| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/16/2003 | US20030010990 Active matrix panel |
| 01/16/2003 | US20030010961 For the formation of an insulating film comprising a low dielectric constant polymeric material and a sublimating material(a silcone compound) which are dissolved in a solvent |
| 01/16/2003 | US20030010759 Method of attaching a component to a connection support by welding without the addition of material |
| 01/16/2003 | US20030010645 Barrier enhancement process for copper interconnects |
| 01/16/2003 | US20030010632 Method for manufacturing a semiconductor device and a plating apparatus and a sputtering apparatus therefor |
| 01/16/2003 | US20030010518 Device for accommodating electronic components |
| 01/16/2003 | US20030010485 Flattened tube cold plate for liquid cooling electrical components |
| 01/16/2003 | US20030010425 Method for integrating image sensors with optical components |
| 01/16/2003 | US20030010050 Computer cooling apparatus |
| 01/16/2003 | US20030009880 Electronic packaging device with insertable leads and method of manufacturing |
| 01/16/2003 | US20030009878 Method for attaching an electronic component to a substrate |
| 01/16/2003 | US20030009864 Method for fabricating surface acoustic wave filter package |
| 01/16/2003 | DE10145468C1 Process for fixing a semiconductor device on a switching device, used in flip-chip technology, comprises preparing a semiconductor device with bond pads on one surface |
| 01/16/2003 | DE10125374C1 Gehäuse für einen elektromagnetische Strahlung emittierenden Halbleiterchip und Verfahren zu dessen Herstellung Housing for emitting electromagnetic radiation of a semiconductor chip and method of producing the |
| 01/16/2003 | CA2447728A1 Nanoscale wires and related devices |
| 01/15/2003 | EP1276362A2 Flattened tube cold plate for liquid cooling electrical components |
| 01/15/2003 | EP1276153A1 Circuit board and production method therefor |
| 01/15/2003 | EP1276152A2 Passive devices and modules for transceiver and manufacturing method thereof |
| 01/15/2003 | EP1276151A2 Semiconductor device protected against analysis and method of fabricating the same |
| 01/15/2003 | EP1276150A2 Resin-encapsulated electronic device |
| 01/15/2003 | EP1276149A2 Encapsulated electronic component including a power electronic device and method of making the same |
| 01/15/2003 | EP1276139A2 Capacitor and method of manufacturing the same |
| 01/15/2003 | EP1275463A2 Pb-free solder-connected electronic device |
| 01/15/2003 | EP1275278A1 Cooling device for cooling components of the power electronics, said device comprising a micro heat exchanger |
| 01/15/2003 | EP1275168A2 Method and apparatus for integrated-battery devices |
| 01/15/2003 | EP1275152A2 Bonding pad in semiconductor device |
| 01/15/2003 | EP1275151A2 Bonding pad in semiconductor device |
| 01/15/2003 | EP1275150A2 Shaped springs and methods of fabricating and using shaped springs |
| 01/15/2003 | EP1275148A1 Resin sealed semiconductor device with stress-reducing layer |
| 01/15/2003 | EP1275145A2 Electromigration early failure distribution in submicron interconnects |
| 01/15/2003 | EP1274964A1 Notched finned heat sink structure |
| 01/15/2003 | EP1274561A1 Thermally conductive sheet |
| 01/15/2003 | EP1274529A1 Device for monitoring and calibrating oxide charge measurement equipment and method therefor |
| 01/15/2003 | EP0940065B1 Electrical apparatus |
| 01/15/2003 | EP0917597B1 Method for producing conductor track structures, especially fine conductor track structures, arranged on a nonconductive support material |
| 01/15/2003 | CN2531602Y Cooling plate and photoelectric heating assembly combined structure |
| 01/15/2003 | CN2531525Y Direct radiating BGA baseboard |
| 01/15/2003 | CN1391703A Semiconductor chip having bond pad located on active device |
| 01/15/2003 | CN1391590A Polyarylene compositions with enhanced modulus profiles |
| 01/15/2003 | CN1391428A Printing circuit boards and their manufacture |
| 01/15/2003 | CN1391427A Flexible substrate, semiconductor device, camera device and X-ray camera system |
| 01/15/2003 | CN1391342A Radiator with built-in integrated circuit module |
| 01/15/2003 | CN1391280A Electronic device and manufacture thereof |
| 01/15/2003 | CN1391278A Semiconductor device and manufacture thereof |
| 01/15/2003 | CN1391277A Internal connecting line structure with dual-layer electric partition and its preparing process |
| 01/15/2003 | CN1391276A Internal Connecting line structure with dielectric partition and its preparing process |
| 01/15/2003 | CN1391275A Internal connecting line structure with metallic partitions and its preparing process |
| 01/15/2003 | CN1391274A Chip package structure and its preparing process |
