| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/30/2003 | WO2003009372A2 Low resistivity tantalum nitride/tantalum bilayer stack |
| 01/30/2003 | WO2003009371A1 Method of forming a conductive interconnect |
| 01/30/2003 | WO2003009364A2 Low dielectric constant layers |
| 01/30/2003 | WO2003009342A2 Data carrier for contactless communication with an integrated component |
| 01/30/2003 | WO2003009318A2 Support with getter-material for microelectronic, microoptoelectronic or micromechanical device |
| 01/30/2003 | WO2003009317A2 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
| 01/30/2003 | WO2003008660A1 Depositing a tantalum film |
| 01/30/2003 | WO2003008500A1 Material consisting of a polyurethane gel, production method and uses thereof |
| 01/30/2003 | WO2003008483A1 Aromatic fluoropolymer and use thereof |
| 01/30/2003 | WO2003008186A1 Insulating and functionalizing fine metal-containing particles with comformal ultra-thin films |
| 01/30/2003 | WO2002087293A3 Support for electrical circuit elements |
| 01/30/2003 | WO2002076166A9 Heat sink |
| 01/30/2003 | WO2002055431A3 Wafer level interconnection |
| 01/30/2003 | WO2002047451A3 Conduited heat dissipation device |
| 01/30/2003 | US20030022646 Integrated switchless programmable attenuator and low noise amplifier |
| 01/30/2003 | US20030022558 Electronic device, method of manufacturing the same and method of designing the same, and circuit board and electronic instrument |
| 01/30/2003 | US20030022532 Electrical contact |
| 01/30/2003 | US20030022527 Removing hydrogen from the microcircuit in a vacuum furnace and annealing in deuterium-containing forming gas |
| 01/30/2003 | US20030022526 Process for fabricating a dielectric film using plasma oxidation |
| 01/30/2003 | US20030022514 Method of forming contacts for a bit line and a storage node in a semiconductor device |
| 01/30/2003 | US20030022503 Method for the fabrication of electrical contacts |
| 01/30/2003 | US20030022489 Method of fabricating high melting point metal wiring layer, method of fabricating semiconductor device and semiconductor device |
| 01/30/2003 | US20030022483 Dielectric between metal structures and method therefor |
| 01/30/2003 | US20030022482 Method of manufacturing a semiconductor device |
| 01/30/2003 | US20030022481 Semiconductor device and method for fabricating the same |
| 01/30/2003 | US20030022479 Semiconductor device, a method of manufacturing the same and an electronic device |
| 01/30/2003 | US20030022478 Semiconductor device using bumps, method for fabricating same, and method for forming bumps |
| 01/30/2003 | US20030022477 Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints |
| 01/30/2003 | US20030022475 Electrical connection between two surfaces of a substrate and method for producing same |
| 01/30/2003 | US20030022468 Manufacturing method of semiconductor device |
| 01/30/2003 | US20030022464 Transfer-molded power device and method for manufacturing transfer-molded power device |
| 01/30/2003 | US20030022454 Capacitor and method of manufacturing the same |
| 01/30/2003 | US20030022433 Method for production of semiconductor device |
| 01/30/2003 | US20030022419 Method of fabricating vias in solder pads of a ball grid array (BGA) substrate |
| 01/30/2003 | US20030022417 Micro eletro-mechanical component and system architecture |
| 01/30/2003 | US20030022405 Lead formation, assembly strip test and singulation method |
| 01/30/2003 | US20030021990 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame |
| 01/30/2003 | US20030021570 Tooling fixture for packaged optical micro-mechanical devices |
| 01/30/2003 | US20030021310 Method and apparatus for cooling electronic or opto-electronic devices |
| 01/30/2003 | US20030021096 Decoupling capacitor closely coupled with integrated circuit |
| 01/30/2003 | US20030020590 Protection of electrical devices with voltage variable materials |
| 01/30/2003 | US20030020544 Large gain range, high linearity, low noise MOS VGA |
| 01/30/2003 | US20030020510 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing |
| 01/30/2003 | US20030020497 Apparatus for testing reliability of interconnection in integrated circuit |
| 01/30/2003 | US20030020183 Semiconductor device without use of chip carrier and method for making the same |
| 01/30/2003 | US20030020181 Manufacturing method of electroluminescence display apparatus |
| 01/30/2003 | US20030020179 Methods and apparatus for aligning an integrated circuit package with an interface |
| 01/30/2003 | US20030020178 Intergrated circuit chip bonding sheet and integrated circuit package |
| 01/30/2003 | US20030020177 Method of manufacturing a semiconductor device having a die pad without a downset |
