| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/01/2014 | CN203377210U CPU radiating fin |
| 01/01/2014 | CN203377209U Novel radiator structure |
| 01/01/2014 | CN203377208U Radiator |
| 01/01/2014 | CN203377205U Production device of flexible display member |
| 01/01/2014 | CN203377200U Chip package testing structure |
| 01/01/2014 | CN103493613A Circuit assemblies including thermoelectric modules |
| 01/01/2014 | CN103493200A Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device |
| 01/01/2014 | CN103493198A Electronic device and manufacturing method thereof |
| 01/01/2014 | CN103493197A Semiconductor device and manufacturing method thereof |
| 01/01/2014 | CN103493196A Heat sink with laminated fins and method for production of such a heat sink |
| 01/01/2014 | CN103493191A Method for producing electronic component module and electronic component module |
| 01/01/2014 | CN103492482A Curable resin composition for reflection of light, and optical semiconductor device |
| 01/01/2014 | CN103489917A Longitudinal double-diffusion metal oxide semiconductor structure with high avalanche tolerance capacity |
| 01/01/2014 | CN103489892A Array substrate, preparing method of array substrate and display device of array substrate |
| 01/01/2014 | CN103489885A Wafer-level packaging method of image sensor chips |
| 01/01/2014 | CN103489876A Array substrate, preparing method of array substrate and display device of array substrate |
| 01/01/2014 | CN103489869A Semiconductor memory device, memory system including the same and method of manufacturing the same |
| 01/01/2014 | CN103489867A Sram Sram |
| 01/01/2014 | CN103489858A Wafer packaging method |
| 01/01/2014 | CN103489856A Thyristor compression joint assembly for flexible direct-current transmission |
| 01/01/2014 | CN103489855A 晶圆封装结构 Wafer package |
| 01/01/2014 | CN103489852A Structure and method for packaging radio-frequency inductor |
| 01/01/2014 | CN103489851A Semiconductor sealing ring used for isolating noise |
| 01/01/2014 | CN103489850A CTE adaption in a semiconductor package |
| 01/01/2014 | CN103489849A Bonding structure |
| 01/01/2014 | CN103489848A Multi-pin-position semiconductor integrated circuit lead frame |
| 01/01/2014 | CN103489847A PGA/BGA (Pin Grid Array/Ball Grid Array) three-dimensional structure for assembling components and production method thereof |
| 01/01/2014 | CN103489846A Chip package and method for forming the same |
| 01/01/2014 | CN103489845A Electric device package and method of making an electric device package |
| 01/01/2014 | CN103489844A Methods and apparatus of packaging semiconductor devices |
| 01/01/2014 | CN103489843A Metal-oxide semiconductor chip electrode bonding pad and manufacturing method thereof |
| 01/01/2014 | CN103489842A Semiconductor packaging structure |
| 01/01/2014 | CN103489841A PCB with capacitor, inductor and resistor buried in simultaneously and manufacturing method thereof |
| 01/01/2014 | CN103489840A Through-silicon via and fabrication method thereof |
| 01/01/2014 | CN103489839A Hard mask spacer structure and fabrication method thereof |
| 01/01/2014 | CN103489838A Enhanced radiation three-dimensional packaging structure and packaging method for same |
| 01/01/2014 | CN103489837A 晶闸管 Thyristor |
| 01/01/2014 | CN103489836A Radiator based on high-density graphene and manufacturing method thereof |
| 01/01/2014 | CN103489835A Security chip and packing method |
| 01/01/2014 | CN103489834A Semiconductor package and semiconductor device including the same |
| 01/01/2014 | CN103489833A Chip-packaging module for a chip and a method for forming a chip-packaging module |
| 01/01/2014 | CN103489832A Package substrate plate structure for package, package substrate, semiconductor package and fabrication method thereof |
| 01/01/2014 | CN103489831A Semiconductor device with multi-layered storage node and method for fabricating the same |
| 01/01/2014 | CN103489807A Method of test probe alignment control |
| 01/01/2014 | CN103489804A Method for forming semiconductor packaging structure |
| 01/01/2014 | CN103489803A Method for forming semiconductor packaging structure |
| 01/01/2014 | CN103489802A Chip packaging structure and formation method thereof |
| 01/01/2014 | CN103489798A Method of marking semiconductor element, method of manufacturing semiconductor device, and semiconductor device |
