Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2003
02/06/2003US20030027423 Contact structure and production method thereof and probe contact assembly using same
02/06/2003US20030027418 Semiconductor device fabricating method and treating liquid
02/06/2003US20030027413 Method to improve the adhesion of dielectric layers to copper
02/06/2003US20030027411 Semiconductor device
02/06/2003US20030027393 Semiconductor device and method of manufacturing the same
02/06/2003US20030027385 Method for manufacturing a semiconductor device having a metal-insulator-metal capacitor and a damascene wiring layer structure
02/06/2003US20030027379 Laser repair operation
02/06/2003US20030027377 Multi-strand substrate for ball-grid array assemblies and method
02/06/2003US20030027375 Semiconductor device, method of making the same, circuit board, and flexible substrate
02/06/2003US20030027374 Methods of making microelectronic assemblies including compliant interfaces
02/06/2003US20030027373 Methods for providing void-free layers for semiconductor assemblies
02/06/2003US20030027372 Semiconductor device having leads provided with interrupter for molten resin
02/06/2003US20030027368 Monitoring processing tendencies of processing tools adapted to process wafers, measuring characteristic of particular incoming wafer, identifying tool having processing tendency complimentary to characteristic, routing wafer to that tool
02/06/2003US20030027081 Photolithographically-patterned out-of-plane coil structures and method of making
02/06/2003US20030027060 Photoresist and process for structuring such a photoresist
02/06/2003US20030026991 Passive electrical components formed on carbon coated insulating substrates
02/06/2003US20030026989 Insulating and functionalizing fine metal-containing particles with conformal ultra-thin films
02/06/2003US20030026674 Fastener retainer assembly
02/06/2003US20030026158 Anti-fuse memory cell with asymmetric breakdown voltage
02/06/2003US20030026157 Anti-fuse memory cell with asymmetric breakdown voltage
02/06/2003US20030026077 Covering element for subassemblies
02/06/2003US20030026076 Memory heat sink device
02/06/2003US20030026075 CPU heat sink with fan fitting hole
02/06/2003US20030026073 Toggle heat sink clip
02/06/2003US20030026070 Dynamic isolating mount for processor packages
02/06/2003US20030026054 Active power/ground ESD trigger
02/06/2003US20030025579 IGFET and tuning circuit
02/06/2003US20030025517 Method and apparatus for determining the location of an alignment mark on a wafer
02/06/2003US20030025516 Testing vias and contacts in integrated circuit fabrication
02/06/2003US20030025216 Phase shift mask blank, phase shift mask, and method of manufacture
02/06/2003US20030025215 Plastic ball grid array package with integral heatsink
02/06/2003US20030025214 Sealing resin, resin-sealed semiconductor and system-in-package
02/06/2003US20030025211 Chip stack with differing chip package types
02/06/2003US20030025210 Patterning three dimensional structures
02/06/2003US20030025209 Semiconductor device and method for fabricating the same
02/06/2003US20030025207 Semiconductor device and its fabrication method
02/06/2003US20030025206 Boron-doped titanium nitride layer for high aspect ratio semiconductor devices
02/06/2003US20030025205 Hexadecagonal routing
02/06/2003US20030025204 Ball grid array type semiconductor device and method for manufacturing the same
02/06/2003US20030025203 Under bump metallization pad and solder bump connections
02/06/2003US20030025202 Semiconductor device having an external electrode
02/06/2003US20030025201 Integrated circuit chip with little possibility of becoming damaged and structure for mounting the same
02/06/2003US20030025200 Process of manufacturing semiconductor device and slurry used therefor
02/06/2003US20030025199 Super low profile package with stacked dies
02/06/2003US20030025198 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
02/06/2003US20030025197 Cooling structure for multichip module
02/06/2003US20030025196 Heat transfer structure and a semi-conductor device
02/06/2003US20030025195 Heat transfer structure and a semi-conductor device
02/06/2003US20030025194 Protective device with spacer for subassemblies
02/06/2003US20030025192 Forming microelectronic connection components by electrophoretic deposition
