| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/07/2003 | US6504241 Stackable semiconductor device and method for manufacturing the same |
| 01/07/2003 | US6504240 Semiconductor device having reliable coupling between wiring substrate and semiconductor pellet |
| 01/07/2003 | US6504239 Semiconductor device having dummy pattern that relieves stress |
| 01/07/2003 | US6504238 Leadframe with elevated small mount pads |
| 01/07/2003 | US6504237 Semiconductor with multilayer metal structure using copper that offer high speed performance |
| 01/07/2003 | US6504236 Semiconductor die assembly having leadframe decoupling characters and method |
| 01/07/2003 | US6504235 Passivation layer and process for semiconductor devices |
| 01/07/2003 | US6504234 Semiconductor device with interlayer film comprising a diffusion prevention layer to keep metal impurities from invading the underlying semiconductor substrate |
| 01/07/2003 | US6504227 Passive semiconductor device mounted as daughter chip on active semiconductor device |
| 01/07/2003 | US6504225 Teos seaming scribe line monitor |
| 01/07/2003 | US6504224 Methods and structures for metal interconnections in integrated circuits |
| 01/07/2003 | US6504223 Contact structure and production method thereof and probe contact assembly using same |
| 01/07/2003 | US6504217 Semiconductor device and a method of manufacturing the same |
| 01/07/2003 | US6504203 Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed |
| 01/07/2003 | US6504202 Interconnect-embedded metal-insulator-metal capacitor |
| 01/07/2003 | US6504190 FET whose source electrode overhangs gate electrode and its manufacture method |
| 01/07/2003 | US6504189 Semiconductor device having a microstrip line |
| 01/07/2003 | US6504188 Solid state image pickup device |
| 01/07/2003 | US6504187 Semiconductor integrated circuit and digital camera comprising the same |
| 01/07/2003 | US6504185 Compound semiconductor device and method for controlling characteristics of the same |
| 01/07/2003 | US6504123 Process for sorting integrated circuit devices |
| 01/07/2003 | US6504110 Insulating circuit board and power semiconductor apparatus employing the same |
| 01/07/2003 | US6504105 Solder ball connections and assembly process |
| 01/07/2003 | US6504104 Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array |
| 01/07/2003 | US6504097 Electronic device |
| 01/07/2003 | US6504096 Semiconductor device, methods of production of the same, and method of mounting a component |
| 01/07/2003 | US6503829 Metal via contact of a semiconductor device and method for fabricating the same |
| 01/07/2003 | US6503826 Semiconductor device and method for manufacturing the same |
| 01/07/2003 | US6503821 Integrated circuit chip carrier assembly |
| 01/07/2003 | US6503820 Die pad crack absorption system and method for integrated circuit chip fabrication |
| 01/07/2003 | US6503803 Method of fabricating a semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer |
| 01/07/2003 | US6503795 Method for fabricating a semiconductor device having a storage cell |
| 01/07/2003 | US6503787 Device and method for forming semiconductor interconnections in an integrated circuit substrate |
| 01/07/2003 | US6503781 Molded ball grid array |
| 01/07/2003 | US6503779 Method of manufacturing flip chip type semiconductor device |
| 01/07/2003 | US6503777 Deflectable interconnect |
| 01/07/2003 | US6503765 Testing vias and contacts in integrated circuit fabrication |
| 01/07/2003 | US6503645 Barium, zirconium, zinc, tantalum oxide ceramic and a glass component comprising silicon oxide and boron oxide and at least one of an alkaline earth metal oxide and zinc oxide |
| 01/07/2003 | US6503641 Interconnects with Ti-containing liners |
| 01/07/2003 | US6503626 Graphite-based heat sink |
| 01/07/2003 | US6503088 I-channel surface-mount connector with extended flanges |
| 01/06/2003 | CA2393069A1 Power converter enclosure |
| 01/05/2003 | CA2391223A1 Circuit board, method for manufacturing same, and high-output module |
| 01/05/2003 | CA2391218A1 Cicuit board, method for manufacturing same, and high-output module |
| 01/03/2003 | WO2003001612A1 Semiconductor device and its fabriction method |
| 01/03/2003 | WO2003001597A2 Vertically contacted stacked chips |
| 01/03/2003 | WO2003001596A1 Electronic device and method for manufacturing the same |
| 01/03/2003 | WO2003001595A2 Electronic device |
| 01/03/2003 | WO2003001594A2 High-voltage module and method for producing the same |
| 01/03/2003 | WO2003001591A1 Semiconductor integrated circuit, its designing method, and its designing system |
| 01/03/2003 | WO2003001590A2 System and method to form a composite film stack utilizing sequential deposition techniques |
| 01/03/2003 | WO2003001589A2 A method of selectively alloying interconnect regions by depostion process |
