| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/02/2003 | EP1272018A2 Method of mounting electronic parts with Sn-Zn solder free of Pb |
| 01/02/2003 | EP1271723A2 Cooling device |
| 01/02/2003 | EP1271648A1 Power semiconductor package and method for making the same |
| 01/02/2003 | EP1271647A2 Compound semiconductor device |
| 01/02/2003 | EP1271646A2 Electronic power module and power component for such a module |
| 01/02/2003 | EP1271645A1 Method and device for fastening IC packages on a printed circuit board |
| 01/02/2003 | EP1271644A1 Wiring board, semiconductor device, and method of manufacturing wiring board |
| 01/02/2003 | EP1271640A2 Mold for manufacturing semiconductor device |
| 01/02/2003 | EP1271633A2 Method of functionalization and passivation of the surface of silicon wafers by electrodeposition of thin organic layers |
| 01/02/2003 | EP1270697A2 Integrated circuit chip bonding sheet and integrated circuit package |
| 01/02/2003 | EP1270694A1 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof |
| 01/02/2003 | EP1270675A1 Moisture absorbing formed article |
| 01/02/2003 | EP1270668A1 Epoxy resin composition and electronic part |
| 01/02/2003 | EP1269808A1 Method for fabricating electrical connecting elements, and connecting element |
| 01/02/2003 | EP1269807A1 Method for fabricating electrical connecting element, and electrical connecting element |
| 01/02/2003 | EP1269805A1 Electrical circuit and substrate therefor |
| 01/02/2003 | EP1269804A1 Electrical connecting element and method of fabricating the same |
| 01/02/2003 | EP1269539A1 Semiconductor component with contacts provided on the lower side thereof, and method for producing the same |
| 01/02/2003 | EP1269533A1 Method for producing a heat-conducting connection between two work pieces |
| 01/02/2003 | EP1269532A1 Housing assembly for an electronic component |
| 01/02/2003 | EP1269531A1 Electronic device packaging |
| 01/02/2003 | EP1269450A1 Component provided with a description |
| 01/02/2003 | EP1268665A1 Flame retardant phosphorus element-containing epoxy resin compositions |
| 01/02/2003 | EP1268054A1 Electrocatalyst powders, methods for producing powders and devices fabricated from same |
| 01/02/2003 | EP1127479B1 An electrical component and an electrical circuit module having connected ground planes |
| 01/02/2003 | EP0855090B1 Multichip module |
| 01/02/2003 | EP0588944B1 An improved miniature transponder device |
| 01/01/2003 | CN2529387Y Improved of ligh-emitting diode |
| 01/01/2003 | CN2529306Y CPU heat sink device |
| 01/01/2003 | CN2529305Y CPU heat sink |
| 01/01/2003 | CN2529304Y Fan of electronic heat sink |
| 01/01/2003 | CN2529303Y Device for fixing cooling fin |
| 01/01/2003 | CN1389089A High capacity memory module with higher density and improved manufacturability |
| 01/01/2003 | CN1389005A High reliability interposer of low-cost and high reliability application |
| 01/01/2003 | CN1388989A Method of manufactring a semi conductor device having a porous dielectric layer and air gaps |
| 01/01/2003 | CN1388987A Chip image display device for semiconductor testing system anel its method |
| 01/01/2003 | CN1388985A Fabrication process of a semiconductor device |
| 01/01/2003 | CN1388977A Semiconductor inductor and methods for making the same |
| 01/01/2003 | CN1388636A Power converter, photovoltaic element assembly and power generation equipment using the same assembly |
| 01/01/2003 | CN1388584A Semiconductor device |
| 01/01/2003 | CN1388583A Two-stage electrostatic discharge protecting circuit with acceleratively conducting secondary stage |
| 01/01/2003 | CN1388582A 半导体器件 Semiconductor devices |
| 01/01/2003 | CN1388581A Fan unit with guide design |
| 01/01/2003 | CN1388580A 半导体器件 Semiconductor devices |
| 01/01/2003 | CN1388579A High-density integrated circuit configuration structure and method |
| 01/01/2003 | CN1388578A Staircase shape pattern for semiconductor chip welding |
| 01/01/2003 | CN1388577A Strap for forming resin pull-rod and resin |
| 01/01/2003 | CN1388566A Connecting tape for semiconductor chip loading, carrier and package for semiconductor chip |
| 01/01/2003 | CN1388538A Composite electronic element and method for producing the same element |
| 01/01/2003 | CN1388398A Optical semiconductor and seal package of optical semiconductor module |
| 01/01/2003 | CN1097853C Lead frame of semiconductor package |
| 01/01/2003 | CN1097852C Miniature semiconductor for surface mounting and carrier bar adapted for its production |
| 12/31/2002 | US6502231 Integrated circuit template cell system and method |
