| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/09/2003 | US20030006496 Semiconductor/printed circuit board assembly, and computer system |
| 01/09/2003 | US20030006495 Die stacking scheme |
| 01/09/2003 | US20030006494 Thin profile stackable semiconductor package and method for manufacturing |
| 01/09/2003 | US20030006493 Semiconductor device and manufacturing method thereof |
| 01/09/2003 | US20030006492 Semiconductor device and method of manufacturing the same |
| 01/09/2003 | US20030006491 Single package containing multiple integrated circuit devices |
| 01/09/2003 | US20030006490 Semiconductor integrated circuit device |
| 01/09/2003 | US20030006489 Flexible wiring substrate interposed between semiconductor element and circuit substrate |
| 01/09/2003 | US20030006488 Lead frame and manufacturing method of the same |
| 01/09/2003 | US20030006487 Semiconductor device having element isolation structure |
| 01/09/2003 | US20030006481 Semiconductor integrated circuit, D-A converter device, and A-D converter device |
| 01/09/2003 | US20030006479 Laser programming of integrated circuits |
| 01/09/2003 | US20030006477 Porous materials |
| 01/09/2003 | US20030006474 Apparatus and methods for fabricating inductor for integrated circuit or integrated circuit package |
| 01/09/2003 | US20030006471 Semiconductor device having silicon carbide layer of predetermined conductivity type and module device having the same |
| 01/09/2003 | US20030006466 Semiconductor integrated circuit |
| 01/09/2003 | US20030006441 Semiconductor integrated circuit device and process for manufacturing |
| 01/09/2003 | US20030006439 Hydrogen barrier encapsulation techniques for the control of hydrogen induced degradation of ferroelectric capacitors in conjunction with multilevel metal processing for non-volatile integrated circuit memory devices |
| 01/09/2003 | US20030006434 Inverter module |
| 01/09/2003 | US20030006423 Semiconductor light emitting device package |
| 01/09/2003 | US20030006412 Semiconductor device, semiconductor test structure and method for fabricating a semiconductor device |
| 01/09/2003 | US20030006271 Room temperature gold wire bonding |
| 01/09/2003 | US20030006267 Room temperature gold wire bonding |
| 01/09/2003 | US20030006221 Method and apparatus for cutting a multi-layer substrate by dual laser irradiation |
| 01/09/2003 | US20030006066 An electronic package having a substrate with electrically conductive filled through holes |
| 01/09/2003 | US20030006065 Monolithic ceramic electronic component, method for manufacturing the same, and electronic device |
| 01/09/2003 | US20030006063 Wiring substrate |
| 01/09/2003 | US20030006062 Interconnect system and method of fabrication |
| 01/09/2003 | US20030006055 Semiconductor package for fixed surface mounting |
| 01/09/2003 | US20030005881 Method for forming contact plug of semiconductor device |
| 01/09/2003 | US20030005706 Compact, high-efficiency thermoelectric systems |
| 01/09/2003 | US20030005584 Assembly including heat pipe and heat conductive member fixed to each other by plastic deformation of the latter, and method of manufacturing the assembly |
| 01/09/2003 | US20030005582 Circuit board, method for manufacturing same, and high-output module |
| 01/09/2003 | US20030005572 Integrated inductor |
| 01/09/2003 | US20030005569 Ultra-miniature magnetic device |
| 01/09/2003 | DE10141988C1 Modular heat sink manufacturing method uses transverse pressure for clamping projection of one extruded profile in channel of adjacent extruded profile by plastic deformation of Al wire |
| 01/09/2003 | CA2451636A1 Low temperature method and compositions for producing electrical conductors |
| 01/09/2003 | CA2447364A1 Topside active optical device apparatus and method |
| 01/08/2003 | EP1274292A1 Casing for a power converter |
| 01/08/2003 | EP1274149A2 Radio frequency circuit manufacturing method and radio frequency circuit |
| 01/08/2003 | EP1274128A1 Semiconductor device with hyper-frequency structure |
| 01/08/2003 | EP1274127A2 Semiconductor integrated circuit device, mounting board, and device and board assembly |
| 01/08/2003 | EP1274126A2 Circuit board, method for manufacturing same, and high-output module |
| 01/08/2003 | EP1274125A2 Circuit board, method for manufacturing same, and high-output module |
| 01/08/2003 | EP1273998A1 Tamper-evident and/or tamper-resistant electronic components |
| 01/08/2003 | EP1273630A1 Resin composition, adhesive film for semiconductor device, and laminated film with metallic foil and semiconductor device using the same |
| 01/08/2003 | EP1273609A1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them |
| 01/08/2003 | EP1273608A1 Flame-retardant epoxy resin composition, molded object thereof, and electronic part |
| 01/08/2003 | EP1273212A1 Double-sided wiring board and its manufacture method |
