Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2013
12/31/2013US8618643 Semiconductor device and lead frame used for the same
12/31/2013US8618642 Semiconductor device
12/31/2013US8618641 Leadframe-based semiconductor package
12/31/2013US8618640 Method of shielding through silicon vias in a passive interposer
12/31/2013US8618637 Semiconductor package using through-electrodes having voids
12/31/2013US8618632 Semiconductor device and multi-layered wiring substrate
12/31/2013US8618630 Semiconductor device
12/31/2013US8618628 Buffered fuse for integrated circuit reconfiguration by laser
12/31/2013US8618618 Semiconductor device
12/31/2013US8618613 Methods of forming secured metal gate antifuse structures
12/31/2013US8618608 Lateral silicon controlled rectifier structure
12/31/2013US8618606 Semiconductor device
12/31/2013US8618585 Semiconductor apparatus including cooling base with projections
12/31/2013US8618584 Semiconductor device
12/31/2013US8618580 Integrated circuit chips with fine-line metal and over-passivation metal
12/31/2013US8618573 Layered substrate, light-emitting diode including the layered substrate and lighting device using the light-emitting diode
12/31/2013US8618557 Wide-band-gap reverse-blocking MOS-type semiconductor device
12/31/2013US8618541 Semiconductor apparatus
12/31/2013US8618540 Semiconductor packages
12/31/2013US8618539 Interconnect sensor for detecting delamination
12/31/2013US8617989 Liner property improvement
12/31/2013US8617984 Tungsten metallization: structure and fabrication of same
12/31/2013US8617981 Semiconductor device and manufacturing method thereof
12/31/2013US8617934 Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages
12/31/2013US8617925 Methods of forming bonded semiconductor structures in 3D integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods
12/31/2013US8617924 Stacked integrated circuit package-in-package system and method of manufacture thereof
12/31/2013US8617071 Analyte monitoring device and methods of use
12/31/2013US8616266 Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid
12/27/2013WO2013192534A1 Rinsing solution to prevent tin pattern collapse
12/27/2013WO2013192323A1 Sidewall protection of low-k material during etching and ashing
12/27/2013WO2013192194A1 Microelectronic assembly tolerant to misplacement of microelectronic elements therein
12/27/2013WO2013192054A1 Semiconductor chip with expansive underbump metallization structures
12/27/2013WO2013192053A1 Thermal management circuit board for stacked semiconductor chip device
12/27/2013WO2013191656A1 A layer arrangement and a wafer level package comprising the layer arrangement
12/27/2013WO2013191618A1 Precise definition of transducer electrodes
12/27/2013WO2013191116A1 Method of forming thermal interface material and heat dissipation structure
12/27/2013WO2013191075A1 Amorphous inorganic anion exchanger, resin composition for sealing electronic component, and method for producing amorphous bismuth compound
12/27/2013WO2013191065A1 Method for forming film containing manganese
12/27/2013WO2013191012A1 Epoxy resin, method for producing same, epoxy resin composition, and cured product
12/27/2013WO2013190981A1 Sealed container, electronic device, and solar cell module
12/27/2013WO2013190925A1 Electronic component module
12/27/2013WO2013190895A1 Semiconductor device manufacturing method and film forming device
12/27/2013WO2013190863A1 Stacked semiconductor device and method for manufacturing same
12/27/2013WO2013190848A1 Mounting substrate and method for manufacturing same, led module
12/27/2013WO2013190765A1 Hard mask and process for producing hard mask
12/27/2013WO2013190759A1 Solid-state imaging element and method for manufacturing same
12/27/2013WO2013190749A1 Surface mounted piezoelectric vibrator
12/27/2013WO2013189756A1 Substrate for mounting multiple power transistors thereon and power semiconductor module
12/27/2013WO2013188991A1 Light-emitting diode package and heat dissipation module used by same
12/26/2013US20130344693 Semiconductor device and a method of manufacturing the same
12/26/2013US20130344679 Environmentally-assisted technique for transferring devices onto non-conventional substrates