| 12/31/2002 | US6502226 Semiconductor device, semiconductor device design method, semiconductor device design method recording medium, and semiconductor device design support system |
| 12/31/2002 | US6502225 Semiconductor device, semiconductor device design method, semiconductor device design method recording medium, and semiconductor device design support system |
| 12/31/2002 | US6501663 Three-dimensional interconnect system |
| 12/31/2002 | US6501658 Heatsink mounting with shock absorbers |
| 12/31/2002 | US6501657 Torsional heat sink retention device |
| 12/31/2002 | US6501656 Clip for heat sink |
| 12/31/2002 | US6501655 High performance fin configuration for air cooled heat sinks |
| 12/31/2002 | US6501654 Microfluidic devices for heat transfer |
| 12/31/2002 | US6501652 Heat sink and information processor using it |
| 12/31/2002 | US6501651 Heat sink capable of having a fan mounted aslant to the lateral side thereof |
| 12/31/2002 | US6501647 Computer with thermal cooling and a thermal cooling system and method |
| 12/31/2002 | US6501363 Vertical transformer |
| 12/31/2002 | US6501352 High frequency wiring board and its connecting structure |
| 12/31/2002 | US6501189 Alignment mark of semiconductor wafer for use in aligning the wafer with exposure equipment, alignment system for producing alignment signals from the alignment mark, and method of determining the aligned state of a wafer from the alignment mark |
| 12/31/2002 | US6501188 Method for improving a stepper signal in a planarized surface over alignment topography |
| 12/31/2002 | US6501187 Semiconductor package structure having central leads and method for packaging the same |
| 12/31/2002 | US6501186 Bond pad having variable density via support and method for fabrication |
| 12/31/2002 | US6501184 Semiconductor package and method for manufacturing the same |
| 12/31/2002 | US6501183 Semiconductor device and a method of manufacturing the same and an electronic device |
| 12/31/2002 | US6501182 Semiconductor device and method for making the same |
| 12/31/2002 | US6501181 Arrangement relating to electronic circuitry |
| 12/31/2002 | US6501179 Matrix of non-gaseous material and at least one void within the matrix, the matrix comprising carbon having silicon carbide of formula sicx dispersed therein, where ?x? is 0.2 to 0.5; low dielectric constant materials |
| 12/31/2002 | US6501178 Semiconductor device |
| 12/31/2002 | US6501176 Deflectable interconnect |
| 12/31/2002 | US6501175 Semiconductor device with semiconductor chip on flexible tape |
| 12/31/2002 | US6501174 Interconnect structure for surface mounted devices |
| 12/31/2002 | US6501173 Semiconductor device |
| 12/31/2002 | US6501172 Power module |
| 12/31/2002 | US6501171 Flip chip package with improved cap design and process for making thereof |
| 12/31/2002 | US6501170 Substrates and assemblies including pre-applied adhesion promoter |
| 12/31/2002 | US6501169 Semiconductor device which prevents leakage of noise generated in a circuit element forming area and which shields against external electromagnetic noise |
| 12/31/2002 | US6501168 Substrate for an integrated circuit package |
| 12/31/2002 | US6501167 Low inductance power wiring structure and semiconductor device |
| 12/31/2002 | US6501166 Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance |
| 12/31/2002 | US6501164 Multi-chip semiconductor package with heat dissipating structure |
| 12/31/2002 | US6501162 Semiconductor device, semiconductor module and hard disk |
| 12/31/2002 | US6501161 Semiconductor package having increased solder joint strength |
| 12/31/2002 | US6501160 Semiconductor device and a method of manufacturing the same and a mount structure |
| 12/31/2002 | US6501159 Power transistor module, power amplifier and method in the fabrication thereof |
| 12/31/2002 | US6501158 Structure and method for securing a molding compound to a leadframe paddle |
| 12/31/2002 | US6501157 Substrate for accepting wire bonded or flip-chip components |
| 12/31/2002 | US6501156 Lead frame which includes a die pad, a support lead, and inner leads |
| 12/31/2002 | US6501153 Semiconductor device and drive circuit using the semiconductor devices |
| 12/31/2002 | US6501150 Fuse configuration for a semiconductor apparatus |
| 12/31/2002 | US6501141 Self-aligned contact with improved isolation and method for forming |
| 12/31/2002 | US6501137 Electrostatic discharge protection circuit triggered by PNP bipolar action |
| 12/31/2002 | US6501115 Semiconductor integrated circuit device and process for manufacturing the same |