| 01/15/2003 | CN1391273A Semiconductor package with heat radiator |
| 01/15/2003 | CN1391272A Multi-layer substrate of IC and arrangement method of holes on dielectric layers |
| 01/15/2003 | CN1391260A Manufacturing method for semiconductor device |
| 01/15/2003 | CN1391235A Porous material |
| 01/15/2003 | CN1390985A Composition and method for tinplating |
| 01/15/2003 | CN1099135C Device for semiconductor |
| 01/15/2003 | CN1099131C 栅阵列球半导体封装 Ball grid array semiconductor package |
| 01/15/2003 | CN1099129C Semiconductor device and method for mfg. same |
| 01/15/2003 | CN1099121C Multi-layer ceramic components and manufacturing thereof |
| 01/14/2003 | US6507942 Methods and circuits for testing a circuit fabrication process for device uniformity |
| 01/14/2003 | US6507499 Microprocessor EMI shield |
| 01/14/2003 | US6507497 Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer |
| 01/14/2003 | US6507492 Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump |
| 01/14/2003 | US6507491 Pull/latch type fixing device for heat-radiating fin body |
| 01/14/2003 | US6507489 Toggle heat sink clip |
| 01/14/2003 | US6507482 Chip type solid electrolytic capacitor |
| 01/14/2003 | US6507264 Integral fuse for use in semiconductor packages |
| 01/14/2003 | US6507139 Apparatus having an electronic component located on a surface of a package member with a space therebetween |
| 01/14/2003 | US6507124 Semiconductor memory device |
| 01/14/2003 | US6507122 Integrated circuit packaging comprising encapsulation of substrates using adhesive layers having uniformity at the solder joint interfaces; stress relieving |
| 01/14/2003 | US6507121 Array structure of solder balls able to control collapse |
| 01/14/2003 | US6507120 Flip chip type quad flat non-leaded package |
| 01/14/2003 | US6507119 Embedding semiconductor chips into appertures on substrates and bonding them using solders, allowing efficient heat exchange, electroconductivity, miniaturization and heat resistance, and prevents short circuiting |
| 01/14/2003 | US6507118 Multi-metal layer circuit |
| 01/14/2003 | US6507117 Semiconductor chip and multichip-type semiconductor device |
| 01/14/2003 | US6507116 Electronic package and method of forming |
| 01/14/2003 | US6507115 Multi-chip integrated circuit module |
| 01/14/2003 | US6507114 BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die |
| 01/14/2003 | US6507113 Electronic interface structures and methods of fabrication |
| 01/14/2003 | US6507112 Electrical and electronic apparatus having adhesion interfaces comprising gold, aluminum and/or alloy foundations, barrier layers and titanium and titanium coverings connected to frames of printed circuit supports; bonding strength |
| 01/14/2003 | US6507111 High-frequency circuit and its module for communication devices |
| 01/14/2003 | US6507110 Microwave device and method for making same |
| 01/14/2003 | US6507107 Semiconductor/printed circuit board assembly |
| 01/14/2003 | US6507106 Semiconductor module with a number of semiconductor chips and a conductive connection between the semiconductor chips by flexible tapes |
| 01/14/2003 | US6507105 Member for semiconductor device and method for producing the same |
| 01/14/2003 | US6507104 Semiconductor package with embedded heat-dissipating device |
| 01/14/2003 | US6507103 Semiconductor device |
| 01/14/2003 | US6507102 Printed circuit board with integral heat sink for semiconductor package |
| 01/14/2003 | US6507101 Lossy RF shield for integrated circuits |
| 01/14/2003 | US6507100 Cu-balanced substrate |
| 01/14/2003 | US6507099 Multi-chip integrated circuit carrier |
| 01/14/2003 | US6507097 Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the same |
| 01/14/2003 | US6507096 Tape having implantable conductive lands for semiconductor packaging process and method for manufacturing the same |
| 01/14/2003 | US6507095 Wiring board, connected board and semiconductor device, method of manufacture thereof, circuit board, and electronic instrument |
| 01/14/2003 | US6507094 Die paddle clamping for wire bond enhancement |
| 01/14/2003 | US6507093 Lead frame for fabricating surface mount type semiconductor devices with high reliability |
| 01/14/2003 | US6507092 Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the same |
| 01/14/2003 | US6507087 Silicide agglomeration poly fuse device |
| 01/14/2003 | US6507086 Fuse area structure having guard ring surrounding fuse opening in semiconductor device and method of forming the same |
| 01/14/2003 | US6507082 Flip-chip assembly of protected micromechanical devices |
| 01/14/2003 | US6507054 Solid-state imaging device |
| 01/14/2003 | US6507049 Encapsulants for solid state devices |