| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/16/2003 | WO2003005443A2 Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure |
| 01/16/2003 | WO2003005441A1 Coating material of semiconductor chip, coating method of semiconductor chip and semiconductor device |
| 01/16/2003 | WO2003005438A2 Improved metal barrier behavior by sic:h deposition on porous materials |
| 01/16/2003 | WO2003005437A2 Interconnect system and method of fabrication |
| 01/16/2003 | WO2003005436A1 Coating material of semiconductor chip for controlling magnetic disc drive and method of coating semiconductor chip for controlling magnetic disc drive |
| 01/16/2003 | WO2003005430A2 Method and apparatus for controlling a plating process |
| 01/16/2003 | WO2003005426A1 Semiconductor structure with temperature control device |
| 01/16/2003 | WO2003005415A2 Super gto-based power blocks |
| 01/16/2003 | WO2003005410A2 Semiconductor device, semiconductor test structure and method for producing a semiconductor device |
| 01/16/2003 | WO2003005385A1 Capacitor having improved electrodes |
| 01/16/2003 | WO2003005381A1 Conductive structure with improved alternating current characteristics |
| 01/16/2003 | WO2003004580A1 Thermoconductive composition |
| 01/16/2003 | WO2002061826A3 Area efficient stacking of antifuses in semiconductor device |
| 01/16/2003 | WO2002058137A3 Composite microelectronic spring structure and method for making same |
| 01/16/2003 | WO2002056348A3 Method for incorporating silicon into cvd metal films |
| 01/16/2003 | US20030014727 Integrated circuit with layout matched high speed lines |
| 01/16/2003 | US20030013606 Method for the production of electrocatalyst powders |
| 01/16/2003 | US20030013408 Wireless local loop antenna |
| 01/16/2003 | US20030013328 Connection assembly for integrated circuit sensors |
| 01/16/2003 | US20030013303 Full image exposure of field with alignment marks |
| 01/16/2003 | US20030013299 Method for forming a metal plug of a semiconductor device |
| 01/16/2003 | US20030013298 Coupling capacitance reduction |
| 01/16/2003 | US20030013296 Locally increasing sidewall density by ion implantation |
| 01/16/2003 | US20030013294 Method of opening repair fuse of semiconductor device |
| 01/16/2003 | US20030013292 Etch stop in damascene interconnect structure and method of making |
| 01/16/2003 | US20030013291 Passivation and planarization process for flip chip packages |
| 01/16/2003 | US20030013290 Semiconductor device and method of formation |
| 01/16/2003 | US20030013289 Method for forming a fuse in a semiconductor device |
| 01/16/2003 | US20030013288 Gold wire for use in semiconductor packaging and high-frequency signal transmission and its fabrication method |
| 01/16/2003 | US20030013276 Compound semiconductor device |
| 01/16/2003 | US20030013264 Integrated vertical spiral inductor on semiconductor material |
| 01/16/2003 | US20030013235 for covering conductive parts without covering semiconductor device; superimposing; dielectrics; stereolithography |
| 01/16/2003 | US20030013234 Use of diverse materials in air-cavity packaging of electronic devices |
| 01/16/2003 | US20030013232 Method for fabricating a microelectronic device using wafer-level adhesion layer deposition |
| 01/16/2003 | US20030013229 Semiconductor device and method of manufacturing the same, apparatus for manufacturing semiconductor device, circuit board, and electronic instrument |
| 01/16/2003 | US20030013221 Active matrix substrate plate and manufacturing method therefor |
| 01/16/2003 | US20030013214 Pulse voltage breakdown (VBD) technique for inline gate oxide reliability monitoring |
| 01/16/2003 | US20030013045 Integrated circuits, printed circuits; multilayer overcoatings of chromium, copper and polymer; removal zones |
| 01/16/2003 | US20030013025 Plurality of mask revision state output circuits and an EXOR circuit. |
| 01/16/2003 | US20030012953 Non-stoichiometric non- equilibrium material, and the material is a nanostructured material;e.g., boron nitrides, tin oxides, titanium carbides and nickel ferrites |
| 01/16/2003 | US20030012952 Nanotechnology for electrochemical and energy devices |
| 01/16/2003 | US20030012884 Encapsulation for an electrical component and method for producing the same |
| 01/16/2003 | US20030012882 Adhesive polyimide resin and adhesive laminate |
| 01/16/2003 | US20030012881 Process for reducing the resistivity of an electrically conductive layer |
| 01/16/2003 | US20030012869 Pattern forming method and method for manufacturing liquid crystal display device using the same |
| 01/16/2003 | US20030012525 Light-emitting module |
| 01/16/2003 | US20030012071 Methods of rerouting dies using antifuses |
| 01/16/2003 | US20030012006 Pocket mounted chip having microstrip line |
| 01/16/2003 | US20030012005 Electronic circuit device |
