaic modules and method of manufacturing same
12/27/2002	WO2002103805A1 A permanently-on transistor buried contact
12/27/2002	WO2002103794A1 A method of producing a lamp
12/27/2002	WO2002103793A1 Semiconductor device and manufacturing method thereof
12/27/2002	WO2002103792A2 Method of manufacturing a semiconductor device and semiconductor device
12/27/2002	WO2002103791A2 Semiconductor structure implementing sacrificial material and methods for making and implementing the same
12/27/2002	WO2002103790A1 Reduction of via-resistance-shift by increasing via size at a last conductor level of a semiconductor device
12/27/2002	WO2002103789A2 Electronic assembly with laterally connected capacitors and manufacturing method
12/27/2002	WO2002103788A1 High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing
12/27/2002	WO2002103787A1 Substrate for use in joining element
12/27/2002	WO2002103784A1 Method for producing miniature amplifier and signal processing unit
12/27/2002	WO2002103782A2 Barrier enhancement process for copper interconnects
12/27/2002	WO2002103755A2 Semiconductor die including conductive columns
12/27/2002	WO2002103700A1 Detachable packaging for a programmable device with means for programming the device from the exterior
12/27/2002	WO2002103627A1 Method for connecting a chip to the antenna of a radio frequency identification device of a contactless chip card variety
12/27/2002	WO2002103271A1 Method for producing heat exchangers in a sintering method
12/27/2002	WO2002103268A2 Multi-purpose microchannel micro-component
12/27/2002	WO2002102524A1 Electroless process for the preparation of particle enhanced electric contact surfaces
12/27/2002	WO2002102267A1 Hermetic feedthrough for an implantable device
12/27/2002	WO2002089260A3 Separable power delivery connector
12/27/2002	WO2002070191A8 Fluxing underfill compositions
12/27/2002	WO2002050907A9 Interconnection of active and passive components in substrate
12/27/2002	WO2002041335A3 High quality printed inductor on a package
12/27/2002	CA2450156A1 A method of producing a lamp
12/27/2002	CA2388890A1 Hermetically sealing enclosure for housing photo-semiconductor devices and photo-semiconductor module incorporating the enclosure
12/26/2002	US20020199159 Naked chip motherboard module
12/26/2002	US20020199049 Signal bus arrangement
12/26/2002	US20020198286 Electromagnetic wave suppressor sheet
12/26/2002	US20020197923 Polymer matrix; and carbon powders obtained by graphitizing a polymeric material that has an aromatic ring on its main chain by heating; carbon powders are aligned in a certain direction in the polymer matrix.
12/26/2002	US20020197866 Fabrication method of a semiconductor device
12/26/2002	US20020197865 Method for forming a capping layer on a copper interconnect
12/26/2002	US20020197863 System and method to form a composite film stack utilizing sequential deposition techniques
12/26/2002	US20020197861 Titanium disilicide resistance in pinched active regions of semiconductor devices
12/26/2002	US20020197857 Method of using tantalum-aluminum-nitrogen material as diffusion barrier and adhesion layer in semiconductor devices
12/26/2002	US20020197856 Method of forming a barrier film and method of forming wiring structure and electrodes of semiconductor device having a barrier film
12/26/2002	US20020197849 Very low dielectric constant plasma-enhanced CVD films
12/26/2002	US20020197848 Semiconductor processing methods of forming integrated circuitry, forming conductive lines, forming a conductive grid, forming a conductive network, forming an electrical interconnection to a node location, forming an electrical interconnection with a transistor source/drain region, and integrated circuitry
12/26/2002	US20020197845 Process for making an electronic device having a multilevel structure
12/26/2002	US20020197843 Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components
12/26/2002	US20020197833 Method of varying the resistance along a conductive layer
12/26/2002	US20020197826 Singulation method used in leadless packaging process
12/26/2002	US20020197815 Semiconductor device having capacitors and method of manufacturing the same
12/26/2002	US20020197813 Method of forming contact holes in semiconductor devices and method of forming capacitors using the same
12/26/2002	US20020197778 Semiconductor device and method of manufacturing the same
12/26/2002	US20020197775 Laminating method for forming integrated circuit microelectronic fabrication
12/26/2002	US20020197773 High-frequency module, method of manufacturing thereof and method of molding resin
12/26/2002	US20020197772 Method of attaching a leadframe to singulated semiconductor dice
12/26/2002	US20020197771 Semiconductor package and a method for producing the same
12/26/2002	US20020197770 Method of manufacturing semiconductor chips
12/26/2002	US20020197769 Semiconductor package with semiconductor chips stacked therein and method of making the package
12/26/2002	US20020197768 Flip chip semicondustor device and method of making the same
12/26/2002	US20020197767 Apparatus, method and product therefrom, for aligning die to interconnect metal on flex substrate
12/26/2002	US20020197766 Method and apparatus for conducting heat in a flip-chip assembly
12/26/2002	US20020197751 Method and structure for measuring bridge induced by mask layout amendment
12/26/2002	US20020197749 Method of monitoring and controlling a photoresist edge bead
12/26/2002	US20020197748 Method and structure for measuring bridge induced by mask layout amendment
12/26/2002	US20020197488 Use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass to enhance the reliability of the electrical connection of a silver-based conductor film
12/26/2002	US20020197458 Minimizing distortion of pattern while curving rod-like element forming loop shaped device such as steering wheel or rings
12/26/2002	US20020197457 Impregnated printed circuit board, and manufacturing method therefor
12/26/2002	US20020197399 Method for production of microcapsule type conductive filler
12/26/2002	US20020196615 Shielded electronics package structure with enhanced mechanical reliability
12/26/2002	US20020196614 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
12/26/2002	US20020196610 Eelectronic power module and a power component designed to equip such a module
12/26/2002	US20020196607 Heat sink for electronic components
12/26/2002	US20020196604 System for cooling a component in a computer system
12/26/2002	US20020196097 High-frequency module
12/26/2002	US20020196096 Balun and semiconductor device including the balun
12/26/2002	US20020196085 High frequency module
12/26/2002	US20020195725 Resin-encapsulated semiconductor apparatus and process for its fabrication
12/26/2002	US20020195724 Resin-encapsulated semiconductor apparatus and process for its fabrication
12/26/2002	US20020195723 Bond pad structure
12/26/2002	US20020195722 Structure and mounting method
12/26/2002	US20020195721 Cavity down ball grid array packaging structure
12/26/2002	US20020195720 Flip chip type semiconductor device and method of manufacturing the same

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