| 01/08/2003 | EP1273058A2 Thin-film battery having ultra-thin electrolyte and associated method |
| 01/08/2003 | EP1273054A2 Battery-operated wireless-communication apparatus and method |
| 01/08/2003 | EP1273045A1 Diode and method for producing the same |
| 01/08/2003 | EP1273041A2 Combined transistor-capacitor structure in deep sub-micron cmos for power amplifiers |
| 01/08/2003 | EP1273040A2 Contactless interconnection system |
| 01/08/2003 | EP1273039A1 Vertical structure and process for semiconductor wafer-level chip scale packages |
| 01/08/2003 | EP1273037A2 High rigidity, multi-layered, semiconductor package and method of making the same |
| 01/08/2003 | EP1273032A1 Method of forming vias in silicon carbide and resulting devices and circuits |
| 01/08/2003 | EP1273017A2 Distributed capacitor |
| 01/08/2003 | EP1272422A2 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components |
| 01/08/2003 | CN2530350Y Radiating modulus of CPU |
| 01/08/2003 | CN2530293Y Combined radiating fan |
| 01/08/2003 | CN1390246A Flame-retardant epoxy resin composition and liminate made with same |
| 01/08/2003 | CN1390238A Highly stable packaging substrates and brominated indane derivatives |
| 01/08/2003 | CN1390088A Power assembly and method for manufacturing the same |
| 01/08/2003 | CN1390075A Electronic component and mobile communicating device using the same |
| 01/08/2003 | CN1389919A Cross-point diode storage array addressing mfg. technology |
| 01/08/2003 | CN1389915A Semiconductor device |
| 01/08/2003 | CN1389913A Parallel semi-conductor piling-up device |
| 01/08/2003 | CN1389912A Chip package structre and its substrate board |
| 01/08/2003 | CN1389908A Surface fitting device package lead connecting method |
| 01/08/2003 | CN1389907A Coating treatment method and method for manufacturing semiconductor device using the same |
| 01/08/2003 | CN1389591A Low-permittivity material and processing method via CVD |
| 01/08/2003 | CN1389325A Method for fixing electronic element using lead-less tin-zinc soldering material without redacing connection strength |
| 01/08/2003 | CN1098620C Contact arrangement for detachably attaching an electric component, especially integrated circuit to printed circuit board |
| 01/08/2003 | CN1098537C Label for semiconductor wafer |
| 01/08/2003 | CN1098533C Contacting structure in semiconductor integrated circuit and mfg. method thereof |
| 01/07/2003 | US6505329 Semiconductor device designing method and apparatus, and memory medium that is stored with macro information |
| 01/07/2003 | US6504769 Semiconductor memory device employing row repair scheme |
| 01/07/2003 | US6504723 Electronic assembly having solder thermal interface between a die substrate and a heat spreader |
| 01/07/2003 | US6504720 Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module |
| 01/07/2003 | US6504712 Heat sinks for CPUs for use in personal computers |
| 01/07/2003 | US6504697 Arrangement and method for measuring a temperature |
| 01/07/2003 | US6504444 High frequency integrated circuit including an isolator and dielectric filter |
| 01/07/2003 | US6504433 CMOS transceiver having an integrated power amplifier |
| 01/07/2003 | US6504431 CMOS transceiver having an integrated power amplifier |
| 01/07/2003 | US6504420 Temperature compensation for internal inductor resistance |
| 01/07/2003 | US6504394 Configuration for trimming reference voltages in semiconductor chips, in particular semiconductor memories |
| 01/07/2003 | US6504256 Insitu radiation protection of integrated circuits |
| 01/07/2003 | US6504254 Semiconductor device with dummy wiring layers |
| 01/07/2003 | US6504253 Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material composite structure using electric connection structure |
| 01/07/2003 | US6504252 Semiconductor device with a split pad electrode |
| 01/07/2003 | US6504250 Integrated circuit device with reduced cross talk |
| 01/07/2003 | US6504249 Integrated circuit device with reduced cross talk |
| 01/07/2003 | US6504248 Surface treatment of organic insulating film and the removal of oxidized surface layer on lower electrode are done at same time by irradiation with inert gas ion; increased adhesion strength and reliable electroconductivity |
| 01/07/2003 | US6504247 Integrated having a self-aligned Cu diffusion barrier |
| 01/07/2003 | US6504246 Integrated circuit having a balanced twist for differential signal lines |
| 01/07/2003 | US6504245 Semiconductor device |
| 01/07/2003 | US6504244 Semiconductor device and semiconductor module using the same |
| 01/07/2003 | US6504243 Removable heat transfer apparatus for a pin grid array (PGA) device, and associated installation and removal methods |
| 01/07/2003 | US6504242 Electronic assembly having a wetting layer on a thermally conductive heat spreader |