| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/05/2003 | CN2534773Y 散热器 Heat sink |
| 02/05/2003 | CN2534678Y Fixing device for radiating fins |
| 02/05/2003 | CN2534621Y Air escape mechanism for radiator |
| 02/05/2003 | CN2534619Y Elastic clamp structural element for radiating body |
| 02/05/2003 | CN1395743A Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring |
| 02/05/2003 | CN1395604A Adhensive film for semiconductor, lead frame with adhensive film for semiconductor and semiconductor device using the same |
| 02/05/2003 | CN1395464A Method for mfg. multilayer ceramic plate |
| 02/05/2003 | CN1395450A Method for manufacturing electric field lighting display device |
| 02/05/2003 | CN1395315A Semiconductor and manufacturing method thereof |
| 02/05/2003 | CN1395311A Semiconductor integrated circuit and D/A converter and A/D converter |
| 02/05/2003 | CN1395309A Mixed integrated circuit device and its manufacturing method |
| 02/05/2003 | CN1395308A Mixed integrated circuit device and its manufacturing method |
| 02/05/2003 | CN1395307A Semiconductor structure with embedded bus, and method for generating contant to embedded bus |
| 02/05/2003 | CN1395304A Wiring basilar plate with position information |
| 02/05/2003 | CN1395301A Method for manufacturing mixed integrated circuit device |
| 02/05/2003 | CN1395300A Metal wiring after-treatment method for semiconductor element |
| 02/05/2003 | CN1395295A Method for producing semiconductor device and used slurry |
| 02/05/2003 | CN1395185A Electronic device with detachable circuit block and method for assembling said electronic device |
| 02/05/2003 | CN1395146A Method for measuring bridging connection resulted from correction of photo cover configuration and its equipment |
| 02/05/2003 | CN1101126C Wiring board and its producing method |
| 02/05/2003 | CN1101063C 半导体装置 Semiconductor device |
| 02/04/2003 | US6516447 Topological global routing for automated IC package interconnect |
| 02/04/2003 | US6516415 Device and method of maintaining a secret code within an integrated circuit package |
| 02/04/2003 | US6515931 Rupturing oxide to form short between plates; well biased to internal voltage; integrated circuits |
| 02/04/2003 | US6515913 Semiconductor memory device and defect remedying method thereof |
| 02/04/2003 | US6515870 Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit |
| 02/04/2003 | US6515862 Heat sink assembly for an integrated circuit |
| 02/04/2003 | US6515861 Method and apparatus for shielding electromagnetic emissions from an integrated circuit |
| 02/04/2003 | US6515860 CPU heat sink fastener |
| 02/04/2003 | US6515839 Electronic discharge protection system for mixed voltage application specific circuit design |
| 02/04/2003 | US6515505 Functionality change by bond optioning decoding |
| 02/04/2003 | US6515495 Test structure in an integrated semiconductor |
| 02/04/2003 | US6515374 Contact connection of metal interconnects of an integrated semiconductor chip |
| 02/04/2003 | US6515373 Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys |
| 02/04/2003 | US6515372 Wiring board and its production method, semiconductor device and its production method, and electronic apparatus |
| 02/04/2003 | US6515371 Semiconductor device with elastic structure and wiring |
| 02/04/2003 | US6515370 Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board |
| 02/04/2003 | US6515369 High performance system-on-chip using post passivation process |
| 02/04/2003 | US6515368 Semiconductor device with copper-filled via includes a copper-zinc/alloy film for reduced electromigration of copper |
| 02/04/2003 | US6515366 Sacrificial copper; chemical mechanical polishing |
| 02/04/2003 | US6515365 Semiconductor device having a ground plane and manufacturing method thereof |
| 02/04/2003 | US6515364 Semiconductor device |
| 02/04/2003 | US6515362 Grid array package with increased electrical grounding routes and method of fabrication |
| 02/04/2003 | US6515361 Cavity down ball grid array (CD BGA) package |
| 02/04/2003 | US6515360 Lid attached to ring covers and seals chip |
| 02/04/2003 | US6515359 Lead frame decoupling capacitor semiconductor device packages including the same and methods |
| 02/04/2003 | US6515358 Integrated passivation process, probe geometry and probing process |
| 02/04/2003 | US6515357 Semiconductor package and semiconductor package fabrication method |
| 02/04/2003 | US6515356 Semiconductor package and method for fabricating the same |
| 02/04/2003 | US6515355 Passivation layer for packaged integrated circuits |
| 02/04/2003 | US6515354 Micro-BGA beam lead connection with cantilevered beam leads |
| 02/04/2003 | US6515353 Multi-layer lead frame for a semiconductor device |
