| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/30/2003 | DE10142318C1 Semiconductor structure for measuring critical dimensions and overlay accuracy, has substrate provided with two different periodic patterns with overlap indicating overlay error |
| 01/29/2003 | EP1280392A1 Printed circuit board and relevant manufacturing method for the installation of microwave chips up to 80 Ghz |
| 01/29/2003 | EP1280241A1 Electrical contact |
| 01/29/2003 | EP1280213A2 Layered wiring line of silver or silver alloy and method for forming the same and display panel substrate using the same |
| 01/29/2003 | EP1280204A2 Wiring substrate having position problem |
| 01/29/2003 | EP1280202A2 High performance cooling device |
| 01/29/2003 | EP1280201A2 Spring clip for a cooling device |
| 01/29/2003 | EP1280200A1 Hydrogen gettering structure including silver-doped palladium layer to increase hydrogen gettering of module component and semiconductor device module having such structure, and methods of fabrication |
| 01/29/2003 | EP1280194A2 Manufacturing method of semiconductor device |
| 01/29/2003 | EP1279966A2 Apparatus and method for determining the reliability of integrated semiconductor circuits at high temperatures |
| 01/29/2003 | EP1279491A1 Gold wire for use in semiconductor packaging and high-frequency signal transmission and its fabrication method |
| 01/29/2003 | EP1279197A1 Encapsulated display device |
| 01/29/2003 | EP1279195A1 Electronic component with flexible contact points and method for the production thereof |
| 01/29/2003 | EP1279193A2 Method of forming an integrated circuit package at a wafer level |
| 01/29/2003 | EP1279189A1 A method of forming a conductive coating on a semiconductor device |
| 01/29/2003 | EP1278796A1 Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom |
| 01/29/2003 | EP0877762A4 Dual-curing coating formulation and method |
| 01/29/2003 | CN2533575Y Heatsink assembly |
| 01/29/2003 | CN2533509Y Heatsink |
| 01/29/2003 | CN1394360A Semiconductor device fabrication method and device thereof |
| 01/29/2003 | CN1394359A Method for hermetic sealing of electronic parts |
| 01/29/2003 | CN1394358A Laser system and method for processing memory link with burst of laser pulses having ultrashort pulsewidths |
| 01/29/2003 | CN1394115A 散热器 Heat sink |
| 01/29/2003 | CN1394113A Method for mfg. glass ceramic multi-substrate and glass ceramic multi-substrate |
| 01/29/2003 | CN1394110A Process for praparing contact electrode of high-temp superconductor filter |
| 01/29/2003 | CN1393942A Illuminating device and mfg. method thereof |
| 01/29/2003 | CN1393941A Lead frame for surface fixing type LED and mfg. method thereof |
| 01/29/2003 | CN1393933A 化合物半导体装置 The compound semiconductor device |
| 01/29/2003 | CN1393932A Semiconductor chip with fuse element |
| 01/29/2003 | CN1393930A Sintered heat radiator |
| 01/29/2003 | CN1393929A Thermal radiator for IC |
| 01/29/2003 | CN1393928A Sealed encapsulating containing for optical semiconductor device and optical semiconductor module |
| 01/29/2003 | CN1393919A Method for mfg. recognizer, jointing device and circuit apparatus |
| 01/29/2003 | CN1393829A Replacing at least one chip mounted on seat by pressing into and covering |
| 01/29/2003 | CN1100474C Electronic package and its mfg. method |
| 01/29/2003 | CN1100473C Structure reinforced spherical grid array semiconductor package and system |
| 01/29/2003 | CN1100350C Conductor for forming conductive path on integrated circuit and method thereof |
| 01/29/2003 | CN1100349C Semiconductor and method of fabricating same |
| 01/29/2003 | CN1100346C Lead frame and chip-size semiconductor package fabrication method applied thereto |
| 01/29/2003 | CN1100345C Method and device for chip assembly |
| 01/28/2003 | US6513000 Simulating wiring temperature rise due to void by conducting two-dimensional thermal analysis on wiring cross-section using computer |
| 01/28/2003 | US6512680 Semiconductor package |
| 01/28/2003 | US6512675 Heat sink grounded to a grounded package lid |
| 01/28/2003 | US6512674 Package for semiconductor device having radiating substrate and radiator fin |
| 01/28/2003 | US6512673 Low profile equipment housing with angular fan |
| 01/28/2003 | US6512447 Bussing high frequency crosspoint switches |
| 01/28/2003 | US6512388 IC socket and spring means of IC socket |
| 01/28/2003 | US6512304 Nickel-iron expansion contact for semiconductor die |
| 01/28/2003 | US6512303 Flip chip adaptor package for bare die |
| 01/28/2003 | US6512302 Apparatus and methods of packaging and testing die |
| 01/28/2003 | US6512300 Water level interconnection |