12/26/2013US20130344659 Microelectronic package having direct contact heat spreader and method of manufacturing same
12/26/2013US20130344654 Process For Flip-Chip Connection of an Electronic Component
12/26/2013US20130344274 Pressure-sensitive adhesive tape for protecting surface of semiconductor parts
12/26/2013US20130342986 Pin connector structure and method
12/26/2013US20130342831 Device-like scatterometry overlay targets
12/26/2013US20130342263 Heater for semiconductor device
12/26/2013US20130341807 Semiconductor package structure
12/26/2013US20130341806 Substrate structure and semiconductor package using the same
12/26/2013US20130341802 Integrated circuit package having offset vias
12/26/2013US20130341801 Redeposition Control in MRAM Fabrication Process
12/26/2013US20130341800 Integrated Circuit Packages and Methods for Forming the Same
12/26/2013US20130341799 Through silicon via structure and method of fabricating the same
12/26/2013US20130341798 Apparatuses including stair-step structures and methods of forming the same
12/26/2013US20130341797 Semiconductor devices and methods of manufacturing the same
12/26/2013US20130341796 Semiconductor device with redistributed contacts
12/26/2013US20130341795 Methods of Forming Semiconductor Constructions
12/26/2013US20130341794 Ultra-thin copper seed layer for electroplating into small features
12/26/2013US20130341793 Semiconductor device and method of manufacturing the same
12/26/2013US20130341791 Process For Enhanced 3D Integration and Structures Generated Using the Same
12/26/2013US20130341790 Interchangeable connection arrays for double-sided dimm placement
12/26/2013US20130341789 Semiconductor Device and Method of Forming a Wafer Level Package with Top and Bottom Solder Bump Interconnection
12/26/2013US20130341788 Semiconductor device and method of manufacturing the same, and wiring substrate and method of manufacturing the same
12/26/2013US20130341787 Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
12/26/2013US20130341786 Package on Package Devices and Methods of Packaging Semiconductor Dies
12/26/2013US20130341785 Semiconductor chip with expansive underbump metallization structures
12/26/2013US20130341784 Semiconductor Device and Method of Forming an Embedded SOP Fan-Out Package
12/26/2013US20130341783 Interposer with identification system
12/26/2013US20130341782 Semiconductor package module
12/26/2013US20130341781 Heat transfer member and module with the same
12/26/2013US20130341780 Chip arrangements and a method for forming a chip arrangement
12/26/2013US20130341779 Method of manufacturing a semiconductor device and semiconductor device
12/26/2013US20130341778 Device Contact, Electric Device Package and Method of Manufacturing an Electric Device Package
12/26/2013US20130341777 Electro-Thermal Cooling Devices and Methods of Fabrication Thereof
12/26/2013US20130341776 Semiconductor Device Apparatus and Assembly with Opposite Die Orientations
12/26/2013US20130341775 Semiconductor module
12/26/2013US20130341774 Semiconductor package and method of fabricating the same
12/26/2013US20130341772 Substrate conductor structure and method
12/26/2013US20130341768 Self repairing process for porous dielectric materials
12/26/2013US20130341766 Component having through-hole plating, and method for its production
12/26/2013US20130341765 Semiconductor device and method for manufacturing semiconductor device
12/26/2013US20130341763 Bonded substrate and manufacturing method thereof
12/26/2013US20130341762 Semiconductor hole structure
12/26/2013US20130341757 Masking-Less Fuse Formation with Oxide Remaining
12/26/2013US20130341755 Soi substrate, method for manufacturing soi substrate, and method for manufacturing semiconductor device
12/26/2013US20130341751 Semiconductor device
12/26/2013US20130341735 Anodically bonded strain isolator
12/26/2013US20130341728 Semiconductor Device
12/26/2013US20130341644 Method and design of an rf thru-via interconnect
12/26/2013US20130341620 Monitor Structures and Methods of Formation Thereof
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