| 01/03/2003 | WO2003001588A2 Method for producing an electronic component, especially a memory chip |
| 01/03/2003 | WO2003001585A1 Extension of fatigue life for c4 solder ball in a chip to substrate connection |
| 01/03/2003 | WO2003001574A2 Double-sided semiconductor structures utilizing a compliant substrate |
| 01/03/2003 | WO2003001415A1 Topological global routing for automated ic package interconnect |
| 01/03/2003 | WO2003001133A2 Graphite-based thermal dissipation component |
| 01/03/2003 | WO2003000798A1 Thermosetting resin composition, process for producing the same, and suspension-form mixture |
| 01/03/2003 | WO2003000619A1 Ceramic component and production method therefor |
| 01/03/2003 | WO2003000618A1 A method of producing a metal-containing single-phase composition. |
| 01/03/2003 | WO2002089257A3 Connection housing for an electronic component |
| 01/03/2003 | WO2002082473A3 Thick film paste systems for circuits on diamonds substrates |
| 01/03/2003 | WO2002080640A3 Shunt power connection for an integrated circuit package |
| 01/03/2003 | WO2002054414A3 Fat conductor |
| 01/03/2003 | WO2002021593A3 Method of forming titanium nitride (tin) films using metal-organic chemical vapor deposition (mocvd) |
| 01/03/2003 | WO2002021576A3 Organic nanoelectric conductors |
| 01/03/2003 | WO2002013254A3 Electroplating multi-trace circuit board substrates using single tie bar |
| 01/03/2003 | WO2001097285A3 Electronic component consisting of a housing and a substrate |
| 01/02/2003 | US20030004218 Porous materials |
| 01/02/2003 | US20030004200 Crystalline form of 4-[5-methyl-3-phenylisoxazol-4-YL] benzenesulfonamide |
| 01/02/2003 | US20030004066 Combination of thermally conducting solid filler, dispersant and linear alkylbenzene carrier; applied to an electronic component to increase the cooling of the component |
| 01/02/2003 | US20030003862 Electronic component and mobile communication device using the electronic component |
| 01/02/2003 | US20030003789 Semiconductor device-socket |
| 01/02/2003 | US20030003779 Flexible compliant interconnect assembly |
| 01/02/2003 | US20030003771 Use of a silicon carbide adhesion promoter layer to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbon |
| 01/02/2003 | US20030003765 Split barrier layer including nitrogen-containing portion and oxygen-containing portion |
| 01/02/2003 | US20030003757 Method of etching tungsten or tungsten nitride in semiconductor structures |
| 01/02/2003 | US20030003747 Slurry of ceric ammonium nitrate ((NH4)2Ce(NO3)6) providing improved polishing speed under low pressure in one step; deposited as a barrier film for a capacitor using barium strontium titanate as a dielectric layer; semiconductors |
| 01/02/2003 | US20030003744 Semiconductor chip configuration and fabrication method |
| 01/02/2003 | US20030003741 Method of fabricating semiconductor device |
| 01/02/2003 | US20030003740 Contact structure production method |
| 01/02/2003 | US20030003733 Semiconductor integrated circuit device and fabrication process thereof |
| 01/02/2003 | US20030003732 Method of post treatment for a metal line of semiconductor device |
| 01/02/2003 | US20030003729 Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring |
| 01/02/2003 | US20030003728 Microstructure array, mold for forming a microstructure array, and method of fabricating the same |
| 01/02/2003 | US20030003727 Method of making a semiconductor device with alloy film between barrier metal and interconnect |
| 01/02/2003 | US20030003724 Manufacturing method of the semiconductor device |
| 01/02/2003 | US20030003723 Method for manufacturing semiconductor device |
| 01/02/2003 | US20030003721 Thin titanium nitride layers used in conjunction with tungsten |
| 01/02/2003 | US20030003713 Semiconductor device and method for manufacturing the same |
| 01/02/2003 | US20030003709 Barrier material encapsulation of programmable material |
| 01/02/2003 | US20030003708 Creation of subresolution features via flow characteristics |
| 01/02/2003 | US20030003705 Vertical electronic circuit package and method of fabrication therefor |
| 01/02/2003 | US20030003703 Process for forming fusible links |
| 01/02/2003 | US20030003698 Process for local on-chip cooling of semiconductor devices using buried microchannels |
| 01/02/2003 | US20030003689 Semiconductor device including edge bond pads assemblies including the same and related methods |
| 01/02/2003 | US20030003688 Method and apparatus for marking a bare semiconductor die |
| 01/02/2003 | US20030003677 Alignment method, exposure apparatus and device fabrication method |
| 01/02/2003 | US20030003676 Ultra-fine alignment system and method using acoustic-AFM interaction |
| 01/02/2003 | US20030003671 Method for manufacturing synchronous DRAM device |