| 01/28/2003 | US6512298 Semiconductor device and method for producing the same |
| 01/28/2003 | US6512295 Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses |
| 01/28/2003 | US6512293 Mechanically interlocking ball grid array packages and method of making |
| 01/28/2003 | US6512292 Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces |
| 01/28/2003 | US6512291 Flexible semiconductor device support with integrated thermoelectric cooler and method for making same |
| 01/28/2003 | US6512289 Direct current regulation on integrated circuits under high current design conditions |
| 01/28/2003 | US6512288 Circuit board semiconductor package |
| 01/28/2003 | US6512287 Board frame, method for fabricating thereof and method for fabricating semiconductor apparatus |
| 01/28/2003 | US6512286 Package having covering layer filling gap between chip and die pad so air is completely dissipated out and no void is formed in encapsulant; adhesive attaching chip to die pad does not flash to opening of die pad so no delamination occurs |
| 01/28/2003 | US6512285 High inductance inductor in a semiconductor package |
| 01/28/2003 | US6512284 Semiconductor fuse or antifuse that is programmable and readable with same two electrodes, has enhanced structural integrity, requires low power signal |
| 01/28/2003 | US6512283 Monolithic low dielectric constant platform for passive components and method |
| 01/28/2003 | US6512281 Method of forming a semiconductor device and an improved deposition system |
| 01/28/2003 | US6512278 Stacked semiconductor integrated circuit device having an inter-electrode barrier to silicide formation |
| 01/28/2003 | US6512270 Thin film transistor substrate and process for producing the same |
| 01/28/2003 | US6512182 Wiring circuit board and method for producing same |
| 01/28/2003 | US6512180 Printed-wiring board, method for identifying same, and method for manufacturing same |
| 01/28/2003 | US6512176 Semiconductor device |
| 01/28/2003 | US6512175 Electronic packaging device |
| 01/28/2003 | US6512071 Organohydridosiloxane resins with high organic content |
| 01/28/2003 | US6512031 First curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into a three-dimensional polymer. The use of two curing agents corresponding to straight chain growth |
| 01/28/2003 | US6511919 Contacts for a bit line and a storage node in a semiconductor device |
| 01/28/2003 | US6511910 Method for manufacturing semiconductor devices |
| 01/28/2003 | US6511908 Method of manufacturing a dual damascene structure using boron nitride as trench etching stop film |
| 01/28/2003 | US6511901 Metal redistribution layer having solderable pads and wire bondable pads |
| 01/28/2003 | US6511900 Boron incorporated diffusion barrier material |
| 01/28/2003 | US6511868 Semiconductor fuses, methods of using the same, methods of making the same, and semiconductor devices containing the same |
| 01/28/2003 | US6511866 Use of diverse materials in air-cavity packaging of electronic devices |
| 01/28/2003 | US6511865 Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly |
| 01/28/2003 | US6511864 Method of fabricating semiconductor device |
| 01/28/2003 | US6511863 Method and apparatus for a semiconductor package for vertical surface mounting |
| 01/28/2003 | US6511862 Modified contact for programmable devices |
| 01/28/2003 | US6511607 Method of making an electrical connecting member |
| 01/28/2003 | US6511538 Film deposition method and apparatus for semiconductor devices |
| 01/28/2003 | US6510976 Method for forming a flip chip semiconductor package |
| 01/28/2003 | US6510606 Multichip module |
| 01/23/2003 | WO2003007451A1 Voltage limiting protection for high frequency power device |
| 01/23/2003 | WO2003007380A1 Semiconductor apparatus with improved esd withstanding voltage |
| 01/23/2003 | WO2003007379A1 Electronic circuit component |
| 01/23/2003 | WO2003007376A1 Power module and air conditioner |
| 01/23/2003 | WO2003007375A2 Single package containing multiple integrated circuit devices |
| 01/23/2003 | WO2003007374A1 Hybrid module |
| 01/23/2003 | WO2003007373A1 Lead frame and its manufacturing method |
| 01/23/2003 | WO2003007372A2 Cooling apparatus for electronic devices |
| 01/23/2003 | WO2003007371A2 Transistor cell |
| 01/23/2003 | WO2003007370A1 Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor |
| 01/23/2003 | WO2003007369A1 Semiconductor connection substrate |
| 01/23/2003 | WO2003007368A2 Method of forming nitride capped cu lines with reduced electromigration along the cu/nitride interface |
| 01/23/2003 | WO2003007367A1 Locally increasing sidewall density by ion implantation |