| 02/04/2003 | US6515352 Shielding arrangement to protect a circuit from stray magnetic fields |
| 02/04/2003 | US6515349 Semiconductor device and process for the same |
| 02/04/2003 | US6515347 Wafer level semiconductor device and method of manufacturing the same |
| 02/04/2003 | US6515346 Microbar and method of its making |
| 02/04/2003 | US6515344 Programmable by passing current and causing gate oxide to fail; adjusting pattern; doped active region; semiconductors, integrated circuits |
| 02/04/2003 | US6515343 Metal-to-metal antifuse with non-conductive diffusion barrier |
| 02/04/2003 | US6515337 Input protection circuit connected to projection circuit power source potential line |
| 02/04/2003 | US6515324 Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same |
| 02/04/2003 | US6515304 Device for defeating reverse engineering of integrated circuits by optical means |
| 02/04/2003 | US6515303 Method of forming vias in silicon carbide and resulting devices and circuits |
| 02/04/2003 | US6515236 Printed wiring board and manufacturing method of the printed wiring board |
| 02/04/2003 | US6515047 Composition of epoxy resin and triazine-formaldehyde-phenol resin |
| 02/04/2003 | US6514884 Method for reforming base surface, method for manufacturing semiconductor device and equipment for manufacturing the same |
| 02/04/2003 | US6514882 Aggregate dielectric layer to reduce nitride consumption |
| 02/04/2003 | US6514880 Vaporizing a silicon-containing hydrocarbon compound producing gas for polysiloxane, chemical vapor deposition wherein semiconductor is placed, introducing additive gas (inert and oxidizing), forming film via plasma polymerization |
| 02/04/2003 | US6514878 Method of fabricating a semiconductor device having a multilayered interconnection structure |
| 02/04/2003 | US6514873 Method for fabricating semiconductor device |
| 02/04/2003 | US6514872 Method of manufacturing a semiconductor device |
| 02/04/2003 | US6514858 Test structure for providing depth of polish feedback |
| 02/04/2003 | US6514855 Semiconductor device manufacturing method having a porous insulating film |
| 02/04/2003 | US6514854 Method of producing semiconductor integrated circuit device having a plug |
| 02/04/2003 | US6514853 Semiconductor device and a manufacturing process therefor |
| 02/04/2003 | US6514852 Semiconductor device and method of manufacturing the same |
| 02/04/2003 | US6514851 Method of fabrication of multilayer semiconductor wiring structure with reduced alignment mark area |
| 02/04/2003 | US6514848 Method for forming an interconnection in a semiconductor element |
| 02/04/2003 | US6514847 Method for making a semiconductor device |
| 02/04/2003 | US6514799 Method for substrate noise distribution |
| 02/04/2003 | US6514798 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
| 02/04/2003 | US6514794 Redistributed bond pads in stacked integrated circuit die package |
| 02/04/2003 | US6514793 Stackable flex circuit IC package and method of making same |
| 02/04/2003 | US6514792 Mechanically-stabilized area-array device package |
| 02/04/2003 | US6514789 Component and method for manufacture |
| 02/04/2003 | US6514783 Method for determining a layout for a flip-chip transition interface structure |
| 02/04/2003 | US6514780 Method for manufacturing an integrated circuit having a particular functionality required by a user of the circuit and having first structures to produce the particular functionality and second structures |
| 02/04/2003 | US6514779 Large area silicon carbide devices and manufacturing methods therefor |
| 02/04/2003 | US6514777 Built-in inspection template for a printed circuit |
| 02/04/2003 | US6514671 Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristics |
| 02/04/2003 | US6514667 Lithography structure |
| 02/04/2003 | US6514616 Thermal management device and method of making such a device |
| 02/04/2003 | US6514389 Method of processing a workpiece |
| 02/04/2003 | US6513389 Technique for determining curvatures of embedded line features on substrates |
| 02/04/2003 | US6513239 Providing liquid retainer surrounding heat exchanger's face and compliant member which forms seal between heat exchanger and retainer; dispensed liquid which falls from face is retained and kept from leaking until removal |
| 01/30/2003 | WO2003009435A1 Heat spreader |
| 01/30/2003 | WO2003009389A1 Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods |
| 01/30/2003 | WO2003009383A1 Capacitor arrangement and method for producing such a capacitor arrangement |
| 01/30/2003 | WO2003009380A2 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates |
| 01/30/2003 | WO2003009379A2 Semiconductive device and method of formation |
| 01/30/2003 | WO2003009378A1 Solder-free pcb assembly |