02/06/2003US20030025190 Tape ball grid array semiconductor chip package having ball land pad isolated from adhesive, a method of manufacturing the same and a multi-chip package
02/06/2003US20030025189 Semiconductor package with recessed leadframe and a recessed leadframe
02/06/2003US20030025187 Protective device for subassemblies
02/06/2003US20030025185 U-shape tape for BOC FBGA package to improve moldability
02/06/2003US20030025184 Semiconductor device and method for manufacturing the same
02/06/2003US20030025183 Packaged semiconductor device and method of manufacture using shaped die
02/06/2003US20030025182 Metal article coated with tin or tin alloy under tensile stress to inhibit whisker growth
02/06/2003US20030025180 EMI shielding for semiconductor chip carriers
02/06/2003US20030025178 Low current blow trim fuse
02/06/2003US20030025177 Optically and electrically programmable silicided polysilicon fuse device
02/06/2003US20030025173 Semiconductor device and manufacturing method thereof
02/06/2003US20030025163 Semiconductor device having elevated source/drain and method of fabricating the same
02/06/2003US20030025139 Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed
02/06/2003US20030025137 Method for manufacturing a semiconductor device having self-aligned contacts
02/06/2003US20030025122 Semiconductor integrated circuit
02/06/2003US20030025089 Methods and compositions for ionizing radiation shielding
02/06/2003US20030024913 Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like
02/06/2003US20030024781 Tunable vibration damper for processor packages
02/06/2003US20030024735 Protective device for subassemblies and method for producing a protective device
02/06/2003US20030024733 Lead-free solder, and connection lead and electrical component using said lead-free solder
02/06/2003US20030024731 Vertical electrical interconnections in a stack
02/06/2003US20030024723 Composition for layer on outer surface of first resin layer encapsulating semiconductor, containing epoxy resin, phenolic resin, curing accelerator and conductive or magnetic particles having surfaces coated with insulating inorganic material
02/06/2003US20030024698 Flexible coupling for heat sink
02/06/2003US20030024693 Counter flow two pass active heat sink with heat spreader
02/06/2003US20030024691 High efficiency heat sink
02/06/2003US20030024689 Cooling device for heat-generating elements
02/06/2003US20030024688 Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled
02/06/2003US20030024687 Radiation fin set for heat sink
02/06/2003US20030024633 Radio frequency circuit manufacturing method and radio frequency circuit
02/06/2003US20030024611 Discontinuous carbon fiber reinforced metal matrix composite
02/06/2003US20030024120 Heat exchanger cast in metal matrix composite and method of making the same
02/06/2003US20030024081 Buckle of IC heat dissipating device
02/06/2003DE10125746C1 Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung Method for shielding a realized on a circuit board electrical circuit and an appropriate combination of a circuit board with a shield
02/06/2003CA2451420A1 Apparatus and method for controlling the temperature of an integrated circuit device
02/05/2003EP1282206A1 Method and apparatus for cooling electronic or optoelectronic devices
02/05/2003EP1282170A1 Short-circuit resistant power semiconductor device
02/05/2003EP1282169A2 IC chip mounting structure and display device
02/05/2003EP1282168A2 Semiconductor device and its fabrication method
02/05/2003EP1282167A2 Fastener retainer assembly
02/05/2003EP1282166A2 Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient similar to that of semiconductor and method for manufacturing the same
02/05/2003EP1282165A2 Semiconductor device and manufacturing method thereof
02/05/2003EP1282164A2 Method to improve the adhesion of dielectric layers to copper
02/05/2003EP1282163A1 Semiconductor device and manufacturing method thereof
02/05/2003EP1281303A1 Electronic power module
02/05/2003EP1281203A2 Semiconductor component
02/05/2003EP1281202A1 Contact connector for a semiconductor component
02/05/2003EP1281036A1 Channel connection for pipe to block joints
02/05/2003EP1119823B1 Biometric sensor and corresponding production method
02/05/2003CN2534775Y Heat conduction radiating structure for electronic element of circuit board
02/05/2003CN2534774Y Fixer for radiating fin
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