| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/22/2003 | EP1277712A2 Zero thermal expansion material and practical component parts making use of the same |
| 01/22/2003 | EP1277278A1 Isolating energy conditioning shield assembly |
| 01/22/2003 | EP1277234A2 Circuit |
| 01/22/2003 | EP1277036A2 Technique for determining curvatures of embedded line features on substrates |
| 01/22/2003 | EP1276799A2 Flame retardant epoxy molding compositions |
| 01/22/2003 | CN2532661Y Spring medium unit for fixing packaged device on printed circuit board |
| 01/22/2003 | CN2532657Y Power transistor heat sink structure for electronic ballast |
| 01/22/2003 | CN2532582Y Improved semiconductor diode wire holder |
| 01/22/2003 | CN2532581Y Continuous type heat sink for heat-producing electronic component |
| 01/22/2003 | CN2532580Y Substrate for making electronic component |
| 01/22/2003 | CN2532523Y Computer heat sink |
| 01/22/2003 | CN1393036A Combined transistor-capactor structure in deep sub-micro CMOS for power amplifier |
| 01/22/2003 | CN1393035A Electronic equipment |
| 01/22/2003 | CN1393033A Semiconductor jointing substrate-use tape with adhesive and copper-clad laminate sheet using it |
| 01/22/2003 | CN1392769A Electronic device and its producing method |
| 01/22/2003 | CN1392756A Flexible conductive foil with electronic circuit |
| 01/22/2003 | CN1392611A Semiconductor device and its producing method |
| 01/22/2003 | CN1392610A Semiconductor device and its producing method |
| 01/22/2003 | CN1392609A Semiconductor packaging piece and its producing method |
| 01/22/2003 | CN1392607A Bottom buffering metal lug structure |
| 01/22/2003 | CN1392606A Mini heat absorption and dissipation method and device with alternately pushed two fluid drive part |
| 01/22/2003 | CN1392602A Method for producing circuit device |
| 01/22/2003 | CN1392601A Circuit device and its producing method |
| 01/22/2003 | CN1392600A Method for producing circuit device |
| 01/22/2003 | CN1392599A Method for producing circuit device |
| 01/22/2003 | CN1392598A Method for producing circuit device |
| 01/22/2003 | CN1392597A Method for producing compound semiconductor device |
| 01/22/2003 | CN1392219A High heat conductivity composite material and its preparing method |
| 01/22/2003 | CN1099754C Piezoelectric oscillator voltage-control oscillator, and manufacturing process thereof |
| 01/22/2003 | CN1099712C Semiconductor device having protection circuit |
| 01/22/2003 | CN1099711C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/22/2003 | CN1099710C 半导体器件 Semiconductor devices |
| 01/22/2003 | CN1099709C 半导体器件 Semiconductor devices |
| 01/22/2003 | CN1099708C Heat sink |
| 01/22/2003 | CN1099703C Leadframe for assembly of integrated circuit in injection moulded housing |
| 01/22/2003 | CN1099700C Method for forming semiconductor device wiring |
| 01/22/2003 | CN1099696C Metal layer patterns of semiconductor device and method for forming the same |
| 01/22/2003 | CN1099441C Epoxy resin compositions for encapsulating semiconductors, and semiconductor device |
| 01/21/2003 | US6510545 Automated shielding algorithm for dynamic circuits |
| 01/21/2003 | US6510059 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
| 01/21/2003 | US6510054 Heat sink clip assembly with handles |
| 01/21/2003 | US6510052 Cooling unit for cooling a heat generating component and electronic apparatus having the cooling unit |
| 01/21/2003 | US6509942 Liquid crystal display device, wiring substrate, and methods for fabricating the same |
| 01/21/2003 | US6509807 Energy conditioning circuit assembly |
| 01/21/2003 | US6509779 System for providing electrostatic discharge protection for high-speed integrated circuits |
| 01/21/2003 | US6509739 Method for locating defects and measuring resistance in a test structure |
| 01/21/2003 | US6509650 Electronic device, and method of patterning a first layer |
| 01/21/2003 | US6509649 Semiconductor device and fabricating method thereof |
| 01/21/2003 | US6509648 Multilayer semiconductor device |
| 01/21/2003 | US6509647 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 01/21/2003 | US6509646 Plurality of inside-connected capacitors are fixed on said contact layer, and a conductive glue is used to electrically connect the capacitors to the power plane and ground plane to reduce the electrical noise between the power plane and ground |
| 01/21/2003 | US6509645 Spherical semiconductor device and method for fabricating the same |
| 01/21/2003 | US6509644 Grid array package with reduced power and ground impedance under high frequency |
| 01/21/2003 | US6509643 Tab tape with stiffener and semiconductor device using same |
| 01/21/2003 | US6509642 Integrated circuit package |
| 01/21/2003 | US6509641 High-frequency signal amplification device |
| 01/21/2003 | US6509640 Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction |
| 01/21/2003 | US6509636 Semiconductor package |
| 01/21/2003 | US6509635 Integrated circuit package having offset die |
| 01/21/2003 | US6509633 IC package capable of accommodating discrete devices |
| 01/21/2003 | US6509632 Method of fabricating a redundant pinout configuration for signal enhancement in an IC package |
| 01/21/2003 | US6509631 Semiconductor device and liquid crystal module |
| 01/21/2003 | US6509630 Flexible interconnecting substrate, film, carrier, tape-shaped semiconductor device, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 01/21/2003 | US6509629 Power module |
| 01/21/2003 | US6509628 IC chip |
| 01/21/2003 | US6509624 Semiconductor fuses and antifuses in vertical DRAMS |
| 01/21/2003 | US6509623 Microelectronic air-gap structures and methods of forming the same |
| 01/21/2003 | US6509622 Structures that reduce or prevent damage to integrated circuits. |
| 01/21/2003 | US6509617 Semiconductor device and fabrication method thereof |
| 01/21/2003 | US6509593 Semiconductor device and method of manufacturing the same |
| 01/21/2003 | US6509591 Thin film transistor with photoconductive material |
| 01/21/2003 | US6509590 Aluminum-beryllium alloys for air bridges |
| 01/21/2003 | US6509584 Optical unit incorporating light-emitting or light-receiving element coated by resin protector |
| 01/21/2003 | US6509582 Semiconductor pad construction enabling pre-bump probing by planarizing the post-sort pad surface |
| 01/21/2003 | US6509531 Monolithic ceramic electronic component, method for manufacturing the same, and electronic device |
| 01/21/2003 | US6509529 Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch |
| 01/21/2003 | US6509386 Porous insulating composition comprising the steps of (A) providing at least one organic sacrificial material/dielectric material composition comprising at least one organic sacrificial material and at least one dielectric |
| 01/21/2003 | US6509282 Silicon-starved PECVD method for metal gate electrode dielectric spacer |
| 01/21/2003 | US6509275 Method of manufacturing thin film and pretreating method thereof |
| 01/21/2003 | US6509262 Method of reducing electromigration in copper lines by calcium-doping copper surfaces in a chemical solution |
| 01/21/2003 | US6509259 Lower layer comprises a non-silicon containing organic polymer and an upper layer comprises an organic, silicon containing polymer |
| 01/21/2003 | US6509258 Etch stop in damascene interconnect structure and method of making |
| 01/21/2003 | US6509257 Semiconductor device and process for making the same |
| 01/21/2003 | US6509255 Fuse area structure having guard ring surrounding fuse opening in semiconductor device and method of forming the same |
| 01/21/2003 | US6509245 Electronic device with interleaved portions for use in integrated circuits |
| 01/21/2003 | US6509236 Laser fuseblow protection method for silicon on insulator (SOI) transistors |
| 01/21/2003 | US6509213 Methods of forming transistors and connections thereto |
| 01/21/2003 | US6509209 Method of forming a metal-to-metal antifuse with non-conductive diffusion barrier |
| 01/21/2003 | US6509197 Inspectable buried test structures and methods for inspecting the same |
| 01/21/2003 | US6508919 Optimized liners for dual damascene metal wiring |
| 01/21/2003 | US6508890 Method of enhancing the conductivity of a conductive surface |
| 01/21/2003 | US6508595 Assembly of opto-electronic module with improved heat sink |
| 01/21/2003 | US6508301 Cold plate utilizing fin with evaporating refrigerant |
| 01/21/2003 | US6508300 Spring clip for a cooling device |
| 01/21/2003 | US6507981 Fastener carrier |
| 01/20/2003 | CA2393668A1 Semiconductor component |
| 01/16/2003 | WO2003005489A2 Socket connector |
| 01/16/2003 | WO2003005453A1 Tft substrate, liquid crystal display using the same, and its manufacturing method |
| 01/16/2003 | WO2003005450A2 Nanoscale wires and related devices |
| 01/16/2003 | WO2003005444A2 Ceramic-filled polymer substrate for using in high frequency technology |