| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/02/2003 | US20030003664 Semiconductor device and manufacturing method thereof |
| 01/02/2003 | US20030003632 Formation of antifuse structure in a three dimensional memory |
| 01/02/2003 | US20030003630 Hybrid integrated circuit device |
| 01/02/2003 | US20030003629 Hybrid integrated circuit device and manufacturing method thereof |
| 01/02/2003 | US20030003628 Lead frame and method for fabricating resin-encapsulated semiconductor device |
| 01/02/2003 | US20030003627 Method for manufacturing a resin-sealed semiconductor device |
| 01/02/2003 | US20030003626 Open-cavity semiconductor die package |
| 01/02/2003 | US20030003625 Leadframe pedestals for uniform die attach |
| 01/02/2003 | US20030003622 Semiconductor device fabrication method and semiconductor device fabrication device |
| 01/02/2003 | US20030003617 Semiconductor device and method of fabricating the same |
| 01/02/2003 | US20030003608 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them |
| 01/02/2003 | US20030003606 Reduced terminal testing system |
| 01/02/2003 | US20030003603 Thin film multi-layer high Q transformer formed in a semiconductor substrate |
| 01/02/2003 | US20030003401 Technique for the size reduction of vias and other images in semiconductor chips |
| 01/02/2003 | US20030003382 Microchip having grayscale and micromachined features and single mask process for patterning same |
| 01/02/2003 | US20030003320 Plating film onto an object at a first current density in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. |
| 01/02/2003 | US20030003303 UV light irradiation process on a metal oxide film in vacuum or in an atmosphere of reducing gas at a temperature maintained between 25 degrees C. and 300 degrees C to reduce resistance |
| 01/02/2003 | US20030003288 Semiconductor integrated circuit having a fast response can be produced by using the film formed from a polysiloxane crosslinked with a polycarbosilane |
| 01/02/2003 | US20030003287 Heat conductive resin substrate and semiconductor package |
| 01/02/2003 | US20030002360 Device for and method of storing identification data in an integrated circuit |
| 01/02/2003 | US20030002271 Integrated EMC shield for integrated circuits and multiple chip modules |
| 01/02/2003 | US20030002268 Ultra-low impedance power interconnection system for electronic packages |
| 01/02/2003 | US20030002260 Electronic apparatus |
| 01/02/2003 | US20030002259 Device and method for mounting integrated circuits on a printed circuit card |
| 01/02/2003 | US20030002258 Mounting fitting of heat sink and method of removing the same |
| 01/02/2003 | US20030002257 Electronic component cooling apparatus |
| 01/02/2003 | US20030002256 Cooling device for cooling ICs |
| 01/02/2003 | US20030002179 Indicators and iluminators using a semiconductor radiation emitter package |
| 01/02/2003 | US20030002043 Periodic patterns and technique to control misalignment |
| 01/02/2003 | US20030001713 Integrated transformer |
| 01/02/2003 | US20030001712 Raised on-chip inductor and method of manufacturing same |
| 01/02/2003 | US20030001605 Temperature control of electronic devices using power following feedback |
| 01/02/2003 | US20030001289 Resin-sealed semiconductor device and manufacturing method thereof |
| 01/02/2003 | US20030001288 Ball grid array chip packages having improved testing and stacking characteristics |
| 01/02/2003 | US20030001287 Flexible tape electronics packaging |
| 01/02/2003 | US20030001286 Semiconductor package and flip chip bonding method therein |
| 01/02/2003 | US20030001285 Semiconductor package and method for manufacturing the same |
| 01/02/2003 | US20030001284 On-die de-coupling capacitor using bumps or bars and method of making same |
| 01/02/2003 | US20030001282 Metal barrier behavior by sic:h deposition on porous materials |
| 01/02/2003 | US20030001281 Stacked chip package having upper chip provided with trenches and method of manufacturing the same |
| 01/02/2003 | US20030001280 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
| 01/02/2003 | US20030001279 Microwave structure semiconductor device |
| 01/02/2003 | US20030001278 Method for manufacturing a semiconductor device and a semiconductor device |
| 01/02/2003 | US20030001277 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
| 01/02/2003 | US20030001276 Semiconductor device and method of manufacture thereof |
| 01/02/2003 | US20030001275 Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect |
| 01/02/2003 | US20030001273 Structure and method for isolating porous low-k dielectric films |
| 01/02/2003 | US20030001272 Method of fabricating interlevel connectors using only one photomask step |
| 01/02/2003 | US20030001270 Semiconductor device having an improved multi-layer interconnection structure and manufacturing method thereof |
