| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/14/2003 | US6507044 Position-selective and material-selective silicon etching to form measurement structures for semiconductor fabrication |
| 01/14/2003 | US6506981 Interconnect structure having fuse or anti-fuse links between profiled apertures |
| 01/14/2003 | US6506980 Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device |
| 01/14/2003 | US6506869 Anhydride-terminated polyimide from a dianhydride and a diaminopolysiloxane as curing agent |
| 01/14/2003 | US6506828 Resin composition, molded article therefrom, and utilization thereof |
| 01/14/2003 | US6506822 For encapsulation of semiconductor devices by potting, chip-on-bonding or screen printing |
| 01/14/2003 | US6506681 Thin flip—chip method |
| 01/14/2003 | US6506672 Re-metallized aluminum bond pad, and method for making the same |
| 01/14/2003 | US6506671 Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad |
| 01/14/2003 | US6506664 Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device |
| 01/14/2003 | US6506633 Method of fabricating a multi-chip module package |
| 01/14/2003 | US6506632 Method of forming IC package having downward-facing chip cavity |
| 01/14/2003 | US6506631 Method for manufacturing integrated circuits and semiconductor wafer which has integrated circuits |
| 01/14/2003 | US6506630 Method of manufacturing a semiconductor device and a support plate with a flange for a semiconductor device |
| 01/14/2003 | US6506629 Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages |
| 01/14/2003 | US6506628 Method of attaching a leadframe to singulated semiconductor dice |
| 01/14/2003 | US6506627 Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device |
| 01/14/2003 | US6506626 Semiconductor package structure with heat-dissipation stiffener and method of fabricating the same |
| 01/14/2003 | US6506625 Semiconductor package having stacked dice and leadframes and method of fabrication |
| 01/14/2003 | US6506624 Method of manufacturing an optical semiconductor module |
| 01/14/2003 | US6506623 Microstructure array, mold for forming a microstructure array, and method of fabricating the same |
| 01/14/2003 | US6506448 Method of protective coating BGA solder alloy spheres |
| 01/14/2003 | US6506321 Quenching melt composed of silicon and high concentration of at least one other element such as aluminum, phosphorous or boron yielding low electrical resistivity structure |
| 01/14/2003 | US6506073 Mounting bracket for integrated circuit device |
| 01/14/2003 | US6505680 High performance cooling device |
| 01/14/2003 | US6505400 Method of making chip scale package with heat spreader |
| 01/13/2003 | CA2352997A1 Computer cooling apparatus |
| 01/09/2003 | WO2003003797A2 Structure and method for fabrication of a leadless multi-die carrier |
| 01/09/2003 | WO2003003501A1 Electronic circuit member and linking structure for electronic circuit member and coupling structure for transmission line |
| 01/09/2003 | WO2003003465A1 Integrated arrays of modulators and lasers on electronics |
| 01/09/2003 | WO2003003458A2 Power pads for application of high current per bond pad in silicon technology |
| 01/09/2003 | WO2003003457A2 Design of lithography alignment and overlay measurement marks on damascene surface |
| 01/09/2003 | WO2003003456A2 Electronic assembly with vertically connected capacitors and manufacturing method |
| 01/09/2003 | WO2003003455A2 Using the wave soldering process to attach motherboard chipset heat sinks |
| 01/09/2003 | WO2003003454A1 Integral heatsink plastic ball grid array |
| 01/09/2003 | WO2003003453A2 Assembling a diode and two electrodes |
| 01/09/2003 | WO2003003450A1 Semiconductor device and production method therefor |
| 01/09/2003 | WO2003003443A1 Process for forming fusible links |
| 01/09/2003 | WO2003003423A1 Topside active optical device apparatus and method |
| 01/09/2003 | WO2003003381A1 Low temperature method and compositions for producing electrical conductors |
| 01/09/2003 | WO2003003208A1 Device for and method of storing identification data in an integrated circuit |
| 01/09/2003 | WO2003003122A2 Method of measuring critical dimension and overlay in single step |
| 01/09/2003 | WO2003002918A2 Cooler for electronic devices |
| 01/09/2003 | WO2003002675A1 Selective deposition of circuit-protective polymers |
| 01/09/2003 | WO2003002661A1 Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials |
| 01/09/2003 | WO2002089184A3 Method for manufacturing a semiconductor device and support plate therefor |
| 01/09/2003 | WO2002073661A9 Extraction method of defect density and size distributions |
| 01/09/2003 | WO2002069373A3 Gallium nitride material based semiconductor devices including thermally conductive regions |
| 01/09/2003 | WO2002047164A3 Integrated circuit with reduced substrate coupling |
| 01/09/2003 | WO2002041391A3 Amorphized barrier layer for integrated circuit interconnects |