| 01/16/2003 | US20030012001 Module unit for memory modules and method for its production |
| 01/16/2003 | US20030011999 Wiring substrate, method of producing the same, and electronic device using the same |
| 01/16/2003 | US20030011998 Chip scale packaging on CTE matched printed wiring boards |
| 01/16/2003 | US20030011997 Electronic assembly with solderable heat sink and methods of manufacture |
| 01/16/2003 | US20030011996 Heat dissipation module and its fixed member |
| 01/16/2003 | US20030011995 Anchor base for heat sink of IC chipset |
| 01/16/2003 | US20030011994 System for securing a processor socket |
| 01/16/2003 | US20030011991 Clip for heat sink |
| 01/16/2003 | US20030011987 Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof |
| 01/16/2003 | US20030011986 Electronic apparatus having a detachable circuit component and method of assembling the electronic apparatus |
| 01/16/2003 | US20030011949 Dual-triggered electrostatic discharge protection circuit |
| 01/16/2003 | US20030011738 Active matrix substrated and method of manufacturing the same |
| 01/16/2003 | US20030011282 Piezoelectric acoustic components and methods of manufacturing the same |
| 01/16/2003 | US20030011079 Semiconductor device and method of fabricating the same |
| 01/16/2003 | US20030011078 Semiconductor module and producing method therefor |
| 01/16/2003 | US20030011077 Sealing resin for flip-flop mounting |
| 01/16/2003 | US20030011076 Semiconductor device with a self-aligned contact and a method of manufacturing the same |
| 01/16/2003 | US20030011075 Semiconductor package and production method thereof |
| 01/16/2003 | US20030011074 Printed circuit board having an improved land structure |
| 01/16/2003 | US20030011073 Semiconductor device and the manufacturing method thereof |
| 01/16/2003 | US20030011072 Semiconductor device and the manufacturing method thereof |
| 01/16/2003 | US20030011071 Semiconductor device |
| 01/16/2003 | US20030011070 Semiconductor package, method of manufacturing the same, and semiconductor device |
| 01/16/2003 | US20030011069 Semiconductor device |
| 01/16/2003 | US20030011068 Semiconductor chip having bond pads and multi-chip package |
| 01/16/2003 | US20030011067 Stacked chip-size package type semiconductor device capable of being decreased in size |
| 01/16/2003 | US20030011066 Comprises phosphorous pentoxide, calcium oxide, magnesium oxide, zinc oxide, and minimal quantities of alkali compounds; for delivery of silver ions to aqueous medium |
| 01/16/2003 | US20030011065 Semiconductor device and method of manufacturing the same |
| 01/16/2003 | US20030011064 Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package |
| 01/16/2003 | US20030011063 Surface mount type semiconductor package and manufacturing method therefor |
| 01/16/2003 | US20030011062 Package board for multiple-pin ball grid array package, multiple-pin ball grid array package, and semiconductor device |
| 01/16/2003 | US20030011061 Monolithic IC package |
| 01/16/2003 | US20030011060 Semiconductor die adapter and method of using |
| 01/16/2003 | US20030011059 Semiconductor chip package having a leadframe with a footprint of about the same size as the chip |
| 01/16/2003 | US20030011058 Semiconductor device, semiconductor module and hard disk |
| 01/16/2003 | US20030011057 Semiconductor device |
| 01/16/2003 | US20030011056 Semiconductor device, image scanning unit and image forming apparatus |
| 01/16/2003 | US20030011055 Semiconductor device, image scanning unit and image forming apparatus |
| 01/16/2003 | US20030011054 Power module package having improved heat dissipating capability |
| 01/16/2003 | US20030011053 Semiconductor device |
| 01/16/2003 | US20030011052 Ultra-thin semiconductor package device using a support tape |
| 01/16/2003 | US20030011051 High current capacity semiconductor device package and lead frame with large area connection posts and modified outline |
| 01/16/2003 | US20030011050 Semiconductor die assembly having leadframe decoupling characters |
| 01/16/2003 | US20030011049 Interconnect circuitry, multichip module, and methods of manufacturing thereof |
| 01/16/2003 | US20030011048 Semiconductor circuit assembly having a plated leadframe including gold selectively covering areas to be soldered |
| 01/16/2003 | US20030011045 Compact layout for a semiconductor device |
| 01/16/2003 | US20030011042 Semiconductor device and manufacturing method of the same |
| 01/16/2003 | US20030011039 Semiconductor component with a charge compensation structure and associated fabrication methods |
| 01/16/2003 | US20030011031 Voltage limiting protection for high frequency power device |
| 01/16/2003 | US20030011006 Leaded semiconductor packages and method of trimming such packages |
| 01/16/2003 | US20030011005 Unmolded package for a semiconductor device |