| 01/30/2003 | US20030020176 Semiconductor device and manufacturing method thereof |
| 01/30/2003 | US20030020175 Semiconductor device and method for fabricating the same |
| 01/30/2003 | US20030020174 Semiconductor device |
| 01/30/2003 | US20030020172 Semiconductor device and process for production thereof |
| 01/30/2003 | US20030020170 Method for fabricating a wiring line assembly for a thin film transistor array panel substrate |
| 01/30/2003 | US20030020168 Semiconductor device and manufacturing method thereof |
| 01/30/2003 | US20030020167 Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum |
| 01/30/2003 | US20030020165 Semiconductor device, and method for manufacturing the same |
| 01/30/2003 | US20030020164 Spherical semiconductor device and method for fabricating the same |
| 01/30/2003 | US20030020163 Bonding pad structure for copper/low-k dielectric material BEOL process |
| 01/30/2003 | US20030020162 Semiconductor device and method of manufacturing the same |
| 01/30/2003 | US20030020160 Semiconductor device die and package having improved heat dissipation capability |
| 01/30/2003 | US20030020159 Heat-conducting adhesive compound and a method for producing a heat-conducting adhesive compound |
| 01/30/2003 | US20030020158 Semiconductor device and contactor for inspection |
| 01/30/2003 | US20030020156 Electronic package with optimized lamination process |
| 01/30/2003 | US20030020155 Chip-on-board module, and method of manufacturing the same |
| 01/30/2003 | US20030020154 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 01/30/2003 | US20030020153 Chip stack with differing chip package types |
| 01/30/2003 | US20030020152 IC chip mounting structure and display device |
| 01/30/2003 | US20030020151 Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same |
| 01/30/2003 | US20030020150 Compliant layer for encapsulated columns |
| 01/30/2003 | US20030020149 Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same |
| 01/30/2003 | US20030020148 Lead frame and semiconductor device having the same as well as method of resin-molding the same |
| 01/30/2003 | US20030020147 Method of making leadframe by mechanical processing |
| 01/30/2003 | US20030020146 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant |
| 01/30/2003 | US20030020145 Semiconductor device having reinforced coupling between solder balls and substrate |
| 01/30/2003 | US20030020142 Semiconductor die with contoured bottom surface and method for making same |
| 01/30/2003 | US20030020131 Device and method for detecting a reliability of integrated semiconductor components at high temperatures |
| 01/30/2003 | US20030020098 Semiconductor integrated circuit device |
| 01/30/2003 | US20030020095 Semiconductor integrated circuit with voltage down converter adaptable for burn-in testing |
| 01/30/2003 | US20030020094 Critically aligned optical mems dies for large packaged substrate arrays and method of manufacture |
| 01/30/2003 | US20030020072 Thermal management systems and methods |
| 01/30/2003 | US20030020069 Structure and method for optimizing transmission media through dielectric layering and doping in semiconductor structures and devices utilizing the formation of a compliant substrate |
| 01/30/2003 | US20030019851 Method and structure for forming metallic interconnections using directed thermal diffusion |
| 01/30/2003 | US20030019836 Method for the fabrication of electrical contacts |
| 01/30/2003 | US20030019664 Electrically conducting bonding connection |
| 01/30/2003 | US20030019647 Protected electronic assembly |
| 01/30/2003 | US20030019612 Cooling apparatus boiling and condensing refrigerant |
| 01/30/2003 | US20030019610 Rapidly self - heat-conductive heat - dissipating module |
| 01/30/2003 | US20030019609 High performance cooling device |
| 01/30/2003 | US20030019608 Spring clip for a cooling device |
| 01/30/2003 | US20030019607 Flexible heat pipe |
| 01/30/2003 | US20030019574 Method for preparing high performance ball grid array board and jig applicable to said method |
| 01/30/2003 | US20030019572 Oled packaging |
| 01/30/2003 | US20030019564 Thermally conductive adhesive sheet |
| 01/30/2003 | US20030019235 Apparatus and method for controlling the temperature of an integrated circuit device |
| 01/30/2003 | US20030019234 Integrated circuit cooling apparatus |
| 01/30/2003 | US20030019104 Finned heat sink assemblies |
| 01/30/2003 | US20030019103 Method of manufacturing a composite overmolded heat pipe |
| 01/30/2003 | US20030019102 Method of fabricating an alloy film on a face of a heat exchanger for an integrated circuit |
| 01/30/2003 | DE20213087U1 Cooling body used for cooling an electronic component, especially a central processing unit chip of a computer is made from or coated with diamond |