| 01/09/2003 | WO2002027791A3 Polymer stud grid array and method for production thereof |
| 01/09/2003 | WO2002025709A3 Integrated thin film capacitor/inductor/interconnect system and method |
| 01/09/2003 | US20030009738 Topological global routing for automated ic package interconnect |
| 01/09/2003 | US20030009684 Tamper-evident and/or tamper-resistant electronic components |
| 01/09/2003 | US20030009001 Polyphenol resin, process for its production, epoxy resin composition and its use |
| 01/09/2003 | US20030008998 Interlayer dielectric film |
| 01/09/2003 | US20030008535 Electrical contact and electrical connection device using same |
| 01/09/2003 | US20030008525 Ionic additives for extreme low dielectric constant chemical formulations |
| 01/09/2003 | US20030008510 Thin flip-chip method |
| 01/09/2003 | US20030008509 Method and apparatus for fabricating semiconductor devices |
| 01/09/2003 | US20030008501 Tantalum nitride CVD deposition by tantalum oxide densification |
| 01/09/2003 | US20030008498 Semiconductor device and method of fabricating the same |
| 01/09/2003 | US20030008492 Method for fabricating semiconductor device and forming interlayer dielectric film using high-density plasma |
| 01/09/2003 | US20030008476 Method of fabricating a wafer level package |
| 01/09/2003 | US20030008472 Semiconductor device and fabrication process thereof |
| 01/09/2003 | US20030008450 Self-aligned process for a stacked gate RF MOSFET device |
| 01/09/2003 | US20030008449 Method for sorting integrated circuit devices |
| 01/09/2003 | US20030008433 Lead frame decoupling capacitor, semiconductor device packages including the same and methods |
| 01/09/2003 | US20030008432 Method and device for securing a multi-dimensionally constructed chip stack and chip configuration |
| 01/09/2003 | US20030008421 Process for making wafers for ion implantation monitoring |
| 01/09/2003 | US20030008243 Ultra-large-scale-integration (ULSI) metallization; forming openings through first and second insulating layers, a tungsten nitride layer in contact with the openings, and providing a copper layer |
| 01/09/2003 | US20030008182 Comprises shrink-suppressing layers on main surface of presintered ceramic; efficiency; electronic |
| 01/09/2003 | US20030008156 Selective deposition of circuit-protective polymers |
| 01/09/2003 | US20030008075 ULSI wiring and method of manufacturing the same |
| 01/09/2003 | US20030008069 Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers |
| 01/09/2003 | US20030007867 CPU cooling structure with a ventilation hood |
| 01/09/2003 | US20030007340 Electrical device allowing for increased device densities |
| 01/09/2003 | US20030007334 Circuit housing |
| 01/09/2003 | US20030007329 Thermal interface structure for placement between a microelectronic component package and heat sink |
| 01/09/2003 | US20030007328 Cooling device for electronic components |
| 01/09/2003 | US20030007327 Cooling unit including fan and plurality of air paths and electronic apparatus including the cooling unit |
| 01/09/2003 | US20030007326 Clamshell heatsink |
| 01/09/2003 | US20030007324 Computer with thermal cooling and a thermal cooling system and method |
| 01/09/2003 | US20030007301 Low-voltage-triggered SOI-SCR device and associated ESD protection circuit |
| 01/09/2003 | US20030006857 High performance dense wire for printed circuit board |
| 01/09/2003 | US20030006856 Integrated circuit interconnect system |
| 01/09/2003 | US20030006795 Semiconductor device, method of measuring the same, and method of manufacturing the same |
| 01/09/2003 | US20030006517 Methods for the production of patterned and unpatterned metal-carbon features |
| 01/09/2003 | US20030006510 Semiconductor device, manufacturing method for semiconductor device and mounting method for the same |
| 01/09/2003 | US20030006509 Semiconductor device |
| 01/09/2003 | US20030006507 Semiconductor device and method of manufacturing the same |
| 01/09/2003 | US20030006506 Semiconductor structure having buried track conductors, and method for generating an electrical contact with buried track conductors |
| 01/09/2003 | US20030006505 Bonding pad structure and method for making same |
| 01/09/2003 | US20030006504 Contact structure, method of forming the same, semiconductor device, and method of manufacturing the same |
| 01/09/2003 | US20030006503 Device having resin package and method of producing the same |
| 01/09/2003 | US20030006502 Hermetically sealed microstructure package |
| 01/09/2003 | US20030006501 Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame |
| 01/09/2003 | US20030006500 Circuit board, method for manufacturing same, and high-output module |
| 01/09/2003 | US20030006499 Semiconductor chip package and method of fabricating same |
| 01/09/2003 | US20030006498 Semiconductor integrated circuit device, mounting board, and device and board assembly |