| 01/02/2003 | US20030001269 Semiconductor integrated circuit device, design method for semiconductor integrated circuit device, design aiding device for semiconductor integrated circuit device, program, and program recording medium |
| 01/02/2003 | US20030001267 Semiconductor wafer device having separated conductive patterns in peripheral area and its manufacture method |
| 01/02/2003 | US20030001266 Agglomeration control using early transition metal alloys |
| 01/02/2003 | US20030001265 Thin titanium nitride layers used in conjunction with tungsten |
| 01/02/2003 | US20030001260 Semiconductor devices having different package sizes made by using common parts |
| 01/02/2003 | US20030001259 Hermetically sealing enclosure for housing photo-semiconductor devices and photo-semiconductor module incorporating the enclosure |
| 01/02/2003 | US20030001258 Semiconductor device, including an arrangementto provide a uniform press contact and converter using same |
| 01/02/2003 | US20030001257 Semiconductor device and semiconductor assembly apparatus for semiconductor device |
| 01/02/2003 | US20030001256 Wiring substrate having position information |
| 01/02/2003 | US20030001255 Hybrid integrated circuit device and manufacturing method thereof |
| 01/02/2003 | US20030001254 Electronic assembly with separate power and signal connections |
| 01/02/2003 | US20030001253 Semiconductor device |
| 01/02/2003 | US20030001252 Semiconductor package including stacked chips |
| 01/02/2003 | US20030001251 Wafer level interconnection |
| 01/02/2003 | US20030001250 TCP optical device |
| 01/02/2003 | US20030001249 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device |
| 01/02/2003 | US20030001248 Stress-relieving heatsink structure and method of attachment to an electronic package |
| 01/02/2003 | US20030001247 High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing |
| 01/02/2003 | US20030001246 Compression layer on the leadframe to reduce stress defects |
| 01/02/2003 | US20030001245 Interdigitated capacitor design for integrated circuit lead frames |
| 01/02/2003 | US20030001244 Lead frame, resin-sealed semiconductor device, and method for fabricating the same |
| 01/02/2003 | US20030001243 Method of monitoring ultra-thin nitride quality by wet re-oxidation |
| 01/02/2003 | US20030001242 Adhesive material for programmable device |
| 01/02/2003 | US20030001241 Semiconductor device and method of fabrication |
| 01/02/2003 | US20030001240 Semiconductor devices containing a discontinuous cap layer and methods for forming same |
| 01/02/2003 | US20030001239 Porous materials |
| 01/02/2003 | US20030001231 Multi-layer inductor formed in a semiconductor substrate |
| 01/02/2003 | US20030001226 Semiconductor device and the manufacturing method thereof |
| 01/02/2003 | US20030001222 Low data line capacitance image sensor array using air-gap metal crossover |
| 01/02/2003 | US20030001211 Modified contact for programmable devices |
| 01/02/2003 | US20030001201 Semiconductor device and manufacturing method thereof |
| 01/02/2003 | US20030001192 Wiring layer structure for ferroelectric capacitor |
| 01/02/2003 | US20030001188 High-dielectric constant metal-insulator metal capacitor in VLSI multi-level metallization systems |
| 01/02/2003 | US20030001186 Semiconductor memory device capable of preventing oxidation of plug and method for fabricating the same |
| 01/02/2003 | US20030001183 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
| 01/02/2003 | US20030001179 Semiconductor device and method of manufacturing therefor |
| 01/02/2003 | US20030001172 Low loss interconnect structure for use in microelectronic circuits |
| 01/02/2003 | US20030000995 Recognition device, bonding device, and method of manufacturing a circuit device |
| 01/02/2003 | US20030000739 Circuit housing clamp and method of manufacture therefor |
| 01/02/2003 | US20030000738 Solder resist opening to define a combination pin one indicator and fiducial |
| 01/02/2003 | US20030000737 Masking layer in substrate cavity |
| 01/02/2003 | US20030000736 Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate |
| 01/02/2003 | US20030000734 Printed-wiring board, method for identifying same, and method for manufacturing same |
| 01/02/2003 | US20030000689 Heat dissipater |
| 01/02/2003 | US20030000684 Heat dissipation device with high efficiency |
| 01/02/2003 | US20030000682 Using micro heat pipes as heat exchanger unit for notebook applications |
| 01/02/2003 | US20030000681 Efficient heat pumping from mobile platforms using on platform assembled heat pipe |
| 01/02/2003 | US20030000568 Encapsulated photovoltaic modules and method of manufacturing same |
| 01/02/2003 | US20030000082 IC package with dual heat spreaders |
| 01/02/2003 | US20030000079 Method for manufacturing multilayer ceramic substrates |
| 01/02/2003 | EP1272020A1 Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |