| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/23/2003 | WO2003007364A2 Method for producing a packing for semiconductor chips |
| 01/23/2003 | WO2003007363A1 Method and apparatus for removing a carrier part from a carrier with a single operation, and a product removed from a carrier |
| 01/23/2003 | WO2003007362A1 Use of diverse materials in air-cavity packaging of electronic devices |
| 01/23/2003 | WO2003007338A2 Method for attaching an electronic component to a substrate |
| 01/23/2003 | WO2003007320A1 Thin film capacitor, and electronic circuit component |
| 01/23/2003 | WO2003007312A2 Thermal interface material and heat sink configuration |
| 01/23/2003 | WO2003007232A1 Lead frame antenna |
| 01/23/2003 | WO2002059964A3 Integrated circuits protected against reverse engineering and method for fabricating the same using etched passivation openings in passivation layer |
| 01/23/2003 | WO2002058138A3 An electronic assembly having a heat pipe that conducts heat from a semiconductor die |
| 01/23/2003 | WO2002056364A3 Conductor reservoir volume for integrated circuit interconnects |
| 01/23/2003 | WO2002011202A3 Method and device for producing connection substrates for electronic components |
| 01/23/2003 | WO2002007211A3 Multi-layer registration control for photolithography processes |
| 01/23/2003 | US20030018132 Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device |
| 01/23/2003 | US20030017707 Semiconductor device and method for manufacturing thereof |
| 01/23/2003 | US20030017698 Semiconductor device manufacturing method of forming an etching stopper film on a diffusion prevention film at a higher temperature |
| 01/23/2003 | US20030017692 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
| 01/23/2003 | US20030017691 Method for relieving bond stress in an under-bond-pad resistor |
| 01/23/2003 | US20030017690 Apparatus and method for attaching integrated circuit structures and devices utilizing the formation of a compliant substrate to a circuit board |
| 01/23/2003 | US20030017676 Operating method for a semiconductor component |
| 01/23/2003 | US20030017654 Semiconductor chip having a supporting member, tape substrate, semiconductor package having the semiconductor chip and the tape substrate, and the method of manufacturing the same |
| 01/23/2003 | US20030017653 Semiconductor package insulation film and manufacturing method thereof |
| 01/23/2003 | US20030017652 Semiconductor device, its fabrication method and electronic device |
| 01/23/2003 | US20030017651 Leadframe alteration to direct compound flow into package |
| 01/23/2003 | US20030017650 Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces |
| 01/23/2003 | US20030017648 Panel structure with plurality of chip compartments for providing high volume of chip modules |
| 01/23/2003 | US20030017647 Wafer level stack chip package and method for manufacturing same |
| 01/23/2003 | US20030017646 Integrated circuit die having an interference shield |
| 01/23/2003 | US20030017645 Method for manufacturing circuit device |
| 01/23/2003 | US20030017643 Embedded recess in polymer memory package and method of making same |
| 01/23/2003 | US20030017642 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates |
| 01/23/2003 | US20030017631 Method of arranging exposed areas including a limited number of TEG regions on a semiconductor wafer |
| 01/23/2003 | US20030017320 Radiating sheet and PDP panel |
| 01/23/2003 | US20030016568 Semiconductor device |
| 01/23/2003 | US20030016511 Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface |
| 01/23/2003 | US20030016503 Solder-free PCB assembly |
| 01/23/2003 | US20030016502 Semiconductor device |
| 01/23/2003 | US20030016501 Heat sink clip assembly with handles |
| 01/23/2003 | US20030016500 Attachment of a single heat dissipation device to multiple components with vibration isolation |
| 01/23/2003 | US20030016497 Heat sink, cooling member, semiconductor-substrate cooling system, computer, and radiation method |
| 01/23/2003 | US20030016495 Cooling unit including plurality of radiating fins and fan for sending air and electronic apparatus with the cooling unit mounted thereon |
| 01/23/2003 | US20030016479 Electrostatic discharge (ESD) protection circuit of silicon-controlled rectifier (SCR) structure operable at a low trigger voltage |
| 01/23/2003 | US20030016308 Thin film transistor substrate for liquid crystal display panel and manufacturing method thereof |
| 01/23/2003 | US20030016076 Semiconductor integrated circuit |
| 01/23/2003 | US20030015806 Semiconductor wafer |
| 01/23/2003 | US20030015804 Flip chip assembly and method of producing flip chip assembly |
| 01/23/2003 | US20030015802 Semiconductor device and a method of manufacturing the same |
| 01/23/2003 | US20030015801 Semiconductor device |
| 01/23/2003 | US20030015800 Semiconductor device having a multiple layer wiring structure, wiring method, wiring device, and recording medium |
| 01/23/2003 | US20030015799 Semiconductor device and method for manufacturing the same |
| 01/23/2003 | US20030015798 Semiconductor device and method of fabricating the semiconductor device |
| 01/23/2003 | US20030015797 Semiconductor device |
| 01/23/2003 | US20030015796 Semiconductor device and production method thereof |
| 01/23/2003 | US20030015793 Microstructure control of copper interconnects |
| 01/23/2003 | US20030015792 Memory chip and semiconductor device using the memory chip and manufacturing method of those |
| 01/23/2003 | US20030015791 Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment |
| 01/23/2003 | US20030015790 Microcooling device |
| 01/23/2003 | US20030015789 Semiconductor package with lid heat spreader |
| 01/23/2003 | US20030015788 Process for making fine pitch connections between devices and structure made by the process |
| 01/23/2003 | US20030015787 Electronic package with integrated capacitor |
| 01/23/2003 | US20030015786 BGA type semiconductor device and electronic equipment using the same |
| 01/23/2003 | US20030015785 BGA type semiconductor device and electronic equipment using the same |
| 01/23/2003 | US20030015784 Grid array packaged integrated circuit |
| 01/23/2003 | US20030015783 Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods |
| 01/23/2003 | US20030015782 Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture |
| 01/23/2003 | US20030015781 Method of using foamed insulators in three dimensional multichip structures |
| 01/23/2003 | US20030015780 Bumped chip carrier package using lead frame and method for manufacturing the same |
| 01/23/2003 | US20030015778 Semiconductor device |
| 01/23/2003 | US20030015775 Resin-encapsulation semiconductor device and method for fabricating the same |
| 01/23/2003 | US20030015774 Semiconductor component with contacts situated at the underside, and fabrication method |
| 01/23/2003 | US20030015773 Semiconductor device |
| 01/23/2003 | US20030015772 Method and structure for DC and RF shielding of integrated circuits |
| 01/23/2003 | US20030015750 Structure for reducing contact aspect ratios |
| 01/23/2003 | US20030015734 Integrated semiconductor circuit having contact points and configuration having at least two such circuits |
| 01/23/2003 | US20030015733 Multichip semiconductor device |
| 01/23/2003 | US20030015732 Integrated circuits having self-aligned metal contact structures and methods of fabricating the same |
| 01/23/2003 | US20030015730 Integrated impedance matching and stability network |
| 01/23/2003 | US20030015718 Laminated lead frame, and optical communication module and method of manufacturing the same |
| 01/23/2003 | US20030015717 Optical semiconductor component package and optical pickup device |
| 01/23/2003 | US20030015709 Structure and method for fabricating semiconductor structures, devices, and packaging utilizing the formation of a compliant substrates for materials used to form the same |
| 01/23/2003 | US20030015701 Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device |
| 01/23/2003 | US20030015574 Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate |
| 01/23/2003 | US20030015350 Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthrough |
| 01/23/2003 | US20030015348 Printed circuit board with a heat dissipation element, mehtod for manufacturing the printed circuit board, and package comprising the printed circuit board |
| 01/23/2003 | US20030015344 Printed circuit board employing lossy power distribution network to reduce power plane resonances |
| 01/23/2003 | US20030015343 Readily attachable heat sink assembly |
| 01/23/2003 | US20030015342 Multilayer printed wiring board and method for producing multilayer printed wiring board |
| 01/23/2003 | US20030015314 Tapered cold plate |
| 01/23/2003 | US20030015311 Heat dissipation device |
| 01/23/2003 | US20030015277 Process for the manufacture of multilayer ceramic substrates |
| 01/23/2003 | US20030015033 Wire bonded sensor and method for manufacturing wire bonded sensor |
| 01/23/2003 | US20030014980 Device and method for controlling temperature of semiconductor module |
| 01/23/2003 | US20030014863 Method for manufacturing a printed circuit board |
| 01/23/2003 | CA2454252A1 Cooling apparatus for electronic devices |
| 01/22/2003 | EP1278408A2 Heat dissipation assembly |
| 01/22/2003 | EP1278296A1 Power comversion apparatus and mobile object incorporating thereof |
| 01/22/2003 | EP1278242A2 Hermetically sealing enclosure for housing photo-semiconductor devices and photo-semiconductor module incorporating the enclosure |
| 01/22/2003 | EP1278240A2 Transfering method of a component onto a connection support by welding without supplying material |
| 01/22/2003 | EP1278214A1 Composition for forming low dielectric constant insulating film, method of forming insulting film using the insulating film produced thereby |
| 01/22/2003 | EP1277801A1 Material made a from polyurethane gel, method of preparation and uses |
| 01/22/2003 | EP1277798A2 Thermosetting resin composition |