| 01/01/2014 | CN103489797A Integrated circuit packaging system with film assist and method of manufacture thereof |
| 01/01/2014 | CN103489795A Frame-based AAQFN package with frame pre-plastic-package optimization technique adopted and manufacturing technique thereof |
| 01/01/2014 | CN103489792A Encapsulation-etching three-dimensional system-level chip inversion encapsulation structure and process method |
| 01/01/2014 | CN103489791A Package carrier and manufacturing method thereof |
| 01/01/2014 | CN103489506A Short circuit chip for surface gold-coated microwave circuit and manufacturing method thereof |
| 01/01/2014 | CN103488063A Align marker and manufacturing method thereof |
| 01/01/2014 | CN103488019A Array substrate, driving method thereof and display device |
| 01/01/2014 | CN103488007A Array substrate, manufacturing method of array substrate and displaying device |
| 01/01/2014 | CN102675881B High temperature resistant rubber base composite material used for chip packaging and application thereof |
| 01/01/2014 | CN102492263B Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof |
| 01/01/2014 | CN102456630B Method for preparing multi-component brazing filler metal coatings of microelectronic device salient points |
| 01/01/2014 | CN102437088B Semiconductor structure and manufacture method thereof |
| 01/01/2014 | CN102347203B Vacuum electronic impact fluorescent energy-saving lamp |
| 01/01/2014 | CN102272925B Method for producing lamps |
| 01/01/2014 | CN102222648B Chip area optimized pads |
| 01/01/2014 | CN102194736B Making method of semiconductor device |
| 01/01/2014 | CN102024748B Method for reducing critical dimension of contact hole |
| 01/01/2014 | CN101887905B Image display system and manufacturing method thereof |
| 01/01/2014 | CN101609827B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/01/2014 | CN101236976B Active part array base plate, photoelectric device and its making method |
| 12/31/2013 | US8619003 Semiconductor device with wireless communication |
| 12/31/2013 | US8618679 Pattern structures in semiconductor devices |
| 12/31/2013 | US8618678 Chip structure and chip package structure |
| 12/31/2013 | US8618677 Wirebonded semiconductor package |
| 12/31/2013 | US8618676 Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained |
| 12/31/2013 | US8618675 Thin semiconductor die package |
| 12/31/2013 | US8618674 Semiconductor device including a sintered insulation material |
| 12/31/2013 | US8618673 Package structures |
| 12/31/2013 | US8618671 Semiconductor packages having passive elements mounted thereonto |
| 12/31/2013 | US8618670 Corrosion control of stacked integrated circuits |
| 12/31/2013 | US8618669 Combination substrate |
| 12/31/2013 | US8618668 Semiconductor contact barrier |
| 12/31/2013 | US8618667 Semiconductor device and method of manufacturing the same |
| 12/31/2013 | US8618665 Pattern layout in semiconductor device |
| 12/31/2013 | US8618664 Semiconductor package and method for packaging the same |
| 12/31/2013 | US8618663 Patternable dielectric film structure with improved lithography and method of fabricating same |
| 12/31/2013 | US8618661 Die having coefficient of thermal expansion graded layer |
| 12/31/2013 | US8618660 Integrated circuit device |
| 12/31/2013 | US8618659 Package-on-package assembly with wire bonds to encapsulation surface |
| 12/31/2013 | US8618657 Semiconductor device with multilayer wiring structure formed within and method of manufacturing the same |
| 12/31/2013 | US8618656 Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same |
| 12/31/2013 | US8618655 Carrier-free semiconductor package |
| 12/31/2013 | US8618654 Structures embedded within core material and methods of manufacturing thereof |
| 12/31/2013 | US8618653 Integrated circuit package system with wafer scale heat slug |
| 12/31/2013 | US8618652 Forming functionalized carrier structures with coreless packages |
| 12/31/2013 | US8618651 Buried TSVs used for decaps |
| 12/31/2013 | US8618649 Compliant printed circuit semiconductor package |
| 12/31/2013 | US8618648 Methods for flip chip stacking |
| 12/31/2013 | US8618647 Packaged microelectronic elements having blind vias for heat dissipation |
| 12/31/2013 | US8618646 Layered chip package and method of manufacturing same |
| 12/31/2013 | US8618645 Package process and package structure |
| 12/31/2013 | US8618644 Electronic device and manufacturing thereof |